公开(公告)号：US07491610B2

公开(公告)日：2009-02-17

申请号：US11809873

申请日：2007-06-01

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L21/8232

CPC分类号： H01L29/66666 ,  H01L27/0629 ,  H01L27/10808 ,  H01L27/10852 ,  H01L27/10861 ,  H01L27/10873 ,  H01L27/10876 ,  H01L28/60 ,  H01L29/66181 ,  H01L29/945

摘要： A process and an architecture related to a vertical MOSFET device and a capacitor for use in integrated circuits. The integrated circuit structure includes a semiconductor layer with a major surface and further including a first doped region formed in the surface. A second doped region of a different conductivity type than the first doped region is positioned over the first region. A third doped region of a different conductivity type than the second region is positioned over the second region. The integrated circuit includes a capacitor having a bottom plate, dielectric layer and a top plate. In an associated method of manufacture, a first device region. is formed on a semiconductor layer. A field-effect transistor gate region is formed over the first device region. A capacitor comprising top and bottom layers and a dielectric layer is formed on the semiconductor layer.

摘要翻译： 与集成电路中使用的垂直MOSFET器件和电容器相关的工艺和架构。 集成电路结构包括具有主表面的半导体层，并且还包括形成在表面中的第一掺杂区域。 与第一掺杂区域不同的导电类型的第二掺杂区域位于第一区域上方。 与第二区域不同的导电类型的第三掺杂区域位于第二区域上方。 集成电路包括具有底板，电介质层和顶板的电容器。 在相关的制造方法中，第一装置区域。 形成在半导体层上。 在第一器件区域上形成场效应晶体管栅极区域。 在半导体层上形成包括顶层和底层的电容器和电介质层。

公开(公告)号：US07033877B2

公开(公告)日：2006-04-25

申请号：US10723547

申请日：2003-11-26

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L21/8238 ,  H01L21/332 ,  H01L21/337

CPC分类号： H01L29/66909 ,  H01L21/823487 ,  H01L27/088 ,  H01L27/098 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66742 ,  H01L29/78642 ,  H01L29/8083

摘要： An architecture for creating a vertical JFET. Generally, an integrated circuit structure includes a semiconductor area with a major surface formed along a plane and a first source/drain doped region formed in the surface. A second doped region forming a channel of different conductivity type than the first region is positioned over the first region. A third doped region is formed over the second doped region having an opposite conductivity type with respect to the second doped region, and forming a source/drain region. A gate is formed over the channel to form a vertical JFET.In an associated method of manufacturing the semiconductor device, a first source/drain region is formed in a semiconductor layer. A field-effect transistor gate region, including a channel and a gate electrode, is formed over the first source/drain region. A second source/drain region is then formed over the channel having the appropriate conductivity type.

公开(公告)号：US20090130810A1

公开(公告)日：2009-05-21

申请号：US12319603

申请日：2009-01-09

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L21/336

CPC分类号： H01L29/66666 ,  H01L27/0629 ,  H01L27/10808 ,  H01L27/10852 ,  H01L27/10861 ,  H01L27/10873 ,  H01L27/10876 ,  H01L28/60 ,  H01L29/66181 ,  H01L29/945

摘要： A process and an architecture related to a vertical MOSFET device and a capacitor for use in integrated circuits. The integrated circuit structure includes a semiconductor layer with a major surface and further including a first doped region formed in the surface. A second doped region of a different conductivity type than the first doped region is positioned over the first region. A third doped region of a different conductivity type than the second region is positioned over the second region. The integrated circuit includes a capacitor having a bottom plate, dielectric layer and a top plate. In an associated method of manufacture, a first device region, is formed on a semiconductor layer. A field-effect transistor gate region is formed over the first device region. A capacitor comprising top and bottom layers and a dielectric layer is formed on the semiconductor layer.

