公开(公告)号：US10199152B2

公开(公告)日：2019-02-05

申请号：US14743623

申请日：2015-06-18

Applicant: QUALCOMM Incorporated

Inventor： Mete Erturk ,  Ravindra Vaman Shenoy ,  Kwan-yu Lai ,  Jitae Kim ,  Donald William Kidwell, Jr. ,  Jon Bradley Lasiter ,  James Thomas Doyle ,  Omar James Bchir

IPC: H01F5/00 ,  H01F27/28 ,  H01F1/147 ,  H01F27/24 ,  H01F41/02 ,  H01F41/14 ,  H05K1/11 ,  H05K1/18 ,  H01F17/00 ,  H01F41/04 ,  H05K1/16 ,  H01L23/64 ,  H01L23/00

Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

公开(公告)号：US09496213B2

公开(公告)日：2016-11-15

申请号：US14836733

申请日：2015-08-26

Applicant: QUALCOMM Incorporated

Inventor： Donald William Kidwell, Jr. ,  Ravindra Shenoy ,  Mete Erturk ,  Layal Rouhana

IPC: H01L27/08 ,  H01L23/498 ,  H01F17/00 ,  H01L21/48 ,  H01L23/522 ,  H01L23/58 ,  H01L49/02 ,  B23K26/06 ,  H01L23/50

CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

Abstract translation: 集成器件封装包括管芯和封装衬底。 封装衬底包括至少一个电介质层（例如芯层，预镀层），电介质层中的磁芯，被配置为作为第一保护环工作的第一多个互连件和被构造成操作的第二多个互连件 作为第一电感器。 所述第二多个互连件定位在所述封装衬底中以至少部分地围绕所述磁芯。 来自第二多个互连的至少一个互连也是第一多个互连的一部分。 在一些实施方案中，第一保护环是不连续的保护环。 在一些实施方式中，第一电感器是螺线管电感器。 在一些实施方案中，磁芯包括载体，第一磁性层和第二磁性层。

公开(公告)号：US10470309B2

公开(公告)日：2019-11-05

申请号：US14859320

申请日：2015-09-20

Applicant: QUALCOMM Incorporated

Inventor： Mete Erturk ,  Farsheed Mahmoudi ,  James Thomas Doyle ,  Ravindra Vaman Shenoy ,  Jitae Kim

IPC: H05K1/16 ,  H01L27/01 ,  H01L23/522 ,  H01L49/02 ,  H01L23/498 ,  H05K1/11 ,  H05K3/42

Abstract: An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.

公开(公告)号：US20160233153A1

公开(公告)日：2016-08-11

申请号：US14836733

申请日：2015-08-26

Applicant: QUALCOMM Incorporated

Inventor： Donald William Kidwell, JR. ,  Ravindra Shenoy ,  Mete Erturk ,  Layal Rouhana

IPC: H01L23/498 ,  H01L49/02 ,  H01L21/48 ,  H01L23/522 ,  H01L23/58

CPC classification number: H01L23/49838 ,  B23K26/0661 ,  H01F17/0033 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/585 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/15311

Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

Abstract translation: 集成器件封装包括管芯和封装衬底。 封装衬底包括至少一个电介质层（例如芯层，预镀层），电介质层中的磁芯，被配置为作为第一保护环工作的第一多个互连件和被构造成操作的第二多个互连件 作为第一电感器。 所述第二多个互连件定位在所述封装衬底中以至少部分地围绕所述磁芯。 来自第二多个互连的至少一个互连也是第一多个互连的一部分。 在一些实施方案中，第一保护环是不连续的保护环。 在一些实施方式中，第一电感器是螺线管电感器。 在一些实施方案中，磁芯包括载体，第一磁性层和第二磁性层。