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25 条记录 (耗时 0.021 秒)

    Method for switching data flow in a fiber distributed interface (FDDI) system
    1.
    发明授权
    Method for switching data flow in a fiber distributed interface (FDDI) system 失效
    用于在光纤分布式接口（FDDI）系统中切换数据流的方法

    公开(公告)号：US5539733A

    公开(公告)日：1996-07-23

    申请号：US445893

    申请日：1995-05-22

    申请人： Paul M. Anderson ,  Lloyd A. Hasley

    发明人： Paul M. Anderson ,  Lloyd A. Hasley

    IPC分类号： H04L12/42 ,  H04L12/433 ,  H04L12/52

    CPC分类号： H04L12/433 ,  H04L12/42 ,  Y10S370/906

    摘要： An integrated circuit for use in fiber distributed data interface (FDDI) system has four elastic layer and buffer management (ELM) circuits (12, 14, 16, and 18) coupled through a crossbar switch (20). The crossbar switch (20) allows any of the ELM circuits (12, 14, 16, and 18) to be coupled to any other ELM circuit (12, 14, 16, or 18) or to one of three external buses for FDDI communication. By using a crossbar switch and four ELM devices on a single integrated circuit, FDDI performance is improved while system design is made easier and more flexible than previously possible. Cipher circuitry (22, 24, 26, and 28) is used to scramble and descramble data ingoing and outcoming from the ELM devices. Concentrators, workstations, local area networks (LANs), and the like may incorporate the circuit (10) to improve performance and flexibility.

    摘要翻译： 用于光纤分布式数据接口（FDDI）系统的集成电路具有通过交叉开关（20）耦合的四个弹性层和缓冲管理（ELM）电路（12,14,16和18）。 交叉开关（20）允许任何ELM电路（12,14,16和18）耦合到任何其它ELM电路（12,14,16或18）或三个外部总线之一用于FDDI通信 。 通过在单个集成电路上使用交叉开关和四个ELM器件，FDDI性能得到改进，同时系统设计比以前更容易和更灵活。 加密电路（22,24,26和28）用于加扰和解扰来自ELM设备的数据输入和输出。 集中器，工作站，局域网（LAN）等可以并入电路（10）以提高性能和灵活性。

    Apparatus and method for encoding data in a fiber data distributed interface (FDDI)
    2.
    发明授权
    Apparatus and method for encoding data in a fiber data distributed interface (FDDI) 失效
    用于在光纤数据分布接口（FDDI）中编码数据的装置和方法

    公开(公告)号：US5655078A

    公开(公告)日：1997-08-05

    申请号：US315472

    申请日：1994-09-30

    申请人： Paul M. Anderson ,  Lloyd A. Hasley ,  Carol Jens

    发明人： Paul M. Anderson ,  Lloyd A. Hasley ,  Carol Jens

    IPC分类号： H04L25/48 ,  H04L25/49 ,  G06F11/00

    CPC分类号： H04L25/4925

    摘要： A fiber data distributed interface (FDDI) system uses an MLT3A encoding scheme in order to reduce DC bias or baseline wander. The MLT3A encoding scheme is a scheme wherein logical zeros are transmitted as ground voltages and logical ones are transmitted as one of either positive voltages or negative voltages depending upon past transmission history (FIG. 4 ) wherein the past history is recorded by a counter C or an analog circuit. MLT3A ensures that the baseline wander or DC bias returns to zero or is maintained as close to zero as possible in a timely manner so that no FDDI systems will fail from baseline wander.

    摘要翻译： 光纤数据分布接口（FDDI）系统使用MLT3A编码方案，以减少DC偏置或基线漂移。 MLT3A编码方案是一种方案，其中逻辑零作为接地电压发送，逻辑0作为正电压或负电压之一传输，这取决于过去的传输历史（图4），其中过去历史由计数器C或 一个模拟电路。 MLT3A确保基线漂移或直流偏差恢复到零，或者及时保持尽可能接近于零，以便FDDI系统不会从基线漂移失败。

    Local area network data processing system containing a quad elastic buffer and layer management (ELM) integrated circuit and method of switching
    3.
    发明授权
    Local area network data processing system containing a quad elastic buffer and layer management (ELM) integrated circuit and method of switching 失效
    局域网数据处理系统包含四通道弹性缓冲和层管理（ELM）集成电路和切换方式

    公开(公告)号：US5442628A

    公开(公告)日：1995-08-15

    申请号：US151676

    申请日：1993-11-15

    申请人： Paul M. Anderson ,  Lloyd A. Hasley

    发明人： Paul M. Anderson ,  Lloyd A. Hasley

    IPC分类号： H04L12/42 ,  H04L12/433 ,  H04L12/417

    CPC分类号： H04L12/433 ,  H04L12/42 ,  Y10S370/906

    摘要： An integrated circuit for use in fiber data distributed interface (FDDI) system has four elastic layer and buffer management (ELM) circuits (12, 14, 16, and 18) coupled through a crossbar switch (20). The crossbar switch (20) allows any of the ELM circuits (12, 14, 16, and 18) to be coupled to any other ELM circuit (12, 14, 16, or 18) or to one of three external buses for FDDI communication. By using a crossbar switch and four ELM devices on a single integrated circuit, FDDI performance is improved while system design is made easier and more flexible than previously possible. Cipher circuitry (22, 24, 26, and 28) is used to scramble and descramble data ingoing and outcoming from the ELM devices. Concentrators, workstations, local area networks (LANs), and the like may incorporate the circuit (10) to improve performance and flexibility.

    摘要翻译： 用于光纤数据分布接口（FDDI）系统的集成电路具有通过交叉开关（20）耦合的四个弹性层和缓冲管理（ELM）电路（12,14,16和18）。 交叉开关（20）允许任何ELM电路（12,14,16和18）耦合到任何其它ELM电路（12,14,16或18）或三个外部总线之一用于FDDI通信 。 通过在单个集成电路上使用交叉开关和四个ELM器件，FDDI性能得到改进，同时系统设计比以前更容易和更灵活。 加密电路（22,24,26和28）用于加扰和解扰来自ELM设备的数据输入和输出。 集中器，工作站，局域网（LAN）等可以并入电路（10）以提高性能和灵活性。

    High frequency microelectronics package
    7.
    发明授权
    High frequency microelectronics package 有权
    高频微电子封装

    公开(公告)号：US06172412B2

    公开(公告)日：2001-01-09

    申请号：US09220133

    申请日：1998-12-23

    申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    IPC分类号： H01L2940

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面

    High frequency microelectronics package
    10.
    发明授权
    High frequency microelectronics package 失效
    高频微电子封装

    公开(公告)号：US5736783A

    公开(公告)日：1998-04-07

    申请号：US645848

    申请日：1996-05-14

    申请人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    发明人： Deborah S. Wein ,  Paul M. Anderson ,  Alan W. Lindner ,  Martin Goetz ,  Joseph Babiarz ,  Timothy Going

    IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/66 ,  H01L23/52

    CPC分类号： H01L21/67121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/3011

    摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.

    摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面