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公开(公告)号：US5456627A
公开(公告)日：1995-10-10
申请号：US148906
申请日：1993-12-20
申请人： Paul D. Jackson , Stephen C. Schultz , James E. Sanford , Glen Ong , Richard B. Rice , Parag S. Modi , John G. Baca
发明人： Paul D. Jackson , Stephen C. Schultz , James E. Sanford , Glen Ong , Richard B. Rice , Parag S. Modi , John G. Baca
IPC分类号： B24B49/18 , B24B53/007 , B24B53/017 , B24B53/02
CPC分类号： B24B53/017 , B24B49/18
摘要： An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to compensate for locations on the polishing pad surface having linear velocities that are directly related to their respective radii. A desired contact force is maintained between the end effector and the polishing pad surface.
摘要翻译： 轴向旋转的圆形抛光垫由旋转的末端执行器调节，旋转末端执行器具有与垫的抛光表面接触的磨盘。 末端执行器沿着抛光垫表面的半径以改变的速度移动，以补偿抛光垫表面上的具有与其相应半径直接相关的线速度的位置。 在末端执行器和抛光垫表面之间保持期望的接触力。
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公开(公告)号：US20080102732A1
公开(公告)日：2008-05-01
申请号：US11553572
申请日：2006-10-27
申请人： Brian Severson , John Stumpf , Stephen C. Schultz
发明人： Brian Severson , John Stumpf , Stephen C. Schultz
CPC分类号： B24B37/30
摘要： An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system comprises first and second annular ribs, each of which comprises a first end portion sealingly coupled to the carrier head housing, a second end portion coupled to the diaphragm, and a strain relief member substantially intermediate the first end portion and the second end portion. A plenum is substantially defined by the first and second annular ribs and the carrier head housing. The passage is fluidly coupled to the plenum to permit the pressurization of the plenum, and the strain relief member promotes the extension of the first and second annular ribs away from the carrier head housing when the plenum is pressurized.
摘要翻译： 一种用于展开在CMP载体头上的边缘控制系统，其包括具有延伸穿过其中的通道的囊和载体头壳体。 囊包括柔性隔膜并联接到承载头壳体。 边缘控制系统包括第一和第二环形肋，每个环形肋包括密封地联接到承载头壳体的第一端部部分，联接到隔膜的第二端部部分和基本上位于第一端部部分和第二端部部分之间的应变消除部件 端部。 充气室基本上由第一和第二环形肋和承载头壳体限定。 通道流体耦合到通风室以允许增压室的加压，并且当增压室被加压时，应变消除构件促使第一和第二环形肋远离承载头壳体延伸。
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公开(公告)号：US07140956B1
公开(公告)日：2006-11-28
申请号：US11324038
申请日：2005-12-29
IPC分类号： B24B20/00
CPC分类号： B24B37/30 , B24B41/061
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
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公开(公告)号：US06758939B2
公开(公告)日：2004-07-06
申请号：US09943699
申请日：2001-08-31
IPC分类号： B24B100
摘要： A laminated wear ring for a chemical mechanical planarization (CMP) apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing/planarization operation. The laminated wear ring includes a high stiffness stainless steel base and a plastic laminate. The high stiffness stainless steel base avoids flexing of the wear ring during polishing and thus provides control of the flexing of a polish pad against which the wafer surface is pressed. The plastic laminate protects the stainless steel base from attack by the polishing slurry and provides a buffer that protects the stainless steel base from mechanically damaging the wafer and vice versa.
摘要翻译： 用于化学机械平面化（CMP）装置的层压耐磨环提供了在抛光/平坦化操作期间对晶片边缘的材料的去除速率的改进的控制。 层压耐磨环包括高刚度不锈钢基座和塑料层压板。 高刚度不锈钢底座避免了抛光过程中磨损环的弯曲，从而提供了对晶片表面进行加压的抛光垫的弯曲的控制。 塑料层压板保护不锈钢基体免受抛光浆料的侵蚀，并提供缓冲液，保护不锈钢基体免受机械损伤晶片，反之亦然。
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公开(公告)号：US06390905B1
公开(公告)日：2002-05-21
申请号：US09540476
申请日：2000-03-31
IPC分类号： B24B2900
摘要： An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer. Zones that correspond to high regions receive greater pressure than zones that correspond to low regions on the wafer. The pressure on the barriers between zones may be optimized to prevent leakage between zones or to smooth the pressure distribution between neighboring zones on the back surface of the wafer.
