公开(公告)号：US20150214197A1

公开(公告)日：2015-07-30

申请号：US14675748

申请日：2015-04-01

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDEKI OHMAE ,  JUNICHI HIBINO ,  ATSUSHI YAMADA ,  DAISUKE UEDA

IPC: H01L25/13 ,  F21K99/00 ,  H01L33/38 ,  F21V23/00

CPC classification number: H01L25/13 ,  F21V23/002 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L33/387 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/4847 ,  H01L2224/4903 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/05599

Abstract: A light-emitting device includes: a plurality of LED chips each having a light-emitting region, and a first electrode and a second electrode that are electrically connected to light-emitting region; a plurality of substrates each being provided on each of the plurality of LED chips; a plurality of through-holes each penetrating through each of the plurality of substrates; and, a plurality of wires each passing through a first through-hole penetrated through a first substrate of the plurality of the substrates and a second through-hole penetrated through a second substrate adjacent to the first substrate. The one of the plurality of the wires is electrically connected the first electrode or the second electrode of a first LED chip corresponding to the first substrate, to the first electrode or the second electrode of a second LED chip corresponding to the second substrate.

Abstract translation: 发光装置包括：具有发光区域的多个LED芯片和与发光区域电连接的第一电极和第二电极; 多个基板，分别设置在所述多个LED芯片的每一个上; 多个贯通所述多个基板中的每一个的通孔; 并且，穿过穿过多个基板的第一基板的第一通孔的多根电线和穿过与第一基板相邻的第二基板的第二通孔。 多个导线中的一个电线将与第一基板对应的第一LED芯片的第一电极或第二电极电连接到对应于第二基板的第二LED芯片的第一电极或第二电极。

公开(公告)号：US20170331149A1

公开(公告)日：2017-11-16

申请号：US15484390

申请日：2017-04-11

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： IZURU SASAKI ,  JUNICHI HIBINO

IPC: H01M10/0562 ,  H01M4/525 ,  H01M4/131 ,  H01M4/62 ,  H01M4/66 ,  H01M10/0525 ,  H01M4/02

CPC classification number: H01M10/0562 ,  H01M4/131 ,  H01M4/525 ,  H01M4/62 ,  H01M4/621 ,  H01M4/625 ,  H01M4/661 ,  H01M10/052 ,  H01M10/0525 ,  H01M2004/028 ,  H01M2300/0068

Abstract: A sulfide solid electrolyte material includes a sulfide phase containing a sulfide material and an oxide phase containing an oxide formed by oxidation of the sulfide material. The oxide phase is located on a surface of the sulfide phase. The sulfide solid electrolyte material satisfies conditions: 1.28≦x≦4.06 and x/y≧2.60, where x denotes the oxygen-to-sulfur elemental ratio measured by XPS depth profiling at the outermost surface of the oxide phase; and y denotes the oxygen-to-sulfur elemental ratio measured by XPS depth profiling at a position 32 nm, estimated from the SiO2 sputtering rate, away from the outermost surface of the oxide phase.

公开(公告)号：US20150179905A1

公开(公告)日：2015-06-25

申请号：US14572771

申请日：2014-12-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDEKI OHMAE ,  JUNICHI HIBINO ,  ATSUSHI YAMADA

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/00 ,  H01L27/15

CPC classification number: H01L33/62 ,  G02F1/133603 ,  G02F1/133608 ,  H01L27/156 ,  H01L33/005 ,  H01L33/52 ,  H01L2224/24 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92244 ,  H01L2924/3512 ,  H01L2933/0066

Abstract: A light emitting device in which a plurality of LED chips are arranged. Each of the plurality of LED chips include a light emitting region that is formed on a substrate, a first pad electrode that is formed on the substrate, and a through-hole that penetrates the substrate. First wiring that passes through the through-hole of one LED chip and the through-hole of an adjacent LED chip, and electrically connects the first pad electrode of the one LED chip and the first pad electrode of the adjacent LED chip is provided. The tip-end parts of the first wiring that have passed through the through-holes have, at a cross section cut at a plane that is parallel with a principal surface of the substrate, a larger cross-sectional area than the cross-sectional area of the first wiring inside the through-holes.

Abstract translation: 一种其中布置有多个LED芯片的发光器件。 多个LED芯片中的每一个包括形成在基板上的发光区域，形成在基板上的第一焊盘电极和穿透基板的通孔。 提供通过一个LED芯片的通孔和相邻LED芯片的通孔的第一布线，并且将一个LED芯片的第一焊盘电极和相邻LED芯片的第一焊盘电极电连接。 已经穿过通孔的第一布线的前端部分在与基板的主表面平行的平面处切割的横截面具有比横截面积更大的横截面积 的通孔内的第一布线。