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公开(公告)号：US09237686B2
公开(公告)日：2016-01-12
申请号：US14119148
申请日：2013-02-26
发明人： Koji Motomura , Arata Kishi , Hiroki Maruo , Yasuhiro Suzuki , Hironori Munakata
CPC分类号： H05K13/0465 , H01L21/4867 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/98 , H01L2224/0401 , H01L2224/05548 , H01L2224/0556 , H01L2224/06181 , H01L2224/06187 , H01L2224/16235 , H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81192 , H01L2224/8159 , H01L2224/816 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2224/83886 , H01L2924/01322 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K2201/099 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/0665 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.
摘要翻译： 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。
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公开(公告)号：US20140158751A1
公开(公告)日：2014-06-12
申请号：US14119148
申请日：2013-02-26
发明人： Koji Motomura , Arata Kishi , Hiroki Maruo , Yasuhiro Suzuki , Hironori Munakata
IPC分类号： H05K13/04
CPC分类号： H05K13/0465 , H01L21/4867 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/98 , H01L2224/0401 , H01L2224/05548 , H01L2224/0556 , H01L2224/06181 , H01L2224/06187 , H01L2224/16235 , H01L2224/2929 , H01L2224/293 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81192 , H01L2224/8159 , H01L2224/816 , H01L2224/81815 , H01L2224/81862 , H01L2224/81885 , H01L2224/83886 , H01L2924/01322 , H05K3/3442 , H05K3/3452 , H05K3/3463 , H05K2201/099 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/0665 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.
摘要翻译： 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。
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公开(公告)号：US20120111617A1
公开(公告)日：2012-05-10
申请号：US13382368
申请日：2010-05-26
申请人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
发明人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
IPC分类号： H05K1/09
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： It is an object of the present invention to provide an electronic element unit and a reinforcing adhesive agent in which a bonding strength can be improved between an electronic element and a circuit board and a repairing work can be carried out without giving a thermal damage to the electronic element or the circuit board. In an electronic element unit (1) including an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).
摘要翻译： 本发明的目的是提供一种电子元件单元和增强粘合剂，其中可以在电子元件和电路板之间提高接合强度，并且可以进行修复作业而不会对其造成热损伤 电子元件或电路板。 在包括在其下表面上具有多个连接端子（12）的电子元件（2）的电子元件单元（1）中，具有与连接端子对应的多个电极（22）的电路板（3） 12）。 连接端子（12）和电极（22）通过焊锡凸块（23）连接，电子元件（2）和电路板（3）通过由热固性树脂制成的树脂粘合部分（24） 热固性树脂的材料和金属粉末（25）以分散状态包含在树脂粘合部分（24）中。 当进行从电路板（3）移除电子元件（2）的工件（修理作业）时，金属粉末（25）的熔点低于加热树脂接合部分（24）的温度 ）。
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公开(公告)号：US20080169574A1
公开(公告)日：2008-07-17
申请号：US11622760
申请日：2007-01-12
CPC分类号： H01L25/0657 , H01L21/563 , H01L24/16 , H01L24/81 , H01L2224/10135 , H01L2224/16225 , H01L2224/16227 , H01L2224/17135 , H01L2224/73204 , H01L2224/81139 , H01L2224/8114 , H01L2224/81192 , H01L2224/81194 , H01L2224/8159 , H01L2224/81639 , H01L2224/81855 , H01L2225/06513 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/14 , H01L2924/3025 , H01L2224/0401
摘要： A method is presented for bare die attachment using conductive ink dots. Dielectric ink dots may be applied, for example as spacer bumps or for attaching. The conductive ink dots are not cured until die and substrate are placed on top of each other, and then cured to form a conductive connection between die and substrate.
