DISTANCE MEASURING DEVICE AND DISTANCE MEASURING SYSTEM

    公开(公告)号:US20240004041A1

    公开(公告)日:2024-01-04

    申请号:US18466429

    申请日:2023-09-13

    CPC classification number: G01S7/484 G01S17/894 G01S7/4865

    Abstract: A distance measuring device includes: a light source configured to project pulsed light; a light receiver configured to receive reflected light; a distance measurement controller configured to select, for distance measurement, one of distance measurement sections set in accordance with distances, and control operation times of the light source and the light receiver in accordance with the selected one of the distance measurement sections; and a distance image generator configured to generate a section image from a signal output from the light receiver, and combine section images corresponding to the distance measurement sections to generate a distance image. The distance measurement controller includes a random number generator configured to generate random number data for selecting one of the distance measurement sections randomly.

    IMAGING DEVICE
    2.
    发明公开
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20230170358A1

    公开(公告)日:2023-06-01

    申请号:US18101834

    申请日:2023-01-26

    Abstract: An imaging device including: a semiconductor substrate having a first surface and a second surface opposite to the first surface; a microlens located closer to the first surface than to the second surface; and a first photoelectric converter located between the first surface and the microlens. The first photoelectric converter includes a first electrode, a second electrode, and a photoelectric conversion layer that is located between the first electrode and the second electrode and that converts light into electric charges. The first photoelectric converter is the closest of any photoelectric converter existing between the first surface and the microlens to the first surface. The imaging device includes no photodiode as a photoelectric converter, and a focal point of the microlens is located below a lowermost surface of the photoelectric conversion layer.

    VOLTAGE CONTROL SYSTEM
    3.
    发明公开

    公开(公告)号:US20230408331A1

    公开(公告)日:2023-12-21

    申请号:US18461314

    申请日:2023-09-05

    Abstract: A voltage control system has a light receiving array part receiving incident light and a light shielding array part shielding light receiving elements from incident light by a light shielding mechanism. The voltage control system also includes: a voltage application unit applying a bias voltage to an anode terminal; a multiplication state determination unit determining the multiplication state of the light shielding array part based on output signals from cathodes of the light receiving elements in the light shielding array part; and a voltage setting unit performing voltage setting for the bias voltage to be output from the voltage application unit based on the determination results from the multiplication state determination unit.

    IMAGING DEVICE
    4.
    发明申请

    公开(公告)号:US20220109800A1

    公开(公告)日:2022-04-07

    申请号:US17551720

    申请日:2021-12-15

    Abstract: An imaging device including a semiconductor substrate that includes a first impurity region; a photoelectric converter that is coupled to the first impurity region and that converts light into charges; a capacitor that includes a first terminal and a second terminal, the first terminal coupled to the first impurity region; voltage supply circuitry coupled to the second terminal; a first transistor including the first impurity region as a source or a drain; and control circuitry. The control circuitry is programmed to cause the voltage supply circuitry to supply a first voltage in a first period, and to cause the voltage supply circuitry to supply a second voltage different from the first voltage in a second period continuous to the first period, the first transistor being in on-state in the first period, the first transistor being in off-state in the second period.

    IMAGING DEVICE
    5.
    发明申请

    公开(公告)号:US20220191424A1

    公开(公告)日:2022-06-16

    申请号:US17683465

    申请日:2022-03-01

    Abstract: An imaging device includes: a solid-state imaging element having a plurality of pixel cells arranged in a matrix; and a signal processing part configured to process a detection signal outputted from each of the pixel cells. The pixel cells each include an avalanche photodiode and output a voltage corresponding to a count number of photons received by the avalanche photodiode as the detection signal. The signal processing part includes a variation calculation part configured to calculate a variation between the pixel cells in the detection signal outputted from each of the pixel cells, and a correction calculation part configured to correct the detection signal outputted from each of the pixel cells, on the basis of the variation calculated by the variation calculation part.

    IMAGING DEVICE
    6.
    发明申请

    公开(公告)号:US20220182572A1

    公开(公告)日:2022-06-09

    申请号:US17679942

    申请日:2022-02-24

    Abstract: An imaging device includes: a solid-state imaging element having a plurality of pixel cells arranged in a matrix; and a control part configured to control the solid-state imaging element. The pixel cells each include an avalanche photodiode, a floating diffusion part configured to accumulate electric charges, a transfer transistor connecting a cathode of the avalanche photodiode and the floating diffusion part, and a reset transistor for resetting electric charges accumulated in the floating diffusion part. The control part controls the reset transistor to discharge electric charges exceeding a predetermined electric charge amount, of electric charges accumulated in the floating diffusion part from the cathode of the avalanche photodiode via the transfer transistor.

    IMAGING DEVICE
    8.
    发明申请

    公开(公告)号:US20210043666A1

    公开(公告)日:2021-02-11

    申请号:US17077013

    申请日:2020-10-22

    Abstract: An imaging device including: a semiconductor substrate having a first and second surface opposite to the first surface; a microlens located closer to the first surface than the second surface; a first photoelectric converter located between the first surface and the microlens, where the first photoelectric converter includes a first electrode, a second electrode, and a photoelectric conversion layer that is located between the first electrode and the second electrode and that converts light into electric charges; and a signal detecting section located in the semiconductor substrate, the signal detecting section being configured to output a signal corresponding to the electric charges. The first photoelectric converter is the closest of any photoelectric converter existing between the first surface and the microlens to the first surface, and a focal point of the microlens is located below a lowermost surface of the photoelectric conversion layer and above the signal detecting section.

    IMAGING DEVICE
    9.
    发明申请
    IMAGING DEVICE 审中-公开

    公开(公告)号:US20200321385A1

    公开(公告)日:2020-10-08

    申请号:US16909070

    申请日:2020-06-23

    Abstract: An imaging device including a semiconductor substrate having a first surface, the semiconductor substrate including: a first layer containing an impurity of a first conductivity type; a second layer containing an impurity of a second conductivity type different from the first conductivity type, the second layer being closer to the first surface than the first layer is; and a pixel. The pixel includes a photoelectric converter configured to convert light into charge; and a first diffusion region containing an impurity of the first conductivity type, the first diffusion region facing the first layer via the second layer, configured to store at least a part of the charge. The first layer having a second surface adjacent to the second layer, the second surface including a convex portion toward the first surface, and the convex portion facing the first diffusion region.

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