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公开(公告)号:US10001552B2
公开(公告)日:2018-06-19
申请号:US14883583
申请日:2015-10-14
发明人: Hrishikesh Vijaykumar Panchawagh , Hao-Yen Tang , Yipeng Lu , Kostadin Dimitrov Djordjev , Suryaprakash Ganti , David William Burns , Ravindra Vaman Shenoy , Jon Bradley Lasiter , Nai-Kuei Kuo , Firas Sammoura
IPC分类号: H01L41/09 , H01L41/113 , B06B1/06 , G01S7/52 , H01L41/047 , G10K11/34 , G06F3/041 , G06F3/043 , G06K9/00 , G10K11/26 , G01S7/521 , G01S15/04 , G01S15/89 , H01L41/08 , B06B1/02
CPC分类号: G01S7/5208 , B06B1/0207 , B06B1/0607 , B06B1/0644 , B06B1/0666 , B06B2201/20 , B06B2201/55 , G01S7/521 , G01S15/04 , G01S15/89 , G01S15/8915 , G06F3/0412 , G06F3/0416 , G06F3/043 , G06F3/0436 , G06F2203/04101 , G06K9/0002 , G06K9/00335 , G10K11/26 , G10K11/34 , G10K11/341 , G10K11/346 , H01L41/047 , H01L41/08
摘要: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.
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公开(公告)号:US09325420B2
公开(公告)日:2016-04-26
申请号:US14280270
申请日:2014-05-16
发明人: Kwan-yu Lai , Ravindra Vaman Shenoy , Jitae Kim , Jon Bradley Lasiter , Donald William Kidwell, Jr. , Evgeni Petrovich Gousev
CPC分类号: H04B10/50 , G01J1/0407 , G02B6/00 , G02B6/4212 , G02B6/428 , G02B6/43 , H03F3/08 , H04B10/501
摘要: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.
摘要翻译: 一种装置包括衬底和耦合到衬底的表面的波导。 表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器。 光电检测器被配置为响应于从波导的核心接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。
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公开(公告)号:US10734332B2
公开(公告)日:2020-08-04
申请号:US15839831
申请日:2017-12-12
发明人: Jon Bradley Lasiter , Ravindra Vaman Shenoy , Donald William Kidwell, Jr. , Mohammad Ali Tassoudji , Vladimir Aparin , Seong Heon Jeong , Jeremy Dunworth , Alireza Mohammadian , Mario Francisco Velez , Chin-Kwan Kim
IPC分类号: H01L23/00 , H01L23/66 , H01L23/498 , H01L23/552 , H01L23/31 , H01L21/50 , H01Q1/22 , H01Q1/24 , H01Q21/10 , H01Q19/24 , H01Q9/16 , H01L23/10
摘要: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
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公开(公告)号:US10199152B2
公开(公告)日:2019-02-05
申请号:US14743623
申请日:2015-06-18
发明人: Mete Erturk , Ravindra Vaman Shenoy , Kwan-yu Lai , Jitae Kim , Donald William Kidwell, Jr. , Jon Bradley Lasiter , James Thomas Doyle , Omar James Bchir
IPC分类号: H01F5/00 , H01F27/28 , H01F1/147 , H01F27/24 , H01F41/02 , H01F41/14 , H05K1/11 , H05K1/18 , H01F17/00 , H01F41/04 , H05K1/16 , H01L23/64 , H01L23/00
摘要: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.
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公开(公告)号:US20170246662A1
公开(公告)日:2017-08-31
申请号:US15441128
申请日:2017-02-23
CPC分类号: B06B1/0622 , A61B8/4494 , B06B1/0603 , H01L41/081
摘要: An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.
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公开(公告)号:US20160107194A1
公开(公告)日:2016-04-21
申请号:US14883583
申请日:2015-10-14
发明人: Hrishikesh Vijaykumar Panchawagh , Hao-Yen Tang , Yipeng Lu , Kostadin Dimitrov Djordjev , Suryaprakash Ganti , David William Burns , Ravindra Vaman Shenoy , Jon Bradley Lasiter , Nai-Kuei Kuo , Firas Sammoura
IPC分类号: B06B1/06 , H01L41/047 , H01L41/053 , H01L41/04
CPC分类号: G01S7/5208 , B06B1/0207 , B06B1/0607 , B06B1/0644 , B06B1/0666 , B06B2201/20 , B06B2201/55 , G01S7/521 , G01S15/04 , G01S15/89 , G01S15/8915 , G06F3/0412 , G06F3/0416 , G06F3/043 , G06F3/0436 , G06F2203/04101 , G06K9/0002 , G06K9/00335 , G10K11/26 , G10K11/34 , G10K11/341 , G10K11/346 , H01L41/047 , H01L41/08
摘要: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a diaphragm disposed over a cavity, the diaphragm including a piezoelectric layer stack including a piezoelectric layer, a first electrode electrically coupled with transceiver circuitry, and a second electrode electrically coupled with the transceiver circuitry. The first electrode may be disposed in a first portion of the diaphragm, and the second electrode may be disposed in a second, separate, portion of the diaphragm. Each of the first and the second electrode is disposed on or proximate to a first surface of the piezoelectric layer, the first surface being opposite from the cavity. The PMUT is configured to transmit first ultrasonic signals by way of the first electrode during a first time period and to receive second ultrasonic signals by way of the second electrode during a second time period, the first time period and the second time period being at least partially overlapping.