摘要翻译： 提出了一种使用导电油墨点进行裸片贴装的方法。 可以施加介电墨点，例如作为间隔凸块或用于附接。 直到芯片和基板被放置在彼此顶部之前，导电墨点不固化，然后固化以在管芯和衬底之间形成导电连接。
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公开(公告)号：US6088236A
公开(公告)日：2000-07-11
申请号：US878369
申请日：1997-06-18
申请人： Yoshihiro Tomura , Yoshihiro Bessho
发明人： Yoshihiro Tomura , Yoshihiro Bessho
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/1184 , H01L2224/13019 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13562 , H01L2224/1357 , H01L2224/1379 , H01L2224/13839 , H01L2224/13844 , H01L2224/13847 , H01L2224/2929 , H01L2224/293 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/8159 , H01L2224/816 , H01L2224/81903 , H01L2224/83851 , H01L24/45 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14
摘要： A semiconductor unit including a circuit board having terminal electrodes on a surface thereof and a semiconductor device having an electrode pad on a first surface, where the semiconductor device is mounted face down on the surface of the circuit board. The semiconductor device has a plurality of bumps formed on the electrode pad, for electrically connecting the electrode pad to the terminal electrodes of the circuit board. Each bump includes a first bump portion and a smaller second bump portion formed on the first bump portion, and each second bump portion has a plurality of irregularities having concave portions extending in various directions. The bonding layer is formed between the second bump portion and the terminal electrode, and includes conductive particles which along with a portion of the bonding layer enter the concave portions of the plurality of irregularities of the bumps. The terminal electrodes may also have a plurality of irregularities having concave portions extending in various directions.
摘要翻译： 一种半导体单元，包括其表面上具有端子电极的电路板和在第一表面上具有电极焊盘的半导体器件，半导体器件被安装在电路板的表面上。 半导体器件具有形成在电极焊盘上的多个凸起，用于将电极焊盘电连接到电路板的端子电极。 每个凸块包括形成在第一凸起部分上的第一凸起部分和较小的第二凸起部分，并且每个第二凸起部分具有多个具有在各个方向上延伸的凹部的凹凸。 接合层形成在第二凸起部和端子电极之间，并且包括与接合层的一部分一起进入凸块的多个凹凸的凹部的导电性粒子。 端子电极也可以具有多个具有在各个方向上延伸的凹部的凹凸。
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公开(公告)号：US09795036B2
公开(公告)日：2017-10-17
申请号：US14396297
申请日：2013-04-05
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
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公开(公告)号：US20150116970A1
公开(公告)日：2015-04-30
申请号：US14396297
申请日：2013-04-05
发明人： Arata Kishi , Hironori Munakata , Koji Motomura , Hiroki Maruo
CPC分类号： H05K1/181 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/10156 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/32052 , H01L2224/32057 , H01L2224/32225 , H01L2224/73203 , H01L2224/81052 , H01L2224/81191 , H01L2224/8159 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81639 , H01L2224/81647 , H01L2224/81815 , H01L2224/81935 , H01L2224/81951 , H01L2224/81986 , H01L2224/83104 , H01L2224/83192 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/384 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10977 , H05K2201/10992 , H05K2201/2009 , H05K2201/2036 , H05K2201/2045 , Y02P70/613 , H01L2924/00012 , H01L2924/00
摘要： A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
摘要翻译： 安装结构包括将电路板（105）的第二电极（104）和半导体封装（101）的凸块（103）接合的接合材料（106），所述接合材料（106）被第一增强树脂 （107）。 此外，半导体封装（101）的外周与电路基板（105）之间的部分被第二增强树脂（108）覆盖。 即使接合材料（106）是具有比常规接合材料低的熔点的焊料，也可获得高的耐滴落性。
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8.发明授权Method for making electronic device with liquid crystal polymer and related devices 有权制造具有液晶聚合物和相关器件的电子器件的方法公开(公告)号：US08877558B2
公开(公告)日：2014-11-04
申请号：US13761833
申请日：2013-02-07
申请人： Harris Corporation
IPC分类号： H01L21/00 , H01L21/762 , H01L23/498
CPC分类号： H01L23/498 , H01L24/29 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/29011 , H01L2224/29017 , H01L2224/2919 , H01L2224/48091 , H01L2224/48228 , H01L2224/73104 , H01L2224/73204 , H01L2224/73265 , H01L2224/81192 , H01L2224/814 , H01L2224/81444 , H01L2224/8159 , H01L2224/816 , H01L2224/81815 , H01L2224/83192 , H01L2224/83856 , H01L2224/83862 , H01L2924/00014 , H01L2924/12042 , H01L2924/014 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof.