摘要翻译： 公开了一种用于在载体中平坦化晶片的装置和方法，其具有可调节的压力区域和区域之间的可调节的屏障。 载体具有独立控制的中心区域和同心的周围区域，用于在晶片在化学机械抛光工具中被压靠在磨料表面上时分配晶片背面的压力。 可以通过将弹性腹板隔膜安装到具有多个凹部的托架壳体上来产生压力区域。 相应的多个弹性环形肋可以从腹板隔膜相对于凹部延伸。 因此，多个环形肋限定了由一个或多个同心周围区域包围的中心区域。 通过在平坦化过程中利用相应的流体连通路径可以单独加压区域和障碍物。一种用于实施本发明的方法开始于选择具有可调压力区域的载体，其对应于晶片上的凸起和凹槽的数量和位置 。 对应于高区域的区域比对应于晶片上的低区域的区域承受更大的压力。 可以优化区域之间的屏障上的压力，以防止区域之间的泄漏或者平滑晶片背表面上的相邻区域之间的压力分布。
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6.发明授权Carrier having pistons for distributing a pressing force on the back surface of a workpiece 失效载体具有用于在工件的后表面上分布按压力的活塞公开(公告)号：US06336853B1
公开(公告)日：2002-01-08
申请号：US09541414
申请日：2000-03-31
IPC分类号： B24B500
CPC分类号： B24B37/30
摘要： An apparatus and method are disclosed for a carrier that is able to create independently controllable pressure zones on the back surface of a wafer while the front surface of the wafer is being planarizing against an abrasive surface. The carrier has a central disk shaped recess surrounded by a plurality of concentric ring shaped recesses. The recesses are covered by a diaphragm thereby creating a central disk shaped plenum and a plurality of surrounding ring shaped plenums. A central disk shaped piston and a plurality of surrounding ring shaped pistons are suspended on the diaphragm so that a portion of each piston may move in and out of their corresponding plenum in the carrier. An independently controllable fluid communication path is placed in fluid communication with each plenum thereby allowing the pressure exerted on each piston to be independently controllable.
摘要翻译： 公开了一种用于载体的装置和方法，其能够在晶片的背面上创建独立可控的压力区，同时晶片的前表面正对着研磨表面进行平面化。 载体具有由多个同心环形凹部包围的中心盘状凹部。 凹槽由隔膜覆盖，从而形成中央盘形集气室和多个周围的环形气室。 中心圆盘形活塞和多个周围的环形活塞悬挂在隔膜上，使得每个活塞的一部分可以在载体中进出其相应的气室。 独立可控的流体连通路径被放置成与每个通风室流体连通，从而允许施加在每个活塞上的压力是独立可控的。
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公开(公告)号：US07335092B1
公开(公告)日：2008-02-26
申请号：US11553580
申请日：2006-10-27
申请人： Brian Severson , John Stumpf , Stephen C. Schultz
发明人： Brian Severson , John Stumpf , Stephen C. Schultz
IPC分类号： B24B7/22
CPC分类号： B24B37/30
摘要： A carrier head for supporting a workpiece is provided. The carrier head comprises a mount plate having an aperture therethrough, and a clamp ring having a foot portion and a first leg portion extending therefrom. The first leg portion extends through the aperture, and the foot portion abuts the mount plate proximate the aperture. A flexible bladder has first and second ribs that are received between the mount plate and the foot portion. An annular fastener is removably coupled to the leg portion, and engages the mount plate to cause the first and second ribs to be sealingly secured between the mount plate and the foot portion.
摘要翻译： 提供了用于支撑工件的承载头。 载体头包括具有穿过其中的孔的安装板，以及具有从其延伸的脚部和第一腿部的夹紧环。 第一腿部分延伸穿过孔，并且脚部靠近孔的邻接安装板。 柔性气囊具有容纳在安装板和脚部之间的第一和第二肋。 环形紧固件可拆卸地联接到腿部，并且与安装板接合，以使第一和第二肋条密封地固定在安装板和脚部之间。
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公开(公告)号：US06878039B2
公开(公告)日：2005-04-12
申请号：US10058743
申请日：2002-01-28
CPC分类号： B24B37/205 , B24B37/26
摘要： A polishing pad assembly for use in a chemical-mechanical polishing apparatus comprises a polishing pad having at least a first aperture therethrough and a platen for supporting the polishing pad having a second aperture therethrough at least a portion of which is larger than the first aperture. A substantially transparent plug includes at least a first section having a first dimension for positioning substantially within the first aperture and at least a second section having a second dimension larger than the first dimension for positioning substantially within the second aperture. The optical plug is made of a polymeric material which may be press-fit through the platen into polishing pad.
摘要翻译： 用于化学 - 机械抛光装置的抛光垫组件包括具有穿过其中的至少第一孔的抛光垫和用于支撑抛光垫的压板，其具有穿过其中的至少一部分大于第一孔的第二孔。 基本上透明的插头包括至少第一部分，其具有用于基本上位于第一孔内的第一尺寸，以及具有大于第一尺寸的第二尺寸的第二部分，用于基本上位于第二孔内。 光学插头由聚合物材料制成，其可以通过压板压配合到抛光垫中。
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公开(公告)号：US06659850B2
公开(公告)日：2003-12-09
申请号：US10120600
申请日：2002-04-11
IPC分类号： B24B2900
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
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公开(公告)号：US06184139B2
公开(公告)日：2001-02-06
申请号：US09153993
申请日：1998-09-17
IPC分类号： H01L21302
CPC分类号： B24B37/042 , B24B23/03 , Y10S977/888
摘要： A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.
摘要翻译： 一种用于通过化学机械抛光改善材料从半导体衬底的表面去除速率的均匀性的方法和装置。 根据本发明，半导体衬底经受包括轨道运动在内的抛光运动和从旋转，摆动，扫掠和线性抛光运动中选择的至少一个附加抛光运动的组合。 本发明还提供了一种用于调节抛光垫以提供更均匀调节并延长其使用寿命的改进方法。
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