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    Metal film interrupting process
    1.
    发明授权
    Metal film interrupting process 失效
    金属膜中断过程

    公开(公告)号：US06544865B1

    公开(公告)日：2003-04-08

    申请号：US09673053

    申请日：2000-11-07

    申请人： Paul Alan Basore ,  Neil Barrett ,  Trevor Young

    发明人： Paul Alan Basore ,  Neil Barrett ,  Trevor Young

    IPC分类号： H01L21301

    CPC分类号： B23K26/364 ,  B23K26/389 ,  B23K2101/40

    摘要： A simple thin film structure is illustrated in which a substrate (11), which may be glass or any other suitable substrate material, supports a device structure (12), over which is formed an inert dielectric layer (13) and a metal film (14). A pulsed laser beam (15) directed at the surface of the metal film layer (14). When the laser is pulsed on, a small amount of metal is ablated directly under the beam and surface tension in the surface of molten metal surrounding the ablated region pulls the metal back from the hole causing a slight thickening of the metal (17) around the hole, and creates a hole (16) which is significantly larger in diameter than the ablated region.

    摘要翻译： 示出了简单的薄膜结构，其中可以是玻璃或任何其它合适的衬底材料的衬底（11）支撑器件结构（12），其上形成惰性介电层（13）和金属膜（ 14）。 指向金属膜层（14）的表面的脉冲激光束（15）。 当激光被脉冲时，少量的金属直接在梁的下面被烧蚀，围绕烧蚀区域的熔融金属表面的表面张力将金属从孔中拉出，导致金属（17）周围的轻微的增厚 并且产生直径明显大于烧蚀区域的孔（16）。

    Pull-cord and pulley lacing system
    3.
    发明申请
    Pull-cord and pulley lacing system 审中-公开
    拉绳和滑轮系带系统

    公开(公告)号：US20060021204A1

    公开(公告)日：2006-02-02

    申请号：US11191339

    申请日：2005-07-28

    申请人： Trevor Young

    发明人： Trevor Young

    IPC分类号： A43C7/00

    CPC分类号： A43C7/00 ,  A43C11/165 ,  Y10T24/3711

    摘要： A convenient lacing system including a drawing mechanism, pulleys or some other form of low friction lace paths, an attachment point, and a lace. The lace terminates at the attachment point, and follows a path around the outside hemispheres of the pulleys (or through the lace paths), criss-crossing between the two rows of pulleys without the lace overlapping. The pulleys are aligned generally in two rows on either side of an area to be drawn together. A drawing mechanism is attached at the non-terminating end of the path of the lace, and through use of a pull-cord draws in the lace and tightens the item to which the system is attached by drawing the pulleys (lace paths) closer together. The use of pulleys allows the system to distribute tension evenly along the path of the lace, and aids in the convenience of tightening.

    摘要翻译： 一种方便的系带系统，包括拉伸机构，滑轮或一些其他形式的低摩擦花边路径，附接点和花边。 花边在连接点处终止，并且沿着绕着滑轮的外半球（或通过花边路径）的路径，在两排滑轮之间交叉而没有花边重叠。 滑轮通常在要拉制在一起的区域的任一侧上两行排列。 在花边路径的非终止端附着拉丝机构，通过使用拉绳吸入花边，并通过将皮带轮（花边路径）靠近在一起拉紧系统所附接的物品 。 使用滑轮可以使系统沿着花边的路径均匀分布张力，有助于紧固的方便。

    Method of forming openings in an organic resin material
    4.
    发明申请
    Method of forming openings in an organic resin material 失效
    在有机树脂材料中形成开口的方法

    公开(公告)号：US20070007627A1

    公开(公告)日：2007-01-11

    申请号：US10569652

    申请日：2004-09-09

    申请人： Trevor Young ,  Patrick Lasswell

    发明人： Trevor Young ,  Patrick Lasswell

    IPC分类号： H01L29/06

    CPC分类号： H01L21/0271 ,  B41J2/01 ,  H01L21/31133 ,  H01L31/046 ,  Y02E10/50

    摘要： A thin film of organic resin material (17), such as novolac, is used as an etch mask and openings (32) are formed in the mask in a predetermined pattern to allow processing in selected areas defined by the openings. The openings (32) are formed by applying a pattern of droplets (76) of caustic etchant, such as sodium hydroxide (NaOH) or potassium hydroxide (KOH) in the areas where the openings are to be formed. The droplets (76) are applied using a inkjet printer (90) which is scanned over the surface of the organic resin as the droplets are applied. The droplets (76) are of a size which defines the dimension of the openings (32) and allows the organic resin (17) under the droplet (76) to be completely removed. After the etchant has etched through the organic resin to expose an underlying surface (12), the etchant is washed from the organic resin and the openings (32).

    摘要翻译： 使用诸如酚醛清漆的有机树脂材料（17）的薄膜作为蚀刻掩模，并且在掩模中以预定图案形成开口（32），以允许在由开口限定的选定区域中进行处理。 通过在要形成开口的区域中施加诸如氢氧化钠（NaOH）或氢氧化钾（KOH）的腐蚀性蚀刻剂的液滴（76）的图案形成开口（32）。 使用喷墨打印机（90）施加液滴（76），喷墨打印机（90）在施加液滴时在有机树脂的表面上扫描。 液滴（76）具有限定开口（32）的尺寸并允许液滴（76）下方的有机树脂（17）被完全去除的尺寸。 在蚀刻剂通过有机树脂蚀刻以暴露下面的表面（12）之后，从有机树脂和开口（32）洗涤蚀刻剂。

    Method of etching silicon
    5.
    发明申请
    Method of etching silicon 失效
    蚀刻硅的方法

    公开(公告)号：US20060292821A1

    公开(公告)日：2006-12-28

    申请号：US10569701

    申请日：2004-09-09

    申请人： Trevor Young

    发明人： Trevor Young

    IPC分类号： H01L21/76

    CPC分类号： H01L21/32139 ,  H01L21/32134 ,  H01L31/046 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

    摘要： Silicon (12) is etched through a mask (11) comprising a layer of organic resin material (such as novolac) through which openings (32) are formed in the areas to be etched. The layer of organic resin is first deposited over a free surface of the device to be etched. The openings (32) are then formed by depositing droplets of a caustic etchant such as sodium hydroxide (NaOH) or potassium hydroxide (KOH) with an inkjet printer. The etchant reacts with the resin to expose the silicon surface in areas to be etched. The etching of the silicon surface is performed by applying a dilute solution of hydrofluoric acid (HF) and potassium permanganate (KMnO4) to the exposed surface through the openings in the mask to etch the silicon to a desired depth (83).

    摘要翻译： 通过掩模（11）蚀刻硅（12），所述掩模（11）包括有机树脂材料（例如酚醛清漆）层，在待蚀刻的区域中形成开口（32）。 有机树脂层首先沉积在被蚀刻装置的自由表面上。 然后通过用喷墨打印机沉积苛性蚀刻剂如氢氧化钠（NaOH）或氢氧化钾（KOH）的液滴形成开口（32）。 蚀刻剂与树脂反应，以在要蚀刻的区域中露出硅表面。 硅表面的蚀刻是通过将暴露的表面通过掩模中的开口施加氢氟酸（HF）和高锰酸钾（KMnO 4 S 4）的稀释溶液进行的，以将硅蚀刻成所需的 深度（83）。