摘要翻译： 与集成电路中使用的垂直MOSFET器件和电容器相关的工艺和架构。 集成电路结构包括具有主表面的半导体层，并且还包括形成在表面中的第一掺杂区域。 与第一掺杂区域不同的导电类型的第二掺杂区域位于第一区域上方。 与第二区域不同的导电类型的第三掺杂区域位于第二区域上方。 集成电路包括具有底板，电介质层和顶板的电容器。 在相关联的制造方法中，在半导体层上形成第一器件区域。 在第一器件区域上形成场效应晶体管栅极区域。 在半导体层上形成包括顶层和底层的电容器和电介质层。

公开(公告)号：US07045835B2

公开(公告)日：2006-05-16

申请号：US10638248

申请日：2003-08-08

申请人： Paul Arthur Layman ,  John Russell McMacken

发明人： Paul Arthur Layman ,  John Russell McMacken

IPC分类号： H01L31/288 ,  H01L31/112

CPC分类号： H01L27/1465 ,  H01L24/81 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/1469 ,  H01L2224/16145 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00

摘要： An interconnect architecture for connecting a plurality of closely-spaced electrical elements on a first integrated circuit fabricated structure with operative circuits on a second integrated circuit fabricated structure. In one embodiment, the first integrated circuit fabricated structure comprises a plurality of photo sensors. Conductive interconnect elements on the first integrated circuit fabricated structure provide electrical connection between individual photo sensors and the operative circuitry on the second integrated circuit fabricated structure.

公开(公告)号：US06709904B2

公开(公告)日：2004-03-23

申请号：US09968234

申请日：2001-09-28

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L2100

CPC分类号： H01L29/42392 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66666 ,  H01L29/7827 ,  H01L29/78642

摘要： An architecture for creating a vertical silicon-on-insulator MOSFET. Generally, an integrated circuit structure includes a semiconductor area with a major surface formed along a plane and a first source/drain contact region formed in the surface. A relatively thin single crystalline layer is oriented vertically above the major surface and comprises a first source/drain doped region over which is located a doped channel region, over which is located a second source/drain region. An insulating layer is disposed adjacent said first and said second source/drain regions and said channel region, serving as the insulating material of the SOI device. In another embodiment, insulating material is adjacent only said first and said second source/drain regions. A conductive region is adjacent the channel region for connecting the back side of the channel region to ground, for example, to prevent the channel region from floating. In an associated method of manufacturing the semiconductor device, a first source/drain region is formed in a relatively thin vertical layer of single crystalline material. A MOSFET gate region, including a channel and a gate electrode, is formed over the first source/drain region. A second source/drain region is then formed over the channel, the regions being appropriately doped to effect MOSFET action.

摘要翻译： 一种用于创建垂直绝缘体上硅的MOSFET的架构。 通常，集成电路结构包括具有沿着平面形成的主表面的半导体区域和形成在表面中的第一源极/漏极接触区域。 相对薄的单晶层在主表面上垂直取向，并且包括第一源极/漏极掺杂区域，在该第一源极/漏极掺杂区域上定位有掺杂沟道区，其上定位有第二源极/漏极区。 邻近所述第一和第二源极/漏极区域和所述沟道区域设置绝缘层，用作SOI器件的绝缘材料。 在另一个实施例中，绝缘材料仅与所述第一和所述第二源极/漏极区相邻。 导电区域与通道区域相邻，用于将沟道区域的背面连接到地，例如以防止沟道区域浮动。在制造半导体器件的相关方法中，形成第一源极/漏极区域 相对薄的垂直层单晶材料。 在第一源极/漏极区域上形成包括沟道和栅电极的MOSFET栅极区域。 然后在该通道上形成第二源极/漏极区域，该区域被适当地掺杂以实现MOSFET的动作。

公开(公告)号：US06690040B2

公开(公告)日：2004-02-10

申请号：US09950384

申请日：2001-09-10

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L2932

CPC分类号： H01L29/66909 ,  H01L21/823487 ,  H01L27/088 ,  H01L27/098 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/66742 ,  H01L29/78642 ,  H01L29/8083

摘要： A vertical JFET architecture. Generally, an integrated circuit structure includes a semiconductor area with a major surface formed along a plane and a first source/drain doped region formed in the surface. A second doped region forming a channel of different conductivity type than the first region is disposed over the first region. A third doped region is formed over the second doped region having an opposite conductivity type with respect to the second doped region, and forming a source/drain region. A gate is formed over the channel to form a vertical JFET.

