Abstract:
A method of aligning a semiconductor body with respect to an electron beam pattern, comprising for each direction with respect to which alignment is desired, the steps of: forming on the semiconductor body a reference marker having two outer regions of one conductivity type semiconductor material separated by an intermediate region of opposite conductivity type semiconductor material; forming an alignment electron beam positionally fixed relative to the electron beam pattern and suitably crosssectioned such that when the electron beam pattern is aligned with respect to the semiconductor body, said alignment electron beam strikes said intermediate region midway between said two outer regions causing thereby equal currents diffusing thereto from each of said two outer regions; comparing the currents diffusing into said intermediate region from each of said two outer regions; and adjusting the relative position of the electron beam pattern with respect to the semiconductor body until said compared currents are equal.
Abstract:
A METHOD FOR MAKING A HIGH-FREQUENCY BIPOLAR TRANSISTOR IS DESCRIBED. THE METHOD EMPLOYS SELECTIVE ION IMPLANTATION TO FORM HIGHLY CONDUCTING MUTUALLY SPACED STRIPE PORTIONS IN THE BASE REGION OF THE TRANSISTOR. THE STRIPE PORTIONS MAY BE FORMED DIRECTLY BELOW AND SPACED FROM THE EMITTER REGION. A HEAVY METAL MASK DEFINED BY ELECTRON-RESIST METHODS MAY BE PROVIDED AT LEAST IN THE EMITTER WINDOW TO SELECTIVELY MASK AGAINST THE IMPLANTATION.
Abstract:
A method of improving the voltage linearity of a semiconductor resistor for use, for example, in integrated circuit manufacture, which linearity is deteriorated by the loss of carriers in the resistor at the vicinity of a junction separating the resistor region from the semiconductor body. The method consists of bombarding the semiconductor to implant therein in the vicinity of the junction neutral ions, such as neon, forming lattice damage. The concentration of implanted ions and lattice damage is so high as to reduce the effective mobility of charge carriers in the region resulting in the improved voltage linearity.
Abstract:
A method for making an IGFET is described. The method utilizes impurity ion implantation into the surface channel to determine the conductivity thereof. The advantages include special impurity profiles providing improved performance, better control over important parameters such as threshold voltage, the manufacture of improved tetrodes, and the manufacture of improved ICs using for example N- and P-channel devices, and depletion and enhancement devices combined in a single chip.