公开(公告)号：US09536914B2

公开(公告)日：2017-01-03

申请号：US14590270

申请日：2015-01-06

Applicant: PIXART IMAGING INC.

Inventor： Sen-Huang Huang ,  Huan-Kun Pan ,  Yi-Chang Chang ,  Ching-Wei Chen

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685

Abstract: There is provided a front side illuminated (FSI) semiconductor structure with improved light absorption efficiency which is configured to provide a reflecting layer on a bottom of the FSI semiconductor structure to enhance the light absorption efficiency, wherein the reflecting layer is manufactured in the packaging process or the semiconductor process.

Abstract translation: 提供了具有改善的光吸收效率的前侧照明（FSI）半导体结构，其被配置为在FSI半导体结构的底部上提供反射层以增强光吸收效率，其中反射层在包装过程中制造 或半导体工艺。

公开(公告)号：US11495697B2

公开(公告)日：2022-11-08

申请号：US17113349

申请日：2020-12-07

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US10439077B2

公开(公告)日：2019-10-08

申请号：US15979708

申请日：2018-05-15

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/09 ,  H01L31/024

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US12040416B2

公开(公告)日：2024-07-16

申请号：US17955854

申请日：2022-09-29

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

CPC classification number: H01L31/0203 ,  G01J5/00 ,  G01J5/0025 ,  G01J5/045 ,  G01J5/20 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02363 ,  G01J2005/206 ,  H01L27/14601 ,  H01L31/02164 ,  H01L31/024 ,  H01L31/095

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

公开(公告)号：US11990557B2

公开(公告)日：2024-05-21

申请号：US17083763

申请日：2020-10-29

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Kuo-Hsiung Li ,  Shang-Feng Hsieh ,  Jui-Cheng Chuang ,  Yi-Chang Chang

IPC: H01L31/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/143 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/186

Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.

公开(公告)号：US10002975B2

公开(公告)日：2018-06-19

申请号：US15607393

申请日：2017-05-26

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/09 ,  H01L31/024

CPC classification number: H01L31/0203 ,  G01J5/00 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14685

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US10896983B2

公开(公告)日：2021-01-19

申请号：US16537284

申请日：2019-08-09

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US09741875B2

公开(公告)日：2017-08-22

申请号：US15096601

申请日：2016-04-12

Applicant: PIXART IMAGING INC.

Inventor： Chi-Chih Shen ,  Yen-Hsin Chen ,  Yi-Chang Chang

IPC: H01L23/02 ,  H01L31/0203 ,  H01L31/14 ,  H01L31/02 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L31/02005 ,  H01L31/143 ,  H01L31/18 ,  H01L31/1876 ,  H01L2224/48091 ,  H01L2924/10155 ,  H01L2924/00014

Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 μm to 400 μm. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.