-
公开(公告)号：US08155916B2
公开(公告)日：2012-04-10
申请号：US12168369
申请日：2008-07-07
IPC分类号： G01K7/16
CPC分类号： H01L23/34 , H01L23/647 , H01L27/0248 , H01L29/0696 , H01L29/42312 , H01L2924/0002 , H01L2924/00
摘要： One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor body and having a control connection and a load connection is provided. A resistance component is thermally coupled to the power semiconductor component and likewise integrated into the semiconductor body and arranged between the control connection and the load connection of the power semiconductor component. The resistance component has a temperature-dependent resistance characteristic curve. A driving and evaluation unit is designed to evaluate the current through the resistance component or the voltage drop across the resistance component and provides a temperature signal dependent thereon.
摘要翻译： 一个实施例提供集成在半导体本体中的电路装置。 提供集成在半导体本体中并且具有控制连接和负载连接的至少一个功率半导体部件。 电阻分量热耦合到功率半导体部件，并且同样集成到半导体本体中并且布置在功率半导体部件的控制连接和负载连接之间。 电阻分量具有温度依赖性电阻特性曲线。 驱动和评估单元被设计为评估通过电阻分量的电流或电阻分量两端的电压降，并提供依赖于其的温度信号。
-
公开(公告)号：US08478559B2
公开(公告)日：2013-07-02
申请号：US13423883
申请日：2012-03-19
CPC分类号： H01L23/34 , H01L23/647 , H01L27/0248 , H01L29/0696 , H01L29/42312 , H01L2924/0002 , H01L2924/00
摘要： One embodiment provides a semiconductor chip including a semiconductor body and a power semiconductor component integrated therein. The power semiconductor component includes a load electrode zone arranged on a first surface of the semiconductor body, a control electrode zone arranged on the first surface, the control electrode zone being electrically insulated from the load electrode zone, and a resistance track arranged on the load electrode zone and the control electrode zone. The resistance track ensures an electrical connection between the load electrode zone and the control electrode zone.
摘要翻译： 一个实施例提供一种包括半导体本体和集成在其中的功率半导体元件的半导体芯片。 功率半导体部件包括布置在半导体主体的第一表面上的负载电极区域，布置在第一表面上的控制电极区域，控制电极区域与负载电极区域电绝缘，以及布置在负载上的电阻轨道 电极区和控制电极区。 电阻轨道确保负载电极区域和控制电极区域之间的电连接。
-
公开(公告)号：US20120175780A1
公开(公告)日：2012-07-12
申请号：US13423883
申请日：2012-03-19
CPC分类号： H01L23/34 , H01L23/647 , H01L27/0248 , H01L29/0696 , H01L29/42312 , H01L2924/0002 , H01L2924/00
摘要： One embodiment provides a semiconductor chip including a semiconductor body and a power semiconductor component integrated therein. The power semiconductor component includes a load electrode zone arranged on a first surface of the semiconductor body, a control electrode zone arranged on the first surface, the control electrode zone being electrically insulated from the load electrode zone, and a resistance track arranged on the load electrode zone and the control electrode zone. The resistance track ensures an electrical connection between the load electrode zone and the control electrode zone.
摘要翻译： 一个实施例提供一种包括半导体本体和集成在其中的功率半导体元件的半导体芯片 功率半导体部件包括布置在半导体主体的第一表面上的负载电极区域，布置在第一表面上的控制电极区域，控制电极区域与负载电极区域电绝缘，以及布置在负载上的电阻轨道 电极区和控制电极区。 电阻轨道确保负载电极区域和控制电极区域之间的电连接。
-
公开(公告)号：US20100001785A1
公开(公告)日：2010-01-07
申请号：US12168369
申请日：2008-07-07
CPC分类号： H01L23/34 , H01L23/647 , H01L27/0248 , H01L29/0696 , H01L29/42312 , H01L2924/0002 , H01L2924/00
摘要： One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor body and having a control connection and a load connection is provided. A resistance component is thermally coupled to the power semiconductor component and likewise integrated into the semiconductor body and arranged between the control connection and the load connection of the power semiconductor component. The resistance component has a temperature-dependent resistance characteristic curve. A driving and evaluation unit is designed to evaluate the current through the resistance component or the voltage drop across the resistance component and provides a temperature signal dependent thereon.
