Abstract:
An insulated gate field effect transistor having in the channel region extending from the source to the drain, at least to the depth of the source, a laterally decreasing concentration of substrate-type impurities, with the result that the resistivity of the channel region decreases as the source is approached. An advantage is that the source and drain may be closely spaced while avoiding punchthrough at the usual drain source voltage.
Abstract:
A method for making an IGFET is described. The method utilizes impurity ion implantation into the surface channel to determine the conductivity thereof. The advantages include special impurity profiles providing improved performance, better control over important parameters such as threshold voltage, the manufacture of improved tetrodes, and the manufacture of improved ICs using for example N- and P-channel devices, and depletion and enhancement devices combined in a single chip.
Abstract:
This invention relates to insulated field effect transistors, particularly to insulated gate field effect transistors, suitable for high frequency, high power operation, in which the source and drain regions each comprise a base part and a plurality of finger parts extending therefrom, the source finger parts being interdigitated with the drain finger parts and the current carrying channel region being situated at surface region parts between adjacent source finger parts and drain finger parts, the gate electrode comprising a metal layer pattern having a plurality of limb portions situated above said surface region parts and extending substantially parallel to the longitudinal direction of the source and drain finger parts.