公开(公告)号：US20140167273A1

公开(公告)日：2014-06-19

申请号：US13719984

申请日：2012-12-19

Applicant: QUALCOMM INCORPORATED

Inventor： Jonghae Kim ,  Chengjie Zuo ,  Changhan Yun ,  Mario Francisco Velez ,  Ravindra V. Shenoy ,  Matthew M. Nowak ,  Francesco Carobolante ,  Kyu-Pyung Hwang ,  Dong Wook Kim ,  Young K. Song

IPC: H01L23/482 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/1517 ,  H01L2924/181 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10015 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: One feature pertains to a multi-layer package substrate of an integrated circuit package that comprises a discrete circuit component (DCC) having at least one electrode. The DCC is embedded within an insulator layer, and a via coupling component electrically couples to the electrode. A first portion of the via coupling component extends beyond a first edge of the electrode, and a plurality of vias each having a first end couple to the first via coupling component. At least a first via of the plurality of vias couples to the first portion of the via coupling component that extends beyond the first edge of the electrode. Moreover, the plurality of vias each have a second end that electrically couple to a first outer metal layer, and at least a second portion of the via coupling component is positioned within a first inner metal layer.

Abstract translation: 一个特征涉及集成电路封装的多层封装衬底，其包括具有至少一个电极的分立电路部件（DCC）。 DCC嵌入在绝缘体层内，并且通孔耦合部件电耦合到电极。 通孔耦合部件的第一部分延伸超过电极的第一边缘，并且多个通孔各自具有耦合到第一通路耦合部件的第一端。 多个通孔中的至少第一通孔耦合到延伸超出电极的第一边缘的通孔连接部件的第一部分。 此外，多个通孔各自具有电耦合到第一外部金属层的第二端，并且通孔连接部件的至少第二部分位于第一内部金属层内。