公开(公告)号：US09293683B2

公开(公告)日：2016-03-22

申请号：US14707101

申请日：2015-05-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kazunobu Irie ,  Futoshi Ohtsuka ,  Takeshi Kita ,  Motoi Hatanaka

IPC: B23K31/02 ,  H01L41/047 ,  H01L41/053 ,  B41J2/14 ,  B23K1/00

CPC classification number: H01L41/047 ,  B23K1/0016 ,  B23K31/02 ,  B41J2/14201 ,  B41J2/14209 ,  B41J2/14274 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14491 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/08 ,  H01L41/083 ,  H01L41/273 ,  H01L41/29 ,  H01L41/338

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract translation: 本文公开的连接方法包括通过加热压电体的元件电极和要连接到压电体的柔性电缆的基板电极，使元件电极和基板电极被压接而使热固性树脂的树脂膜软化 通过树脂膜彼此相连; 从元件电极和基板电极的相对位置部分地推出熔融树脂膜，以使设置在基板电极上的焊料层与元件电极接触; 通过进一步提高加热温度来固化树脂膜并熔化焊料层中的焊料; 在由固化的树脂膜限定的方向上排出多余的焊料; 然后固化焊料层中的焊料，以将元件电极和基板电极焊接在一起。

公开(公告)号：US11446929B2

公开(公告)日：2022-09-20

申请号：US17076257

申请日：2020-10-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shuhei Nakatani ,  Kazunobu Irie

IPC: B41J2/14

Abstract: A liquid discharging head and an ink-jet apparatus that can achieve stable discharging over time by suppressing clogging of a nozzle due to particles and the like contained in liquid, and by suppressing adhesion of particles to a channel and a diaphragm surface. A liquid discharging head includes a nozzle configured to discharge liquid; a pressure chamber communicated with the nozzle; an individual channel communicated with the pressure chamber through a narrow part; a common channel communicated with the individual channel; an energy generation element configured to generate energy; and a diaphragm configured to convey the energy to the pressure chamber, wherein a monomolecular film is formed at inner walls of the nozzle, the pressure chamber, the narrow part, the diaphragm, and the individual channel, the monomolecular film being lyophilic to the liquid.

公开(公告)号：US12005709B2

公开(公告)日：2024-06-11

申请号：US17883292

申请日：2022-08-08

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Shuhei Nakatani ,  Kazunobu Irie

IPC: B41J2/14

CPC classification number: B41J2/14233 ,  B41J2002/14241 ,  B41J2202/03 ,  B41J2202/11

Abstract: A liquid discharging head includes a nozzle configured to discharge liquid, a pressure chamber communicated with the nozzle, and an individual channel communicated with the pressure chamber through a narrow part. The liquid discharging head also includes a common channel communicated with the individual channel, an energy generation element configured to generate energy, and a diaphragm configured to convey the energy to the pressure chamber. A metal oxide film is formed at inner walls of the nozzle, the pressure chamber, the narrow part, the diaphragm, and the individual channel, and a hydroxyl group has come out from the metal oxide film.

公开(公告)号：US11312136B2

公开(公告)日：2022-04-26

申请号：US17194416

申请日：2021-03-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kazunobu Irie ,  Hidehiro Yoshida ,  Shuhei Nakatani ,  Futoshi Ohtsuka ,  Yousuke Toyofuku

IPC: B41J2/14 ,  B41J2/045 ,  B41J2/175

Abstract: An ink jet head includes a piezoelectric element that is driven in a d33 mode, a pressure generation chamber in which a pressure is generated by the piezoelectric element, and an individual ink supply flow passage that through which the ink is supplied to the pressure generation chamber. The ink jet head includes an individual ink discharge flow passage that through which the ink is discharged from the pressure generation chamber, and a nozzle that ejects the ink from the pressure generation chamber. In a cross-sectional view in a direction orthogonal to an arrangement direction of the nozzle, inner diameters of the pressure generation chamber, the individual ink supply flow passage, and the individual ink discharge flow passage are shorter on a part close to the nozzle than a part close to the piezoelectric element side. Accordingly, an ink jet head capable of ejecting high-viscosity ink can be provided.

公开(公告)号：US10112389B2

公开(公告)日：2018-10-30

申请号：US15318333

申请日：2015-06-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kenichi Yamamoto ,  Kazuki Fukada ,  Tohru Nakagawa ,  Kazunobu Irie ,  Takeshi Kita ,  Hidehiro Yoshida

IPC: B41J2/14 ,  G01N1/00 ,  B05C5/00 ,  B05C11/10 ,  B41J2/18 ,  B41J2/195

Abstract: In a common chamber (102) for distributing, to respective pressure chambers (211), an ink supplied from the ink inlet (101), resistant walls (111) are provided in areas that are located ahead and behind of the flow of the ink, i.e., areas around inlets of flow channels (221) that lead to respective pressure chambers (211), and any resistance against the flow of the ink is generated according to the heights of the resistant walls (111), thereby capturing a solid ingredient (150) included in the ink. In this case, by adjusting the heights of the resistant walls (111) to control capabilities of introducing the solid ingredient (150), it becomes possible to dispense desired amounts of the solid ingredient (150) to the respective pressure chamber (211).

公开(公告)号：US09773963B2

公开(公告)日：2017-09-26

申请号：US15044181

申请日：2016-02-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kazunobu Irie ,  Futoshi Ohtsuka ,  Takeshi Kita ,  Motoi Hatanaka

IPC: B41J2/045 ,  H01L41/047 ,  H01L41/053 ,  B23K31/02 ,  B41J2/14 ,  B41J2/16 ,  B23K1/00 ,  H01L41/29 ,  H01L41/08 ,  H01L41/083 ,  H01L41/338 ,  H01L41/273

CPC classification number: H01L41/047 ,  B23K1/0016 ,  B23K31/02 ,  B41J2/14201 ,  B41J2/14209 ,  B41J2/14274 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14491 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/08 ,  H01L41/083 ,  H01L41/273 ,  H01L41/29 ,  H01L41/338

Abstract: A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.