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Patent Agency Ranking
公开(公告)号：US10369783B2
公开(公告)日：2019-08-06
申请号：US15886811
申请日：2018-02-01
Inventor： Kentaro Kumazawa , Shuhei Nakatani , Takao Nagumo , Takashi Inoue , Futoshi Ohtsuka
Abstract: A high precision printing method taking into consideration the variance in the thickness of a printing target. An ink-jet printing method, including: (i) measuring a distance between a printing target and at least one nozzle; (ii) measuring a flying speed and a flying angle of an ink(a) discharged from the at least one nozzle; (iii) printing a test substrate with an ink to identify a location on which an ink(b) is spotted, and calculating a thickness-related displacement that is a displacement from the location on which the ink is spotted, based on a thickness difference between the printing target and the test substrate from results obtained in Step (i), and the flying speed and the flying angle of the ink(a) obtained in Step (ii); and (iv) discharging an ink(c) from the at least one nozzle to achieve actual printing of the printing target with the ink(c) while correcting the thickness-related displacement.
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2.发明授权Method for connecting piezoelectric element and cable substrate, piezoelectric element having cable substrate, and inkjet head including piezoelectric element with cable substrate 有权用于连接压电元件和电缆基板的方法，具有电缆基板的压电元件和包括具有电缆基板的压电元件的喷墨头公开(公告)号：US09293683B2
公开(公告)日：2016-03-22
申请号：US14707101
申请日：2015-05-08
Inventor： Kazunobu Irie , Futoshi Ohtsuka , Takeshi Kita , Motoi Hatanaka
IPC: B23K31/02 , H01L41/047 , H01L41/053 , B41J2/14 , B23K1/00
CPC classification number: H01L41/047 , B23K1/0016 , B23K31/02 , B41J2/14201 , B41J2/14209 , B41J2/14274 , B41J2/1609 , B41J2/1623 , B41J2002/14491 , H01L41/0475 , H01L41/053 , H01L41/08 , H01L41/083 , H01L41/273 , H01L41/29 , H01L41/338
Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.
Abstract translation: 本文公开的连接方法包括通过加热压电体的元件电极和要连接到压电体的柔性电缆的基板电极，使元件电极和基板电极被压接而使热固性树脂的树脂膜软化 通过树脂膜彼此相连; 从元件电极和基板电极的相对位置部分地推出熔融树脂膜，以使设置在基板电极上的焊料层与元件电极接触; 通过进一步提高加热温度来固化树脂膜并熔化焊料层中的焊料; 在由固化的树脂膜限定的方向上排出多余的焊料; 然后固化焊料层中的焊料，以将元件电极和基板电极焊接在一起。
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公开(公告)号：US11312136B2
公开(公告)日：2022-04-26
申请号：US17194416
申请日：2021-03-08
Inventor： Kazunobu Irie , Hidehiro Yoshida , Shuhei Nakatani , Futoshi Ohtsuka , Yousuke Toyofuku
Abstract: An ink jet head includes a piezoelectric element that is driven in a d33 mode, a pressure generation chamber in which a pressure is generated by the piezoelectric element, and an individual ink supply flow passage that through which the ink is supplied to the pressure generation chamber. The ink jet head includes an individual ink discharge flow passage that through which the ink is discharged from the pressure generation chamber, and a nozzle that ejects the ink from the pressure generation chamber. In a cross-sectional view in a direction orthogonal to an arrangement direction of the nozzle, inner diameters of the pressure generation chamber, the individual ink supply flow passage, and the individual ink discharge flow passage are shorter on a part close to the nozzle than a part close to the piezoelectric element side. Accordingly, an ink jet head capable of ejecting high-viscosity ink can be provided.
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公开(公告)号：US09773963B2
公开(公告)日：2017-09-26
申请号：US15044181
申请日：2016-02-16
Inventor： Kazunobu Irie , Futoshi Ohtsuka , Takeshi Kita , Motoi Hatanaka
IPC: B41J2/045 , H01L41/047 , H01L41/053 , B23K31/02 , B41J2/14 , B41J2/16 , B23K1/00 , H01L41/29 , H01L41/08 , H01L41/083 , H01L41/338 , H01L41/273
CPC classification number: H01L41/047 , B23K1/0016 , B23K31/02 , B41J2/14201 , B41J2/14209 , B41J2/14274 , B41J2/1609 , B41J2/1623 , B41J2002/14491 , H01L41/0475 , H01L41/053 , H01L41/08 , H01L41/083 , H01L41/273 , H01L41/29 , H01L41/338
Abstract: A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.
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公开(公告)号：US10457042B2
公开(公告)日：2019-10-29
申请号：US16118186
申请日：2018-08-30
Inventor： Shuhei Nakatani , Futoshi Ohtsuka , Yousuke Toyofuku
Abstract: An object of the disclosure is to provide an inkjet head that makes it possible to realize alleviation of ink-discharge malfunction due to fluid crosstalk possibly caused among multiple discharge components, and that also simultaneously makes it possible to maintain a desirable volume of discharged liquid droplets. Furthermore, another object of the disclosure is to provide an inkjet device including the inkjet head.
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