Abstract:
A semiconductor array includes a matrix of cells, the matrix being arranged in rows and columns of cells, and a plurality of control lines. Each cell is coupled to a number of control lines allowing to select and read/write said cell. At least one of said control lines is coupled to cells of a plurality of columns and of at least two rows of the matrix.
Abstract:
A semiconductor array includes a matrix of cells, the matrix being arranged in rows and columns of cells, and a plurality of control lines. Each cell is coupled to a number of control lines allowing to select and read/write said cell. At least one of said control lines is coupled to cells of a plurality of columns and of at least two rows of the matrix.
Abstract:
Methodology enabling a reduction of edge and strap cell size, and the resulting device are disclosed. Embodiments include: providing first and second NW regions on a substrate; providing first and second RX regions on the first and second NW regions, respectively; providing a contact on the substrate connecting the first and second RX regions; and providing a dummy PC on the substrate connecting the first and second RX regions. Other embodiments include: determining an RX region of an IC design; determining a PPLUS mask region extending along a horizontal direction and being on an entire upper surface of the RX region; determining a NW region extending along a vertical direction and separated from the RX region; and comparing an area of an overlap of the NW region and PPLUS mask region to a threshold value.
Abstract:
A dynamic random access memory integrated element includes a transistor and a region for the storage of electrical charges. The surface area of an electrical junction between a source region of the transistor and the storage region is smaller than the surface area of an electrical junction between a drain region of the transistor and the storage region. Such a memory element can be fabricated from a standard substrate using SOI technology or from a bulk silicon substrate, and a bit stored in the element can be erased with reduced power consumption.
Abstract:
A dual port SRAM has two data storage nodes, a true data and complementary data. A first pull down transistor has an active are that forms the drain region of the first transistor and the true data storage node that is physically isolated from all other transistor active areas of the memory cell. A second pull down transistor has an active area that form the drain region of a second transistor that is the complementary data node that is physically isolated from all other transistor active areas of the memory cell.
Abstract:
A dual port static random access memory cell has pull-down transistors, pull-up transistors, and pass transistors. A first active region has a first pull-down transistor coupled to a true data node, a second pull-down transistor coupled to a complementary data node; a first pass transistor coupled to the true data node, and a second pass transistor coupled to the complementary data node. A second active region has the same size and shape as the first active region and has a third pull-down transistor coupled in parallel to the first-pull down transistor, a fourth pull-down transistor coupled in parallel to the second pull-down transistor; a third pass transistor coupled to the true data node, and a fourth pass transistor coupled to the complementary data node. A first pull-up transistor and a second pull-up transistor are located between the first and second active regions.
Abstract:
A dynamic random access memory (DRAM) including memory cells distributed in rows and in columns, each memory cell comprising a MOS transistor with a floating body, the memory comprising circuitry for writing a datum into a determined (i.e. selected) memory cell belonging to a determined (i.e. selected) row and to a determined (i.e. selected) column, wherein the write circuitry comprises circuitry capable of bringing the drains of the memory cells of the determined column to a voltage V1; circuitry capable of bringing the sources of the memory cells of the determined row to a voltage V2; and circuitry capable of bringing the drains of the memory cells of the columns other than the determined column and the sources of the memory cells of the rows other than the determined row to a voltage V3, voltages V1, V2, and V3 being such that |V1−V2|>|V3−V2| and (V1−V2)×(V3−V2)>0.
Abstract:
A dual port SRAM has two data storage nodes, a true data and complementary data. A first pull down transistor has an active area that forms the drain region of the first transistor and the true data storage node that is physically isolated from all other transistor active areas of the memory cell. A second pull down transistor has an active area that forms the drain region of a second transistor that is the complementary data node that is physically isolated from all other transistor active areas of the memory cell.
Abstract:
Methodology enabling a reduction of edge and strap cell size, and the resulting device are disclosed. Embodiments include: providing first and second NW regions on a substrate; providing first and second RX regions on the first and second NW regions, respectively; providing a contact on the substrate connecting the first and second RX regions; and providing a dummy PC on the substrate connecting the first and second RX regions. Other embodiments include: determining an RX region of an IC design; determining a PPLUS mask region extending along a horizontal direction and being on an entire upper surface of the RX region; determining a NW region extending along a vertical direction and separated from the RX region; and comparing an area of an overlap of the NW region and PPLUS mask region to a threshold value.
Abstract:
A dynamic random access memory (DRAM) comprising memory cells distributed in rows and in columns, each memory cell comprising a MOS transistor with a floating body, the memory comprising circuitry for writing a datum into a determined (i.e. selected) memory cell belonging to a determined (i.e. selected) row and to a determined (i.e. selected) column, wherein the write circuitry comprises circuitry capable of bringing the drains of the memory cells of the determined column to a voltage V1; circuitry capable of bringing the sources of the memory cells of the determined row to a voltage V2; and circuitry capable of bringing the drains of the memory cells of the columns other than the determined column and the sources of the memory cells of the rows other than the determined row to a voltage V3, voltages V1, V2, and V3 being such that |V1−V2|>|V3−V2| and (V1−V2)×(V3−V2)>0.