摘要翻译： 一个实施例提供集成在半导体本体中的电路装置。 提供集成在半导体本体中并且具有控制连接和负载连接的至少一个功率半导体部件。 电阻分量热耦合到功率半导体部件，并且同样集成到半导体本体中并且布置在功率半导体部件的控制连接和负载连接之间。 电阻分量具有温度依赖性电阻特性曲线。 驱动和评估单元被设计为评估通过电阻分量的电流或电阻分量两端的电压降，并提供依赖于其的温度信号。
-
5.发明申请Low Inductance Capacitor Module and Power System with Low Inductance Capacitor Module 有权低电感电容模块和低电感电容模块的电力系统公开(公告)号：US20130094122A1
公开(公告)日：2013-04-18
申请号：US13271491
申请日：2011-10-12
申请人： Daniel Domes , Reinhold Bayerer
发明人： Daniel Domes , Reinhold Bayerer
CPC分类号： H05K7/1432 , H01G2/06 , H01G4/40 , H01L2224/48472
摘要： According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.
摘要翻译： 根据电容器模块的一个实施例，电容器模块包括在衬底的第一侧上具有金属化的衬底，电耦合到金属化的多个连接器和设置在金属化上的多个电容器。 多个电容器包括并联电连接在第一组连接器和第二组连接器之间的第一组电容器。 电容器模块还包括封装电容器模块内的多个电容器的壳体。
-
6.发明授权Low inductance capacitor module and power system with low inductance capacitor module 有权低电感电容模块和低电感电容模块电力系统公开(公告)号：US08787003B2
公开(公告)日：2014-07-22
申请号：US13271491
申请日：2011-10-12
申请人： Daniel Domes , Reinhold Bayerer
发明人： Daniel Domes , Reinhold Bayerer
CPC分类号： H05K7/1432 , H01G2/06 , H01G4/40 , H01L2224/48472
摘要： According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.
摘要翻译： 根据电容器模块的一个实施例，电容器模块包括在衬底的第一侧上具有金属化的衬底，电耦合到金属化的多个连接器和设置在金属化上的多个电容器。 多个电容器包括并联电连接在第一组连接器和第二组连接器之间的第一组电容器。 电容器模块还包括封装电容器模块内的多个电容器的壳体。
-
公开(公告)号：US08487407B2
公开(公告)日：2013-07-16
申请号：US13272741
申请日：2011-10-13
申请人： Reinhold Bayerer , Daniel Domes
发明人： Reinhold Bayerer , Daniel Domes
CPC分类号： H01L23/645 , H01L23/62 , H01L24/46 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/162 , H01L2224/0603 , H01L2224/24225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4903 , H01L2224/49109 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099
摘要： According to one embodiment of a module, the module includes a plurality of gate driver chips coupled in parallel and having a common gate input, a common supply voltage and a common output. The chips are spaced apart from one another and have a combined width extending between an edge of a first outer one of the chips and an opposing edge of a second outer one of the chips. The module further includes a plurality of capacitors coupled in parallel between ground and the common supply voltage, and a transverse electromagnetic (TEM) transmission line medium coupled to the common output of the chips and having a current flow direction perpendicular to the combined width of the chips.
