公开(公告)号：USD634719S1

公开(公告)日：2011-03-22

申请号：US29356450

申请日：2010-02-25

申请人： Hozumi Yasuda ,  Keisuke Namiki ,  Makoto Fukushima ,  Osamu Nabeya ,  Koji Saito ,  Satoru Yamaki ,  Tomoshi Inoue ,  Shingo Togashi ,  Tetsuji Togawa

设计人： Hozumi Yasuda ,  Keisuke Namiki ,  Makoto Fukushima ,  Osamu Nabeya ,  Koji Saito ,  Satoru Yamaki ,  Tomoshi Inoue ,  Shingo Togashi ,  Tetsuji Togawa

公开(公告)号：US08357029B2

公开(公告)日：2013-01-22

申请号：US12747225

申请日：2009-02-09

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

IPC分类号： B24B5/00

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

公开(公告)号：US08100743B2

公开(公告)日：2012-01-24

申请号：US12285941

申请日：2008-10-16

申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

IPC分类号： B24B5/00

CPC分类号： B24B37/32

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有研磨面的研磨台，配置为将基板保持并压靠在研磨面上的顶环体，设置在顶环体的外周部并构造成按压抛光面的保持环， 以及保持环导向件，其固定到所述顶环主体并且被构造成与所述保持环的环形构件滑动接触以引导所述环构件的运动。 彼此滑动接触的环构件和保持器环导向件的滑动接触表面中的任一个包括低摩擦材料。

公开(公告)号：US20100273405A1

公开(公告)日：2010-10-28

申请号：US12747225

申请日：2009-02-09

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

IPC分类号： B24B7/20 ,  B24B41/06 ,  B24B55/02

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

公开(公告)号：US20090111362A1

公开(公告)日：2009-04-30

申请号：US12285941

申请日：2008-10-16

申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

IPC分类号： B24B7/00

CPC分类号： B24B37/32

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有研磨面的研磨台，配置为将基板保持并压靠在研磨面上的顶环体，设置在顶环体的外周部并构造成按压抛光面的保持环， 以及保持环导向件，其固定到所述顶环主体并且被构造成与所述保持环的环形构件滑动接触以引导所述环构件的运动。 彼此滑动接触的环构件和保持器环导向件的滑动接触表面中的任一个包括低摩擦材料。

公开(公告)号：US08485866B2

公开(公告)日：2013-07-16

申请号：US13587371

申请日：2012-08-16

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B29/00 ,  B24B47/02

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US08267746B2

公开(公告)日：2012-09-18

申请号：US12222909

申请日：2008-08-19

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B47/02

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US20120071065A1

公开(公告)日：2012-03-22

申请号：US13304931

申请日：2011-11-28

申请人： Osamu NABEYA ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

发明人： Osamu NABEYA ,  Tetsuji Togawa ,  Makoto Fukushima ,  Hozumi Yasuda

IPC分类号： B24B7/10

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/10 ,  B24B37/105 ,  B24B37/30 ,  B24B37/32 ,  B24B47/22 ,  B24B49/00 ,  B24B49/16

摘要： A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

摘要翻译： 抛光装置具有抛光垫，用于保持半导体晶片的顶环，以及可操作以在垂直方向上移动顶环的垂直移动机构。 抛光装置还具有距离测量传感器，该距离测量传感器可操作以当顶环的下表面与抛光垫接触时检测顶环的位置，以及控制器，其可操作以计算顶环的最佳位置进行抛光 基于由距离测量传感器检测到的位置的半导体晶片。 垂直移动机构包括可操作以将顶环移动到最佳位置的滚珠丝杠机构。

公开(公告)号：US07967665B2

公开(公告)日：2011-06-28

申请号：US11730142

申请日：2007-03-29

申请人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi Yasuda ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B29/00

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US07850509B2

公开(公告)日：2010-12-14

申请号：US12285936

申请日：2008-10-16

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

IPC分类号： B24B7/22

CPC分类号： B24B37/30 ,  B24B41/061

摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。