公开(公告)号：US11495697B2

公开(公告)日：2022-11-08

申请号：US17113349

申请日：2020-12-07

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US10439077B2

公开(公告)日：2019-10-08

申请号：US15979708

申请日：2018-05-15

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/09 ,  H01L31/024

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US12040416B2

公开(公告)日：2024-07-16

申请号：US17955854

申请日：2022-09-29

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

CPC classification number: H01L31/0203 ,  G01J5/00 ,  G01J5/0025 ,  G01J5/045 ,  G01J5/20 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02363 ,  G01J2005/206 ,  H01L27/14601 ,  H01L31/02164 ,  H01L31/024 ,  H01L31/095

Abstract: An optical component packaging structure is provided. The optical component packaging structure includes a substrate, a far-infrared sensor chip, a metal covering cap and a light filter. The far-infrared sensor chip is disposed on the substrate and electrically connected to the substrate. The metal covering cap is disposed on the substrate and accommodating the far-infrared sensor chip. The metal covering cap has an opening exposing the far-infrared sensor chip. The light filter is disposed out of the opening and on the inner surface for covering the opening to filter the far-infrared light passing through. The far-infrared sensor chip is surrounded by the metal covering cap, the substrate and the light filter, and the metal covering cap is directly connected with the substrate.

公开(公告)号：US10002975B2

公开(公告)日：2018-06-19

申请号：US15607393

申请日：2017-05-26

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  H01L31/0216 ,  H01L31/09 ,  H01L31/024

CPC classification number: H01L31/0203 ,  G01J5/00 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14685

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US10896983B2

公开(公告)日：2021-01-19

申请号：US16537284

申请日：2019-08-09

Applicant: PIXART IMAGING INC.

Inventor： Yi-Chang Chang ,  Yen-Hsin Chen ,  Chi-Chih Shen

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0236 ,  G01J5/00 ,  G01J5/04 ,  G01J5/20 ,  H01L31/0216 ,  H01L31/024 ,  H01L31/09

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

公开(公告)号：US09976898B2

公开(公告)日：2018-05-22

申请号：US15218078

申请日：2016-07-24

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Jen-Yu Chen ,  Yen-Hsin Chen ,  Kuo-Hsiung Li ,  Jui-Cheng Chuang

IPC: H01J40/14 ,  G01J1/44 ,  H05K1/18 ,  G01J1/04

CPC classification number: G01J1/44 ,  G01J1/0403 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.

公开(公告)号：US09741875B2

公开(公告)日：2017-08-22

申请号：US15096601

申请日：2016-04-12

Applicant: PIXART IMAGING INC.

Inventor： Chi-Chih Shen ,  Yen-Hsin Chen ,  Yi-Chang Chang

IPC: H01L23/02 ,  H01L31/0203 ,  H01L31/14 ,  H01L31/02 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L31/02005 ,  H01L31/143 ,  H01L31/18 ,  H01L31/1876 ,  H01L2224/48091 ,  H01L2924/10155 ,  H01L2924/00014

Abstract: A sensor chip package structure and a manufacturing method thereof are provided. The sensor chip package structure includes a substrate, a sensor chip and a wiring layer. The sensor chip is mounted on the substrate and has a top surface and a concave portion concaved from the top surface. The sensor chip has an active region formed on the top surface and the concave portion is located at one side of the active region. The concave portion has a depth of 100 μm to 400 μm. The wiring layer is disposed on the sensor chip and electrically connected to the active region. At least a portion of the wiring layer extends from the active region along a sidewall of the concave portion to a bottom surface of the concave portion.

公开(公告)号：US20170167914A1

公开(公告)日：2017-06-15

申请号：US15218078

申请日：2016-07-24

Applicant: PixArt Imaging Inc.

Inventor： Chi-Chih Shen ,  Jen-Yu Chen ,  Yen-Hsin Chen ,  Kuo-Hsiung Li ,  Jui-Cheng Chuang

IPC: G01J1/44 ,  G01J1/04 ,  H05K1/18

CPC classification number: G01J1/44 ,  G01J1/0403 ,  H05K1/181 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.