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    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    1.
    发明申请
    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
    电子元件安装系统和电子元件安装方法

    公开(公告)号：US20150271963A1

    公开(公告)日：2015-09-24

    申请号：US14443491

    申请日：2013-11-15

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Katsuhiko Itoh ,  Nobuo Komiya

    IPC: H05K13/04 ,  H05K13/02 ,  H05K13/00 ,  H05K3/34 ,  H05K13/08

    CPC classification number: H05K13/0465 ,  B23K3/0607 ,  B23K3/0638 ,  H05K3/303 ,  H05K3/341 ,  H05K13/00 ,  H05K13/0015 ,  H05K13/021 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/0817 ,  H05K2203/04 ,  H05K2203/166

    Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information—when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.

    Abstract translation: 根据在执行部件安装工作时预先设置在以下安装信息中的安装模式将电子部件安装在基板上。 在安装信息中，其中电子部件被传送并安装到基于印刷焊料的位置和电极的位置之间的位置偏移量而被校正的安装位置的第一安装模式中的任何一个，以及 作为用于每个电子部件安装装置的性能的安装模式，将电子部件通过仅考虑电极的位置作为基准而被传送并安装到安装位置的第二安装模式。

    Electronic component mounting system and electronic component mounting method
    3.
    发明授权
    Electronic component mounting system and electronic component mounting method 有权

    公开(公告)号：US10123470B2

    公开(公告)日：2018-11-06

    申请号：US14655560

    申请日：2013-12-19

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Katsuhiko Itoh ,  Nobuo Komiya

    IPC: H05K3/30 ,  H05K13/08 ,  H05K3/34 ,  H05K13/04

    Abstract: An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information.

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