摘要翻译： 根据模块的一个实施例，模块包括并联耦合并具有公共栅极输入，公共电源电压和公共输出的多个栅极驱动器芯片。 芯片彼此间隔开并且具有在芯片的第一外部芯片的边缘和芯片的第二外部芯片的相对边缘之间延伸的组合宽度。 模块还包括并联耦合在地和公共电源电压之间的多个电容器，以及耦合到芯片的公共输出的横向电磁（TEM）传输线介质，并且具有垂直于所述芯片的组合宽度的电流流动方向 筹码
-
公开(公告)号：US20130093046A1
公开(公告)日：2013-04-18
申请号：US13272741
申请日：2011-10-13
申请人： Reinhold Bayerer , Daniel Domes
发明人： Reinhold Bayerer , Daniel Domes
IPC分类号： H01L29/02
CPC分类号： H01L23/645 , H01L23/62 , H01L24/46 , H01L24/48 , H01L24/49 , H01L25/072 , H01L25/162 , H01L2224/0603 , H01L2224/24225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4903 , H01L2224/49109 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/45099
摘要： According to one embodiment of a module, the module includes a plurality of gate driver chips coupled in parallel and having a common gate input, a common supply voltage and a common output. The chips are spaced apart from one another and have a combined width extending between an edge of a first outer one of the chips and an opposing edge of a second outer one of the chips. The module further includes a plurality of capacitors coupled in parallel between ground and the common supply voltage, and a transverse electromagnetic (TEM) transmission line medium coupled to the common output of the chips and having a current flow direction perpendicular to the combined width of the chips.
摘要翻译： 根据模块的一个实施例，模块包括并联耦合并具有公共栅极输入，公共电源电压和公共输出的多个栅极驱动器芯片。 芯片彼此间隔开并且具有在芯片的第一外部芯片的边缘和芯片的第二外部芯片的相对边缘之间延伸的组合宽度。 模块还包括并联耦合在地和公共电源电压之间的多个电容器，以及耦合到芯片的公共输出的横向电磁（TEM）传输线介质，并且具有垂直于所述芯片的组合宽度的电流流动方向 筹码
-
公开(公告)号：US20110216561A1
公开(公告)日：2011-09-08
申请号：US13040348
申请日：2011-03-04
申请人： Reinhold Bayerer , Daniel Domes
发明人： Reinhold Bayerer , Daniel Domes
IPC分类号： H02M7/493
CPC分类号： H02M7/003 , H01L25/162 , H01L2224/48091 , H01L2224/49111 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A power semiconductor assembly includes at least two bridge branches each including at least two circuit breakers connected to a phase output. Each of the circuit breakers has at least two parallel-connected switching elements integrated into a semiconductor chip. Each of the circuit breakers is arranged in a power semiconductor module and the individual power semiconductor modules are arranged adjacent to one another in a first direction. The semiconductor chips of a particular circuit breaker are arranged adjacent to one another in the corresponding power semiconductor module in a second direction extending perpendicular to the first direction.
摘要翻译： 功率半导体组件包括至少两个电桥分支，每个至少两个电桥分支包括连接到相位输出的至少两个断路器。 每个断路器具有集成到半导体芯片中的至少两个并联的开关元件。 每个断路器布置在功率半导体模块中，并且各个功率半导体模块在第一方向上彼此相邻布置。 特定断路器的半导体芯片在垂直于第一方向延伸的第二方向上在相应的功率半导体模块中彼此相邻布置。
-
公开(公告)号：US09106124B2
公开(公告)日：2015-08-11
申请号：US13040348
申请日：2011-03-04
申请人： Reinhold Bayerer , Daniel Domes
发明人： Reinhold Bayerer , Daniel Domes
CPC分类号： H02M7/003 , H01L25/162 , H01L2224/48091 , H01L2224/49111 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A low-inductive power semiconductor assembly is provided in which semiconductor switches are arranged behind one another in a main current path.
摘要翻译： 提供一种低感应功率半导体组件，其中半导体开关在主电流路径中相互布置。
-
-
-
-
-
-
-
-
-
搜索结果
112 条记录 (耗时 0.021 秒)