摘要翻译： 制造电子器件的方法包括在衬底上形成导电图案，在衬底上形成覆盖层和导电图案，在覆盖层上形成部分固化的粘性层，并在覆盖层中形成开口 以及与导电图案对准的部分固化的粘性层。 该方法包括将IC定位在部分固化的粘性粘合剂层上，然后固化部分固化的粘性粘合剂层，从而同时机械地固定并将IC电连接到基底上，该IC在其表面上具有接合焊盘。
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9.发明授权公开(公告)号：US08345435B2
公开(公告)日：2013-01-01
申请号：US12851274
申请日：2010-08-05
申请人： Toshiji Hamatani , Hiroki Adachi
发明人： Toshiji Hamatani , Hiroki Adachi
CPC分类号： H01L21/84 , H01L21/6835 , H01L23/3114 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/83 , H01L24/94 , H01L27/1203 , H01L2221/6835 , H01L2224/0401 , H01L2224/1182 , H01L2224/1191 , H01L2224/13022 , H01L2224/13139 , H01L2224/1329 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13364 , H01L2224/13369 , H01L2224/13379 , H01L2224/136 , H01L2224/16225 , H01L2224/16227 , H01L2224/8159 , H01L2224/816 , H01L2224/94 , H01L2924/0001 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H05K3/0017 , H05K3/245 , H05K3/281 , H05K3/4007 , H05K2201/029 , H05K2201/035 , H05K2201/0367 , Y10T29/49002 , Y10T29/49208 , H01L2224/03 , H01L2224/11 , H01L2924/00014 , H01L2224/13099 , H01L2924/0665 , H01L2224/83851 , H01L2924/00
摘要： A conductor having a projecting portion is formed which forms a terminal portion. An uncured prepreg including a reinforcing material is closely attached to the conductor and the prepreg is cured to form an insulating film including the reinforcing material. When the prepreg is closely attached, the prepreg is stretched by the projecting portion, so that a region of the prepreg, which is closely attached to the conductor, can be thinner than the other region of the prepreg. Then, by reducing the thickness of the entire insulating film, an opening can be formed in the portion having a smaller thickness. The step of reducing the thickness can be performed by etching. Further, it is preferable not to remove the reinforcing material in this step. The strength of a terminal and an electronic device can be increased by leaving the reinforcing material at the opening.
摘要翻译： 形成具有突出部分的导体，其形成端子部分。 包含增强材料的未固化的预浸料坯紧密地连接到导体上，并且预浸料被固化以形成包括增强材料的绝缘膜。 当预浸料坯紧密贴合时，预浸料被突出部分拉伸，使得与预浸料坯的其它区域相比，紧贴在导体上的预浸料坯的区域更薄。 然后，通过减小整个绝缘膜的厚度，可以在具有较小厚度的部分中形成开口。 可以通过蚀刻来进行厚度减小的步骤。 此外，优选在该步骤中不去除增强材料。 终端和电子设备的强度可以通过将加强材料留在开口处来增加。
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公开(公告)号：US08027553B2
公开(公告)日：2011-09-27
申请号：US11834065
申请日：2007-08-06
申请人： Toshiaki Takai , Naoki Matsushima , Koki Hirano , Hiroki Yasuda
发明人： Toshiaki Takai , Naoki Matsushima , Koki Hirano , Hiroki Yasuda
CPC分类号： G02B6/4238 , G02B6/4214 , G02B6/423 , H01L24/81 , H01L24/83 , H01L25/16 , H01L31/02005 , H01L31/0203 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/1134 , H01L2224/13022 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/81136 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/81385 , H01L2224/8159 , H01L2224/816 , H01L2224/81801 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12043 , H01L2924/181 , H01L2924/30105 , H01L2924/00 , H01L2224/29075 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An optical element amounted structure includes an optical element having an electrode such as a bump formed on a surface thereof, and a substrate having an electrode that is joined to the optical element formed on the surface. The structure of the electrode of the substrate has a substantially ring configuration or a substantially ring configuration a part of which is notched, and the optical element and the substrate are joined to each other in a configuration where a joining material such as a bump is inserted into an opening portion.
摘要翻译： 光学元件的结构包括具有在其表面上形成的凸块等的电极的光学元件和具有与表面上形成的光学元件接合的电极的基板。 基板的电极的结构具有大致环形或大致环状的构造，其一部分被切口，并且光学元件和基板以插入诸如凹凸的接合材料的结构彼此接合 进入开口部分。
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