Abstract:
A temperature compensated semiconductor resistor is described wherein electrically inactive neutral impurities are included in the semiconductor. The neutral impurities do not contribute free carriers to offset mobility reduction due to lattice scattering, but instead provide an impurity scattering dependence that temperature compensates.
Abstract:
A semiconductor device comprising a charge transfer device having a plurality of storage sites and a plurality of field effect transistors for reading the charge condition at a plurality of said sites. This is accomplished by locating the channels of the field effect transistors below the storage sites to be read and controlling or affecting the size of the channels by the amount of charge stored at the associated sites. Measuring the current through the channel thus indicates the charge level.
Abstract:
In order to provide a semiconductor surface layer of desired properties at a substantially constant depth from all parts of the surface, the body is subjected to bombardment with a beam of energetic particles so as to cause internal crystal damage in the layer over a controlled distance while the semiconductor is maintained at an elevated temperature causing enhanced diffusion of substrate impurities into the layer along the boundary of the damaged zone.
Abstract:
An image intensifier or converter is described comprising an array of JFETs having separate gates which when pulsed block the channel of the associated JFET. Each JFET is connected in series with a display element, such as an electroluminescent diode. Incident imaging photons absorbed in the channel regions unblock the associated FET causing radiation emission from the associated display element.
Abstract:
A solid state radiation sensitive device is described employing JFETs as the sensitive elements. Two terminal construction is achieved by using a common conductor to capacitively couple to the JFET gate and to one of the source and drain connections.
Abstract:
A method for making an IGFET is described. The method utilizes impurity ion implantation into the surface channel to determine the conductivity thereof. The advantages include special impurity profiles providing improved performance, better control over important parameters such as threshold voltage, the manufacture of improved tetrodes, and the manufacture of improved ICs using for example N- and P-channel devices, and depletion and enhancement devices combined in a single chip.