摘要翻译： 垂直JFET架构。 通常，集成电路结构包括具有沿着平面形成的主表面的半导体区域和形成在表面中的第一源极/漏极掺杂区域。 形成与第一区域不同的导电类型的沟道的第二掺杂区域设置在第一区域上。 第三掺杂区形成在相对于第二掺杂区具有相反导电类型的第二掺杂区上方，以及形成源极/漏极区。 在沟道上形成栅极以形成垂直JFET。

公开(公告)号：US07911006B2

公开(公告)日：2011-03-22

申请号：US12610733

申请日：2009-11-02

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L29/78

CPC分类号： H01L29/66666 ,  H01L27/0629 ,  H01L27/10808 ,  H01L27/10852 ,  H01L27/10861 ,  H01L27/10873 ,  H01L27/10876 ,  H01L28/60 ,  H01L29/66181 ,  H01L29/945

摘要： A process and an architecture related to a vertical MOSFET device and a capacitor for use in integrated circuits. Generally, the integrated circuit structure includes a semiconductor layer with a major surface formed along a plane thereof and further including a first doped region formed in the surface. A second doped region of a different conductivity type than the first doped region is positioned over the first region. A third doped region of a different conductivity type than the second region is positioned over the second region. In one embodiment of the invention, a semiconductor device includes a first layer of semiconductor material and a first field-effect transistor having a first source/drain region formed in the first layer. A channel region of the transistor is formed over the first layer and an associated second source/drain region is formed over the channel region. The integrated circuit further includes a capacitor having a bottom plate, dielectric layer and a top capacitor plate. In an associated method of manufacture, a first device region, selected from the group consisting of the source region and a drain region of a field-effect transistor is formed on a semiconductor layer. A first field-effect transistor gate region is formed over the first device region. A capacitor comprising top and bottom layers with a dielectric layer disposed therebetween, is also formed on the semiconductor layer. In another embodiment, the capacitor layers are formed within a trench or window formed in the semiconductor layer.

摘要翻译： 与集成电路中使用的垂直MOSFET器件和电容器相关的工艺和架构。 通常，集成电路结构包括具有沿其平面形成的主表面的半导体层，并且还包括形成在表面中的第一掺杂区域。 与第一掺杂区域不同的导电类型的第二掺杂区域位于第一区域上方。 与第二区域不同的导电类型的第三掺杂区域位于第二区域上方。 在本发明的一个实施例中，半导体器件包括第一层半导体材料和第一场效应晶体管，其具有形成在第一层中的第一源/漏区。 在第一层上形成晶体管的沟道区，并且在沟道区上形成相关联的第二源极/漏极区。 集成电路还包括具有底板，电介质层和顶部电容器板的电容器。 在相关联的制造方法中，在半导体层上形成从由场效应晶体管的源极区域和漏极区域中选择的第一器件区域。 第一场效应晶体管栅极区域形成在第一器件区域上。 在半导体层上还形成有包括设置在其间的介电层的顶层和底层的电容器。 在另一个实施例中，电容器层形成在形成在半导体层中的沟槽或窗口内。

公开(公告)号：US20100044767A1

公开(公告)日：2010-02-25

申请号：US12610733

申请日：2009-11-02

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L27/108

CPC分类号： H01L29/66666 ,  H01L27/0629 ,  H01L27/10808 ,  H01L27/10852 ,  H01L27/10861 ,  H01L27/10873 ,  H01L27/10876 ,  H01L28/60 ,  H01L29/66181 ,  H01L29/945

摘要： A process and an architecture related to a vertical MOSFET device and a capacitor for use in integrated circuits. Generally, the integrated circuit structure includes a semiconductor layer with a major surface formed along a plane thereof and further including a first doped region formed in the surface. A second doped region of a different conductivity type than the first doped region is positioned over the first region. A third doped region of a different conductivity type than the second region is positioned over the second region. In one embodiment of the invention, a semiconductor device includes a first layer of semiconductor material and a first field-effect transistor having a first source/drain region formed in the first layer. A channel region of the transistor is formed over the first layer and an associated second source/drain region is formed over the channel region. The integrated circuit further includes a capacitor having a bottom plate, dielectric layer and a top capacitor plate. In an associated method of manufacture, a first device region, selected from the group consisting of the source region and a drain region of a field-effect transistor is formed on a semiconductor layer. A first field-effect transistor gate region is formed over the first device region. A capacitor comprising top and bottom layers with a dielectric layer disposed therebetween, is also formed on the semiconductor layer. In another embodiment, the capacitor layers are formed within a trench or window formed in the semiconductor layer.

