公开(公告)号：US11780177B2

公开(公告)日：2023-10-10

申请号：US17761023

申请日：2020-03-16

申请人： PIANA NONWOVENS, LLC

发明人： Andy Hollis ,  Michael Stephen Defranks ,  Eric McCann ,  Mehran Jafari ,  Helias Andriessen ,  Sang-hoon Lim ,  Andrea Piana ,  Alfio Borgatti

IPC分类号： B29C70/12 ,  B29C70/18 ,  B29C70/54 ,  B29C35/04 ,  B29C35/16 ,  B29C70/46 ,  B29L31/00

CPC分类号： B29C70/12 ,  B29C35/049 ,  B29C35/16 ,  B29C70/18 ,  B29C70/46 ,  B29C70/54 ,  B29L2031/751 ,  B29L2031/771

摘要： A three-dimensional component is produced in a simplified molding operation. Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. Boards can be formed by laminating two or more blanks together and/or by laminating the blanks with other materials, including non-expendable materials. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. In addition, the boards or blanks may be cut to create desired shapes of parts that can be placed in the mold.

公开(公告)号：US20200338876A1

公开(公告)日：2020-10-29

申请号：US16842829

申请日：2020-04-08

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Michael Stephen DeFranks ,  Eric McCann ,  Andy Hollis ,  Sang-hoon Lim ,  Helias Andriessen ,  Mehran Jafari

IPC分类号： B32B37/00 ,  B32B5/02 ,  B32B5/26 ,  B32B39/00 ,  B29C70/34 ,  B62D29/04

摘要： A mobile molding system, comprising a vehicle and one or more molds arranged on the vehicle configured for receiving one or more expandable nonwoven substrates, heating said one or more expandable nonwoven substrates so as to cause said one or more expandable nonwoven substrates to expand and fill the one or more molds with one or more expanded nonwoven containing articles of three dimensional shape, and releasing said one or more expanded nonwoven containing articles of three dimensional shape from the one or more molds is provided. Methods for manufacturing three dimensional objects using the mobile molding system are also provided.

公开(公告)号：US11993027B2

公开(公告)日：2024-05-28

申请号：US17814555

申请日：2022-07-25

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Andy Hollis ,  Mehran Jafari ,  Helias Andriessen ,  Sang-hoon Lim ,  Eric McCann

IPC分类号： B29C70/34 ,  B29C70/12 ,  B29C70/54 ,  B29K267/00 ,  B29L31/00

CPC分类号： B29C70/12 ,  B29C70/34 ,  B29C70/545 ,  B29K2267/00 ,  B29L2031/751

摘要： Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.

公开(公告)号：US11472132B2

公开(公告)日：2022-10-18

申请号：US16594279

申请日：2019-10-07

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Andy Hollis ,  Mehran Jafari ,  Helias Andriessen ,  Sang-hoon Lim ,  Eric McCann

IPC分类号： B29C70/34 ,  B29C70/12 ,  B29C70/54 ,  B29L31/00 ,  B29K267/00

摘要： Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.

公开(公告)号：US20220363018A1

公开(公告)日：2022-11-17

申请号：US17814555

申请日：2022-07-25

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Andy Hollis ,  Mehran Jafari ,  Helias Andriessen ,  Sang-hoon Lim ,  Eric McCann

IPC分类号： B29C70/12 ,  B29C70/34 ,  B29C70/54

摘要： Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.

公开(公告)号：US20220098770A1

公开(公告)日：2022-03-31

申请号：US17471233

申请日：2021-09-10

申请人： Piana Nonwovens, LLC.

发明人： Mehran Jafari ,  Sang-hoon Lim ,  Andy Hollis ,  Andrea Piana ,  Eric McCann ,  Helias Andriessen

IPC分类号： D04H1/4382 ,  D04H1/435 ,  B60N2/64 ,  B63B29/04 ,  B64D11/06

摘要： A cushion or pad device is provided. The device comprises at least one layer of nonwoven material defining a volume with length, width, and depth dimensions, wherein the vertically lapped nonwoven material comprises at least one bulk fiber, wherein the bulk fiber comprises a thermoplastic polyester; and at least one elastomeric binder fiber. Methods of preparing the cushion or pad device are also provided.

公开(公告)号：US20200298506A1

公开(公告)日：2020-09-24

申请号：US16594279

申请日：2019-10-07

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Andy Hollis ,  Mehran Jafari ,  Helias Andriessen ,  Sang-hoon Lim ,  Eric McCann

IPC分类号： B29C70/12 ,  B29C70/34 ,  B29C70/54

摘要： Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.

公开(公告)号：US11771971B2

公开(公告)日：2023-10-03

申请号：US16842829

申请日：2020-04-08

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Michael Stephen DeFranks ,  Eric McCann ,  Andy Hollis ,  Sang-hoon Lim ,  Helias Andriessen ,  Mehran Jafari

IPC分类号： A63B69/00 ,  B29C70/00 ,  B32B5/00 ,  B32B37/00 ,  B32B39/00 ,  B29C70/34 ,  B32B5/02 ,  B32B5/26 ,  B29L31/00

CPC分类号： A63B69/0048 ,  B29C70/342 ,  B32B5/022 ,  B32B5/26 ,  B32B37/0046 ,  B32B39/00 ,  B29L2031/771 ,  B32B2262/0276 ,  B32B2262/0284 ,  B32B2367/00 ,  B32B2605/003

摘要： A mobile molding system, comprising a vehicle and one or more molds arranged on the vehicle configured for receiving one or more expandable nonwoven substrates, heating said one or more expandable nonwoven substrates so as to cause said one or more expandable nonwoven substrates to expand and fill the one or more molds with one or more expanded nonwoven containing articles of three dimensional shape, and releasing said one or more expanded nonwoven containing articles of three dimensional shape from the one or more molds is provided. Methods for manufacturing three dimensional objects using the mobile molding system are also provided.

公开(公告)号：US20210360928A1

公开(公告)日：2021-11-25

申请号：US17326948

申请日：2021-05-21

申请人： Piana Nonwovens, LLC.

发明人： Andrea Piana ,  Michael Stephen DeFranks ,  Eric McCann ,  Andy Hollis ,  Sang-hoon Lim ,  Helias Andriessen ,  Mehran Jafari

IPC分类号： A01N59/16 ,  A01N25/34 ,  A01N25/10 ,  A01N47/44 ,  A01N59/20 ,  A01N33/12 ,  A01N31/16 ,  A01P1/00 ,  B01D39/16 ,  B01D46/00 ,  D06M16/00 ,  D06M11/13 ,  A62B18/02 ,  A47C31/10

摘要： Provided are antimicrobial nonwovens comprising antimicrobial chemical treated fibers and untreated binder fibers. 0.0003-0.1 wt. % of one or more silver containing antimicrobial chemicals are used in nonwovens to provide an excellent antimicrobial/antiviral property. Exemplary applications and methods of manufacturing antimicrobial products such as a facial covering, a mattress cover, a surface cover and an air filter are provided.