公开(公告)号：US10159165B2

公开(公告)日：2018-12-18

申请号：US15423474

申请日：2017-02-02

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Ali Akbar Merrikh ,  Melika Roshandell

IPC: H05K7/20 ,  H01L23/427 ,  G06F1/20 ,  H01L23/473 ,  H05K1/02

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

公开(公告)号：US10358230B2

公开(公告)日：2019-07-23

申请号：US15263267

申请日：2016-09-12

Applicant: QUALCOMM Incorporated

Inventor： Vivek Sahu ,  Mehdi Saeidi ,  Rajat Mittal ,  Melika Roshandell

IPC: B64D33/08 ,  B64C39/02 ,  B64D27/24

Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

公开(公告)号：US10007310B2

公开(公告)日：2018-06-26

申请号：US15205678

申请日：2016-07-08

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Melika Roshandell ,  Rajat Mittal

IPC: G06F1/00 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F1/3287 ,  G06F1/3296 ,  Y02D10/172

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

公开(公告)号：US20170083063A1

公开(公告)日：2017-03-23

申请号：US14860127

申请日：2015-09-21

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Melika Roshandell ,  Arpit Mittal ,  Farsheed Mahmoudi

IPC: G06F1/20 ,  G01K7/22

CPC classification number: G06F1/206 ,  G01K7/22 ,  Y02D10/16

Abstract: A method includes: receiving an electrical signal from a temperature sensor, wherein the temperature sensor is disposed within a package including a processor chip, further wherein the temperature sensor is thermally separated from the processor chip by materials within the package, generating temperature information from the electrical signal, processing the temperature information to determine that a performance of the processor chip should be mitigate, and mitigating the performance of the processor chip in response to the temperature information, wherein processing the temperature information and mitigating the performance of the processor are performed by the processor chip.

公开(公告)号：US10591531B2

公开(公告)日：2020-03-17

申请号：US15177964

申请日：2016-06-09

Applicant: QUALCOMM Incorporated

Inventor： Rajit Chandra ,  Melika Roshandell ,  Niladri Mojumder

IPC: G01R31/28

Abstract: An apparatus is disclosed. The apparatus includes a circuit, a conductor interconnecting a portion of the circuit, and a processor configured to determine a temperature of the conductor and adjust at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The at least one parameter includes a lifetime estimate for the conductor. A method of operating an apparatus including a circuit and a conductor interconnecting a portion of the circuit is disclosed. The method includes determining a temperature of the conductor, and adjusting at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The parameter includes a lifetime estimate for the conductor.

公开(公告)号：US20180011520A1

公开(公告)日：2018-01-11

申请号：US15205678

申请日：2016-07-08

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Melika Roshandell ,  Rajat Mittal

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G01R31/00 ,  G06F1/203 ,  G06F1/3287 ,  G06F1/3296

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

公开(公告)号：US09829941B1

公开(公告)日：2017-11-28

申请号：US15242483

申请日：2016-08-19

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Melika Roshandell ,  Rajat Mittal ,  Ryan Coutts

IPC: H04M1/00 ,  G06F1/20 ,  H04M1/02

CPC classification number: G06F1/206 ,  H04M1/0202 ,  H04M2250/12

Abstract: A mobile device includes an exterior housing, a display, a capacitive sensor, a temperature sensor, and a controller. The capacitive sensor is coupled to the exterior housing at a backside of the mobile device and the temperature sensor is coupled to one or more components of the mobile device. The controller is coupled to the capacitive sensor and to the temperature sensor. The controller is configured to adjust a temperature threshold of the mobile device in response to detecting the presence of a case installed on the exterior housing. The controller is also configured to adjust one or more operating parameters of the mobile device to control a temperature of the exterior housing to below the temperature threshold based on the output of the capacitive sensor and one or more readings of the temperature sensor.

公开(公告)号：US20170281010A1

公开(公告)日：2017-10-05

申请号：US15456779

申请日：2017-03-13

Applicant: QUALCOMM INCORPORATED

Inventor： Mehdi Saeidi ,  Rajat Mittal ,  Melika Roshandell

IPC: A61B5/01 ,  G06F1/20 ,  G06F1/32

CPC classification number: A61B5/01 ,  G06F1/203 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/3287 ,  G06F1/3296 ,  Y02D10/16

Abstract: A method includes: acquiring temperature values from a plurality of temperature sensors spatially distributed within a device; using the temperature values, calculating skin temperature values corresponding to each of the temperature sensors; comparing the skin temperature values to a first temperature threshold; in response to determining that at least one of the skin temperature values exceeds the first temperature threshold, measuring temperature over time; comparing the temperature over time to a second temperature threshold; and in response to determining that the temperature over time exceeds the second temperature threshold, reducing power consumption of the device.