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9 条记录 (耗时 0.018 秒)

    Method and apparatus for conditioning fixed-abrasive polishing pads
    1.
    发明授权
    Method and apparatus for conditioning fixed-abrasive polishing pads 失效
    用于调节固定研磨抛光垫的方法和设备

    公开(公告)号：US06752698B1

    公开(公告)日：2004-06-22

    申请号：US10100740

    申请日：2002-03-19

    申请人： Peter Renteln ,  Alan J. Jensen ,  David S. Lamb

    发明人： Peter Renteln ,  Alan J. Jensen ,  David S. Lamb

    IPC分类号： B24B100

    CPC分类号： B24B53/017 ,  B24B21/10 ,  B24B37/245

    摘要： A method and apparatus for conditioning a fixed-abrasive polishing pad used in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a conditioning member having a smooth surface. The method includes providing a conditioning member having a smooth surface, pressing the conditioning member against the fixed-abrasive polishing pad, and moving the fixed-abrasive polishing pad. In one embodiment, the method further comprises moving the conditioning member perpendicular to the direction of movement of the fixed-abrasive pad to compensate for variations in amounts of exposed abrasive on the fixed-abrasive pad.

    摘要翻译： 描述了用于调节用于半导体晶片的化学机械平面化的固定研磨抛光垫的方法和装置。 该装置包括具有平滑表面的调节构件。 该方法包括提供具有光滑表面的调节构件，将调节构件压靠固定研磨抛光垫，以及移动固定研磨抛光垫。 在一个实施例中，该方法还包括使调节构件垂直于固定研磨垫的移动方向移动，以补偿固定研磨垫上暴露的研磨剂的量的变化。

    Method and apparatus for conditioning a polishing pad with sonic energy
    4.
    发明授权
    Method and apparatus for conditioning a polishing pad with sonic energy 失效
    用声波能量调理抛光垫的方法和装置

    公开(公告)号：US06875091B2

    公开(公告)日：2005-04-05

    申请号：US09796955

    申请日：2001-02-28

    申请人： Allan M. Radman ,  Alan J. Jensen ,  Helmuth Treichel ,  Robert G. Boehm ,  Michael S. Lacy ,  Eric A. Dunton

    发明人： Allan M. Radman ,  Alan J. Jensen ,  Helmuth Treichel ,  Robert G. Boehm ,  Michael S. Lacy ,  Eric A. Dunton

    IPC分类号： B24B1/04 ,  B24B37/04 ,  B24B53/007 ,  B24B53/10 ,  B24B53/07

    CPC分类号： B24B1/04 ,  B24B53/017 ,  B24B53/10

    摘要： A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.

    摘要翻译： 描述了一种用于调整抛光垫的方法和装置，其中抛光垫具有用于抛光半导体晶片的抛光表面。 该方法包括将抛光垫的抛光表面上方的声能量发生器定位，并将抛光垫的抛光表面施加声能。 所述设备适于定位在所述抛光表面上方，所述声能发生器包括换能器和与所述换能器流动连通的液体载体，其中所述换能器将声能传递到所述液体载体中，并且所述液体载体被施加 到抛光带的抛光表面。

    Chemical mechanical planarization or polishing pad with sections having varied groove patterns
    5.
    发明授权
    Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效

    公开(公告)号：US06585579B2

    公开(公告)日：2003-07-01

    申请号：US09905332

    申请日：2001-07-13

    申请人： Alan J. Jensen ,  Brian S. Thornton

    发明人： Alan J. Jensen ,  Brian S. Thornton

    IPC分类号： B24D1100

    CPC分类号： B24B37/26 ,  B24B21/04 ,  B24D11/001 ,  B24D11/04

    摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

    Chemical mechanical planarization or polishing pad with sections having varied groove patterns
    6.
    发明授权
    Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效

    公开(公告)号：US06261168B1

    公开(公告)日：2001-07-17

    申请号：US09316166

    申请日：1999-05-21

    申请人： Alan J. Jensen ,  Brian S. Thornton

    发明人： Alan J. Jensen ,  Brian S. Thornton

    IPC分类号： B24D1100

    CPC分类号： B24B37/26 ,  B24B21/04 ,  B24D11/001 ,  B24D11/04

    摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

    Chemical mechanical planarization or polishing pad with sections having varied groove patterns
    7.
    发明授权
    Chemical mechanical planarization or polishing pad with sections having varied groove patterns 失效

    公开(公告)号：US06634936B2

    公开(公告)日：2003-10-21

    申请号：US09870212

    申请日：2001-05-30

    申请人： Alan J. Jensen ,  Brian S. Thornton

    发明人： Alan J. Jensen ,  Brian S. Thornton

    IPC分类号： B24B2100

    CPC分类号： B24B37/26 ,  B24B21/04 ,  B24D11/001 ,  B24D11/04

    摘要： A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.

    Roller with treading and system including the same
    9.
    发明授权
    Roller with treading and system including the same 失效
    滚轮与踩踏和系统包括相同

    公开(公告)号：US5862560A

    公开(公告)日：1999-01-26

    申请号：US705337

    申请日：1996-08-29

    申请人： Alan J. Jensen ,  Norman A. Mertke ,  William Dyson, Jr. ,  Lynn Ryle ,  Patrick Paino

    发明人： Alan J. Jensen ,  Norman A. Mertke ,  William Dyson, Jr. ,  Lynn Ryle ,  Patrick Paino

    IPC分类号： B08B3/00 ,  B08B1/04 ,  B08B11/02 ,  H01L21/00 ,  H01L21/304 ,  B08B3/02 ,  B08B11/00

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  B08B11/02 ,  Y10S134/902

    摘要： A method and apparatus for rotating wafers in a double sided scrubber where a rotating roller imparts rotary motion to a semiconductor wafer during a double sided cleaning process. The rotating roller and wafer contact at their outer edges and the friction between their outer edges causes the wafer to rotate. The roller has an outer edge with a groove in which the wafer edge is pinched. Treads or grooves extending from the groove channel liquids away from the groove to prevent wafer slippage when rotating and cleaning solutions are applied to the wafer.

    摘要翻译： 一种用于在双面清洗器中旋转晶片的方法和装置，其中在双面清洁过程中旋转辊向半导体晶片施加旋转运动。 在其外边缘处的旋转辊和晶片接触以及它们的外边缘之间的摩擦导致晶片旋转。 该辊子具有外边缘，该外缘具有凹槽，晶片边缘被夹在该凹槽中。 从凹槽沟槽液体离开凹槽延伸的胎面或沟槽，以防止在旋转时晶片滑动，并将清洁溶液施加到晶片上。