-
公开(公告)号：US09237686B2
公开(公告)日：2016-01-12
申请号：US14119148
申请日：2013-02-26
发明人： Koji Motomura , Arata Kishi , Hiroki Maruo , Yasuhiro Suzuki , Hironori Munakata
CPC分类号： H05K13/0465 , H01L21/4867 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/98 , H01L2224/0401 , H01L2224/05548 , H01L2224/0556 , H01L2224/06181 , H01L2224/06187 , H01L2224/16235 , H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81192 , H01L2224/8159 , H01L2224/816 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2224/83886 , H01L2924/01322 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K2201/099 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/0665 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.
摘要翻译： 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。
-
公开(公告)号：US20140158751A1
公开(公告)日：2014-06-12
申请号：US14119148
申请日：2013-02-26
发明人： Koji Motomura , Arata Kishi , Hiroki Maruo , Yasuhiro Suzuki , Hironori Munakata
IPC分类号： H05K13/04
CPC分类号： H05K13/0465 , H01L21/4867 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/98 , H01L2224/0401 , H01L2224/05548 , H01L2224/0556 , H01L2224/06181 , H01L2224/06187 , H01L2224/16235 , H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81192 , H01L2224/8159 , H01L2224/816 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2224/83886 , H01L2924/01322 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K2201/099 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/0665 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.
摘要翻译： 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。
-
搜索结果
2 条记录 (耗时 0.011 秒)
