Memory with reduced capacitance at a sense amplifier

    公开(公告)号:US11854609B2

    公开(公告)日:2023-12-26

    申请号:US17446195

    申请日:2021-08-27

    CPC classification number: G11C11/419

    Abstract: A memory is provided that includes multiple memory banks, each one of the memory banks being associated with a read multiplexer. A first read multiplexer couples a first plurality of bit lines to a first sense node pair, and a second read multiplexer couples a second plurality of bit lines to a second sense node pair. A first sense amplifier is coupled to the first sense node pair. The second sense node pair may be coupled to the same sense amplifier or a different sense amplifier.

    Read tracking scheme for a memory device

    公开(公告)号:US10796735B1

    公开(公告)日:2020-10-06

    申请号:US16459320

    申请日:2019-07-01

    Abstract: In certain aspects, a memory device includes memory bit cells coupled to a read bit line, and a first sense amplifier having a first input coupled to the read bit line, and a first output. The memory device also includes a latch amplifier having a first input coupled to the first output of the first sense amplifier, an enable input, and an output. The memory device also includes one or more dummy bit cells coupled to a dummy bit line, and a second sense amplifier having a first input coupled to the dummy bit line, and an output. The memory device further includes a trigger circuit having an input coupled to the output of the second sense amplifier, and an output coupled to the enable input of the latch amplifier.

    Differential spin orbit torque magnetic random access memory (SOT-MRAM) cell structure and array

    公开(公告)号:US10483457B1

    公开(公告)日:2019-11-19

    申请号:US16102941

    申请日:2018-08-14

    Abstract: Aspects of the disclosure provide magnetoresistive random access memory (MRAM) and methods. The MRAM generally includes a first magnetic tunnel junction (MTJ) storage element comprising a first fixed layer, a first insulating layer, and a first free layer, and a second MTJ storage element comprising a second fixed layer, a second insulating layer, and a second free layer. The MRAM further includes a conductive layer connected to a source line, first bit line, and a second bit line, wherein the first MTJ storage element is disposed above and connected to the conductive layer and the first bit line at a first end and connected to the first bit line at a second end, and wherein the second MTJ storage element is disposed above and connected to the conductive layer and the second bit line at a first end and connected to the second bit line at a second end.

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