-
1.
公开(公告)号:US20240265569A1
公开(公告)日:2024-08-08
申请号:US18639943
申请日:2024-04-18
Inventor: RYO FUJITA
IPC: G06T7/70 , G02B5/04 , G06T7/13 , G06V10/141
CPC classification number: G06T7/70 , G02B5/04 , G06T7/13 , G06V10/141
Abstract: A positioning device includes a camera, a prism including a first reflection surface and a second reflection surface, and an processor. When the prism is disposed between a joint head and a stage, the first reflection surface reflects, to a side of the camera, light incident from a side of the joint head, and the second reflection surface reflects, to a side of the camera, light incident from a side of the stage. The camera images a camera image including a first image that is an image on the side of the joint head and a second image that is an image on the side of the stage based on light incident from the prism. The processor obtains a position of a first component and a position of a second component based on the camera image.
-
公开(公告)号:US20220408621A1
公开(公告)日:2022-12-22
申请号:US17804856
申请日:2022-06-01
Inventor: YUSUKE TAKECHI , RYO FUJITA
Abstract: A mounting head includes a drive part that moves in a vertical direction to apply a load to an electronic component, a float part supported by the drive part in a vertically movable manner, and a linear motor that applies a vertical upward pressing force to the float part. The linear motor includes a stator fixed on the drive part and a moving member fixed on the float part. The drive part moves downward in the vertical direction to apply the load due to own weight of the float part to the electronic component to mount the electronic component onto the board. The linear motor is driven to control a magnitude of the load applied to the electronic component by applying the vertical upward pressing force to the float part.
-
公开(公告)号:US20250140736A1
公开(公告)日:2025-05-01
申请号:US19004085
申请日:2024-12-27
Inventor: RYO FUJITA , MASARU HAMAHIRA
Abstract: A positioning equipment includes a camera, a lens disposed in an imaging direction of the camera, a light synthesis unit, and an arithmetic equipment. The light synthesis unit is disposed between a bonding head and a stage when a first component and a second component are positioned, synthesizes light incident from the bonding head side and light incident from the stage side, and reflects the synthesized light to the lens side. The camera images a camera image based on light incident via the lens. The arithmetic equipment obtains a position correction amount between the first component and the second component based on the camera image.
-
公开(公告)号:US20230096476A1
公开(公告)日:2023-03-30
申请号:US17929753
申请日:2022-09-06
Inventor: RYOTARO MIYAHARA , RYO FUJITA
Abstract: A linear motion device includes: a base that extends in a reference direction; a linear guide mechanism that includes a guide rail fixed to the base and extending in the reference direction and a slider supported movably on the guide rail along the reference direction; a moving body that is fixed to the slider and that is movable in the reference direction together with the slider; a linear motor that includes a stator fixed to the base, the stator including a magnet row and extending in the reference direction, and a mover including a plurality of coils provided with a certain gap from the stator; and a heat transfer body that is disposed between the moving body and the mover and that is connected to the moving body and the mover, and the heat transfer body extends in a direction away from the linear guide mechanism.
-
公开(公告)号:US20190189586A1
公开(公告)日:2019-06-20
申请号:US16205184
申请日:2018-11-29
Inventor: RYO FUJITA
CPC classification number: H01L24/75 , B23K3/0338 , B23K35/262 , H01L24/32 , H01L24/83 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/75253 , H01L2224/75744 , H01L2224/83075 , H01L2224/83815 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/15747 , H01L2933/0066
Abstract: A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.
-
-
-
-