摘要翻译： 与集成电路中使用的垂直MOSFET器件和电容器相关的工艺和架构。 通常，集成电路结构包括具有沿其平面形成的主表面的半导体层，并且还包括形成在表面中的第一掺杂区域。 与第一掺杂区域不同的导电类型的第二掺杂区域位于第一区域上方。 与第二区域不同的导电类型的第三掺杂区域位于第二区域上方。 在本发明的一个实施例中，半导体器件包括第一层半导体材料和第一场效应晶体管，其具有形成在第一层中的第一源/漏区。 在第一层上形成晶体管的沟道区，并且在沟道区上形成相关联的第二源极/漏极区。 集成电路还包括具有底板，电介质层和顶部电容器板的电容器。 在相关联的制造方法中，在半导体层上形成从由场效应晶体管的源极区域和漏极区域中选择的第一器件区域。 第一场效应晶体管栅极区域形成在第一器件区域上。 在半导体层上还形成有包括设置在其间的介电层的顶层和底层的电容器。 在另一个实施例中，电容器层形成在形成在半导体层中的沟槽或窗口内。

公开(公告)号：US07078280B2

公开(公告)日：2006-07-18

申请号：US10773900

申请日：2004-02-06

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  J. Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L21/00 ,  H01L21/84

CPC分类号： H01L29/42392 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/66666 ,  H01L29/7827 ,  H01L29/78642

摘要： An architecture for creating a vertical silicon-on-insulator MOSFET. Generally, an integrated circuit structure includes a semiconductor area with a major surface formed along a plane and a first source/drain contact region formed in the surface. A relatively thin single crystalline layer is oriented vertically above the major surface and comprises a first source/drain doped region over which is located a doped channel region, over which is located a second source/drain region. An insulating layer is disposed adjacent said first and said second source/drain regions and said channel region, serving as the insulating material of the SOI device. In another embodiment, insulating material is adjacent only said first and said second source/drain regions. A conductive region is adjacent the channel region for connecting the back side of the channel region to ground, for example, to prevent the channel region from floating.In an associated method of manufacturing the semiconductor device, a first source/drain region is formed in a relatively thin vertical layer of single crystalline material. A MOSFET gate region, including a channel and a gate electrode, is formed over the first source/drain region. A second source/drain region is then formed over the channel, the regions being appropriately doped to effect MOSFET action.

公开(公告)号：US06759730B2

公开(公告)日：2004-07-06

申请号：US09956382

申请日：2001-09-18

申请人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  Ross Thomson ,  Jack Qingsheng Zhao

发明人： Samir Chaudhry ,  Paul Arthur Layman ,  John Russell McMacken ,  Ross Thomson ,  Jack Qingsheng Zhao

IPC分类号： H01L27082

CPC分类号： H01L27/1203 ,  H01L21/82285 ,  H01L21/8249 ,  H01L21/84 ,  H01L29/66287 ,  H01L29/66666

摘要： A structure and a process for fabricating a bipolar junction transistor (BJT) that is compatible with the fabrication of a vertical MOSFET is disclosed. In the process, at least three layers of material are formed sequentially on a semiconductor substrate, where the substrate includes a buried collector region for the BJT and a source region for the MOSFET. After the at least three layers are formed on the substrate, two windows or trenches are formed in the layers. The first window terminates at the surface of the silicon substrate where the source region has been formed; the second window terminates at the buried collector region. Both windows are then filled with semiconductor material. For the BJT, the bottom portion of the window is filled with material of a conductivity type matching the conductivity of the buried collector, while the upper region of the semiconductor material is doped the opposite conductivity to form the BJT base. Subsequent processing forms the emitter overlying the base and a MOSFET drain overlying the channel formed within the window. The second layer of the three layers is sacrificial and is completely removed. Upon removal of the sacrificial layer, the channel is exposed and a dielectric layer is grown over the exposed channel region, followed by an overlying gate to complete formation of the BJT.

摘要翻译： 公开了一种用于制造与制造垂直MOSFET兼容的双极结型晶体管（BJT）的结构和工艺。 在此过程中，在半导体衬底上依次形成至少三层材料，其中衬底包括用于BJT的掩埋集电极区域和用于MOSFET的源极区域。 在衬底上形成至少三层之后，在层中形成两个窗口或沟槽。 第一窗口终止于已经形成源极区域的硅衬底的表面; 第二窗口终止于埋藏的收集器区域。 然后两个窗口都填充有半导体材料。 对于BJT，窗口的底部填充有与掩埋集电体的导电性相匹配的导电类型的材料，而半导体材料的上部区域掺杂相反的导电性以形成BJT基底。 随后的处理形成覆盖在基极上的发射极和覆盖在窗口内形成的沟道的MOSFET漏极。 三层的第二层是牺牲品并被完全去除。 在去除牺牲层时，暴露通道并且在暴露的沟道区域上生长电介质层，接着是上覆栅极以完成BJT的形成。