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公开(公告)号：US10591965B2
公开(公告)日：2020-03-17
申请号：US15411868
申请日：2017-01-20
发明人： Palkesh Jain , Ronald Alton , Jon Anderson , Mehdi Saeidi
IPC分类号： G06F1/20 , G06F9/48 , G06F1/3206
摘要： Various embodiments of methods and systems context-aware thermal management in a portable computing device (“PCD”) are disclosed. Notably, the environmental context to which a PCD is subjected may have significant impact on the PCD's thermal energy dissipation efficiency. Embodiments of the solution seek to leverage knowledge of a PCD's environmental context to modify or adjust thermal policy parameters applied within a PCD in response to a thermal event within the PCD.
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2.发明申请公开(公告)号：US20180143853A1
公开(公告)日：2018-05-24
申请号：US15398864
申请日：2017-01-05
发明人： Mehdi Saeidi , Niladri Mojumder , Min Chen , Rajat Mittal , Rajit Chandra
CPC分类号： G06F9/44505 , G06F9/5027 , G06F9/5061
摘要： A system includes a computer processor including N cores; and a plurality of device aging sensors, wherein each one of the plurality of device aging sensors is disposed within a respective core, the plurality of device aging sensors being configured to communicate core aging information with a core scheduler in the computer processor, wherein the core scheduler is configured to make a first set of M cores available to a thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a first time period in which the core aging information indicates that aging of the first set of M cores is below a threshold, and wherein the core scheduler is configured to make a second set of M cores available to the thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a second time period.
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公开(公告)号：US09629233B2
公开(公告)日：2017-04-18
申请号：US14732787
申请日：2015-06-08
发明人： Mehdi Saeidi , Arpit Mittal , Emil Rahim , Rajat Mittal , Kambiz Samadi
IPC分类号： H05K7/20 , H05K1/02 , G05B15/02 , H01L23/473
CPC分类号： H05K1/0203 , G05B15/02 , H05K1/0209 , H05K1/0272 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K2201/064
摘要： Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.
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公开(公告)号：US20160062422A1
公开(公告)日：2016-03-03
申请号：US14836572
申请日：2015-08-26
发明人： Rajat Mittal , Mehdi Saeidi
CPC分类号： G06F1/206 , G06F1/3234 , G06F1/324 , G06F1/3296 , H03K19/0008 , Y02D10/126 , Y02D10/16 , Y02D10/172
摘要： A performance setting technique is disclosed for a clocked circuit such as a processor in an integrated circuit. The technique determines a maximum power consumption for the clocked circuit as a function of a total thermal resistance of a mobile device incorporating the integrated circuit. The total thermal resistance is a sum of a system thermal resistance for the mobile device and a device thermal resistance for the integrated circuit.
摘要翻译： 针对诸如集成电路中的处理器的时钟控制电路公开了一种性能设置技术。 该技术确定了时钟控制电路的最大功耗作为结合集成电路的移动设备的总热阻的函数。 总热阻是移动设备的系统热阻和集成电路的器件热阻之和。
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公开(公告)号：US10393594B2
公开(公告)日：2019-08-27
申请号：US15675604
申请日：2017-08-11
摘要： A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.
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公开(公告)号：US10358230B2
公开(公告)日：2019-07-23
申请号：US15263267
申请日：2016-09-12
发明人： Vivek Sahu , Mehdi Saeidi , Rajat Mittal , Melika Roshandell
摘要： A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.
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公开(公告)号：US20180073933A1
公开(公告)日：2018-03-15
申请号：US15263101
申请日：2016-09-12
发明人： Mustafa Keskin , Masoud Roham , Mehdi Saeidi , Amy Derbyshire , Robert Gilmore , Lew Chua-Eoan
CPC分类号： G01K1/026 , G01K1/14 , G05D23/1917 , G06F1/206 , G06F12/1009 , G06F2212/1016 , Y02D10/16
摘要： In certain aspects, a method for temperature monitoring comprises receiving temperature readings from a plurality of temperature sensors on a chip, and determining an average or a sum of the temperature readings from the temperature sensors. The sum may be a weighted sum of the temperature readings. The method also comprises computing a temperature at a location on the chip based on the average or sum of the temperature readings. The location may be located at approximately a centroid of the locations of the temperature sensors, an estimated hotspot location on the chip, or another location on the chip.
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公开(公告)号：US09625963B2
公开(公告)日：2017-04-18
申请号：US14836572
申请日：2015-08-26
发明人： Rajat Mittal , Mehdi Saeidi
CPC分类号： G06F1/206 , G06F1/3234 , G06F1/324 , G06F1/3296 , H03K19/0008 , Y02D10/126 , Y02D10/16 , Y02D10/172
摘要： A performance setting technique is disclosed for a clocked circuit such as a processor in an integrated circuit. The technique determines a maximum power consumption for the clocked circuit as a function of a total thermal resistance of a mobile device incorporating the integrated circuit. The total thermal resistance is a sum of a system thermal resistance for the mobile device and a device thermal resistance for the integrated circuit.
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9.发明申请PACKAGE-ON-PACKAGE (POP) DEVICE COMPRISING BI-DIRECTIONAL THERMAL ELECTRIC COOLER 有权封装包装（POP）装置，包含双向热电冷却器公开(公告)号：US20160334845A1
公开(公告)日：2016-11-17
申请号：US14709276
申请日：2015-05-11
发明人： Rajat Mittal , Hee Jun Park , Peng Wang , Mehdi Saeidi , Arpit Mittal
CPC分类号： G06F1/206 , G01K7/04 , G05D23/1906 , H01L23/34 , H01L23/3677 , H01L23/38 , H01L23/49811 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1094 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.
摘要翻译： 封装封装（PoP）器件包括第一封装，第二封装和双向热电冷却器（TEC）。 第一封装包括第一基板和耦合到第一基板的第一管芯。 第二个包装耦合到第一个包装。 第二包装包括第二基板和耦合到第二基板的第二管芯。 TEC位于第一模具和第二基板之间。 TEC适于在第一包装和第二包装之间动态地散发热量。 TEC适于在第一时间段内将热量从第一管芯散热到第二管芯。 TEC进一步适于在第二时间段内将热量从第二管芯传送到第一管芯。 TEC适于通过第二衬底将热量从第一裸片散发到第二裸片。
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公开(公告)号：US10401235B2
公开(公告)日：2019-09-03
申请号：US14852350
申请日：2015-09-11
IPC分类号： G01K13/00 , G05B15/02 , G06F1/04 , G06F1/3206 , G06F11/30 , G06F1/20 , G06F1/324 , G06F1/3296
摘要： In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.
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