Abstract:
A flexible chuck for supporting a substrate during lithographic processing is described. This flexible chuck includes an electrode layer, a piezoelectric layer disposed on the electrode layer, and a substrate support layer disposed above the piezoelectric layer. By providing electrical signals to the piezoelectric layer through the electrode layer, the support layer can be flexed, thereby changing surface topography on a substrate disposed on the flexible chuck. The contact layer can include projections, each of the projections corresponding to a respective electrode within the electrode layer. Furthermore, the substrate support layer can be formed of a conductive material and thus serve as the ground layer. Alternatively, separate substrate support and ground layers can be provided. The flexible chuck in accordance with the instant invention can be a vacuum chuck. Also described is a method of monitoring topographic changes in a flexible chuck in accordance with the instant invention.
Abstract:
A method and apparatus for maintaining a purged optical gap between a pellicle and a reticle in a photolithography system. A frame between a reticle and a pellicle maintains the purged optical gap. The frame defines first and second opposing surfaces. The first opposing surface defines a first opening, and is configured to mate with the pellicle. The second opposing surface defines a second opening, and is configured to mate with the reticle to enclose the optical gap between the pellicle and the reticle. At least one edge of the frame has an opening therethrough. A porous sintered material fills each opening through an edge of the frame.
Abstract:
A substrate protection and transport system and method for transitioning a substrate from atmospheric pressure to vacuum in a lithography tool. The system includes one or more removable substrate transport cassettes that support a substrate. The cassette can include a base portion and top portion, and can include a seal. Each cassette has at least one vent and at least one filter. The system further includes a box having a base and lid. The box holds one or more cassette-substrate arrangements. A storage rack having shelves for holding the box-cassette-substrate arrangement is also provided. Further, an entry-exit module having a loadlock is provided for transitioning the cassette-substrate arrangement from atmospheric pressure to vacuum. The entry-exit module can include a shuttle and/or elevator for transporting the cassette-substrate arrangement. During transitioning, the filter(s) and vent(s) restrict particles within the loadlock from entering the cassette-substrate arrangement and reaching a surface of the substrate.
Abstract:
A method and apparatus for maintaining a purged optical gap between a pellicle and a reticle in a photolithography system. A frame between a reticle and a pellicle maintains the purged optical gap. The frame defines first and second opposing surfaces. The first opposing surface defines a first opening, and is configured to mate with the pellicle. The second opposing surface defines a second opening, and is configured to mate with the reticle to enclose the optical gap between the pellicle and the reticle. At least one edge of the frame has an opening therethrough. A porous sintered material fills each opening through an edge of the frame.
Abstract:
A method and apparatus for maintaining an optical gap between optical structures in a photolithography system is described. A frame defines first and second opposing surfaces. The first opposing surface defines a first opening and the second opposing surface defines a second opening. A plurality of spacing members are spaced apart on the first opposing surface around the first opening. The spacing members have substantially co-planar surfaces configured to mate with a surface of a first optical structure. A bonding agent seals a space around the first opening between the first opposing surface and the first optical structure. The frame thereby encloses the optical gap between the first optical structure and a second optical structure.
Abstract:
A method and apparatus for maintaining an optical gap between optical structures in a photolithography system is described. A frame defines first and second opposing surfaces. The first opposing surface defines a first opening and the second opposing surface defines a second opening. A plurality of spacing members are spaced apart on the first opposing surface around the first opening. The spacing members have substantially co-planar surfaces configured to mate with a surface of a first optical structure. A bonding agent seals a space around the first opening between the first opposing surface and the first optical structure. The frame thereby encloses the optical gap between the first optical structure and a second optical structure.
Abstract:
A method and apparatus for maintaining an optical gap between optical structures in a photolithography system is described. A frame defines first and second opposing surfaces. The first opposing surface defines a first opening and the second opposing surface defines a second opening. A plurality of spacing members are spaced apart on the first opposing surface around the first opening. The spacing members have substantially co-planar surfaces configured to mate with a surface of a first optical structure. A bonding agent seals a space around the first opening between the first opposing surface and the first optical structure. The frame thereby encloses the optical gap between the first optical structure and a second optical structure.
Abstract:
A method and apparatus for maintaining an optical gap between optical structures in a photolithography system is described. A frame defines first and second opposing surfaces. The first opposing surface defines a first opening and the second opposing surface defines a second opening. A plurality of spacing members are spaced apart on the first opposing surface around the first opening. The spacing members have substantially co-planar surfaces configured to mate with a surface of a first optical structure. A bonding agent seals a space around the first opening between the first opposing surface and the first optical structure. The frame thereby encloses the optical gap between the first optical structure and a second optical structure.
Abstract:
The present invention relates to a lithography apparatus using catadioptric exposure optics that projects high quality images without image flip. The lithography apparatus includes a reticle stage, a wafer stage, and a catadioptric exposure optics located between the reticle stage and the wafer stage. The catadioptric exposure optics projects an image from the reticle stage onto the wafer stage. The projected image has the same image orientation as the image from the reticle stage. In other words, the catadioptric exposure optics does not perform image flip. The reticle stage lies on a first plane and the wafer stage lies on a second plane, where the first plane is orthogonal to the second plane. In another embodiment of the present invention, the catadioptric exposure optics projects an even number of reflections. The projected image is of high precision and lacks aberrations such as perspective warping and obscured areas. The invention can be combined with a dual wafer stage and with a dual isolation system.
Abstract:
A method and apparatus for maintaining an optical gap between optical structures in a photolithography system is described. A frame defines first and second opposing surfaces. The first opposing surface defines a first opening and the second opposing surface defines a second opening. A plurality of spacing members are spaced apart on the first opposing surface around the first opening. The spacing members have substantially co-planar surfaces configured to mate with a surface of a first optical structure. A bonding agent seals a space around the first opening between the first opposing surface and the first optical structure. The frame thereby encloses the optical gap between the first optical structure and a second optical structure.