摘要翻译: 压电微机械超声换能器(PMUT)包括设置在空腔上方的隔膜,所述隔膜包括压电层堆叠,所述压电层堆叠包括压电层,与收发器电路电耦合的第一电极和与所述收发器电路电耦合的第二电极。 第一电极可以设置在隔膜的第一部分中,并且第二电极可以设置在隔膜的第二,分离的部分中。 第一和第二电极中的每一个设置在压电层的第一表面上或其附近,第一表面与空腔相对。 PMUT被配置为在第一时间段期间通过第一电极传输第一超声波信号,并且在第二时间段期间通过第二电极接收第二超声波信号,第一时间段和第二时间段至少是 部分重叠。
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7.
公开(公告)号:US20150333831A1
公开(公告)日:2015-11-19
申请号:US14280270
申请日:2014-05-16
发明人: Kwan-yu Lai , Ravindra Vaman Shenoy , Jitae Kim , Jon Bradley Lasiter , Donald William Kidwell, JR. , Evgeni Petrovich Gousev
CPC分类号: H04B10/50 , G01J1/0407 , G02B6/00 , G02B6/4212 , G02B6/428 , G02B6/43 , H03F3/08 , H04B10/501
摘要: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.
摘要翻译: 一种装置包括衬底和耦合到衬底的表面的波导。 表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器。 光电检测器被配置为响应于从波导的核心接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。
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公开(公告)号:US20150179731A1
公开(公告)日:2015-06-25
申请号:US14179239
申请日:2014-02-12
IPC分类号: H01L49/02
CPC分类号: H01L28/40 , H01L23/145 , H01L23/147 , H01L23/15 , H01L23/49822 , H01L23/642 , H01L28/90 , H01L2924/0002 , H01L2924/00
摘要: An embedded capacitor is provided that includes a substrate having a dielectric-filled window. A metal-insulator-metal structure lines a plurality of vias extending through the dielectric-filled window and covers at least partially opposing sides of the dielectric-filled window.
摘要翻译: 提供了一种嵌入式电容器,其包括具有电介质填充窗口的基板。 金属 - 绝缘体 - 金属结构将多个通孔延伸穿过电介质填充的窗口并且覆盖电介质填充窗的至少部分相对的两侧。
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公开(公告)号:US10478858B2
公开(公告)日:2019-11-19
申请号:US14569256
申请日:2014-12-12
发明人: Jon Bradley Lasiter , Ravindra Vaman Shenoy , Evgeni Petrovich Gousev , Hrishikesh Panchawagh , David William Burns , Nai-Kuei Kuo , Jonathan Charles Griffiths , Suryaprakash Ganti
摘要: A piezoelectric micromechanical ultrasonic transducer (PMUT) includes a multilayer stack disposed on a substrate. The multilayer stack may include an anchor structure disposed over the substrate, a piezoelectric layer stack disposed over the anchor structure, and a mechanical layer disposed proximate to the piezoelectric layer stack. The piezoelectric layer stack may be disposed over a cavity. The mechanical layer may seal the cavity and, together with the piezoelectric layer stack, is supported by the anchor structure and forms a membrane over the cavity, the membrane being configured to undergo one or both of flexural motion and vibration when the PMUT receives or transmits ultrasonic signals.
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公开(公告)号:US09263370B2
公开(公告)日:2016-02-16
申请号:US14040223
申请日:2013-09-27
发明人: Ravindra Vaman Shenoy , Kwan-yu Lai , Jon Bradley Lasiter , Philip Jason Stephanou , Donald William Kidwell, Jr. , Evgeni Gousev
IPC分类号: H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065 , H01L27/108 , H01L23/15 , H01L23/498 , H01L25/10 , H01L25/18 , H01L23/50 , H01L21/48 , H01L23/538
CPC分类号: H01L23/481 , H01L21/486 , H01L23/15 , H01L23/49827 , H01L23/50 , H01L23/5381 , H01L25/0657 , H01L25/105 , H01L25/18 , H01L27/108 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2224/48471 , H01L2225/06517 , H01L2225/06527 , H01L2225/06548 , H01L2225/06562 , H01L2225/06572 , H01L2924/15311 , H01L2924/19105 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device comprising a second surface of a logic die and a second surface of a via bar coupled to a first surface of a substrate, a second surface of a memory die coupled to a first surface of the via bar, a portion of the second surface of the memory die extending over the first surface of the logic die, such that the logic die and the memory die are vertically staggered, and the memory die electrically coupled to the logic die through the via bar. The via bar can be formed from glass, and include through-glass vias (TGVs) and embedded passives such as resistors, capacitors, and inductors. The semiconductor device can be formed as a single package or a package-on-package structure with the via bar and the memory die encapsulated in a package and the substrate and logic die in another package.
摘要翻译: 一种半导体器件,包括逻辑管芯的第二表面和耦合到衬底的第一表面的通孔条的第二表面,耦合到通孔条的第一表面的存储器管芯的第二表面,第二部分的一部分 存储芯片的表面在逻辑管芯的第一表面上延伸,使得逻辑管芯和存储器管芯垂直交错,并且存储器管芯通过通孔电连接到逻辑管芯。 通孔棒可以由玻璃形成,并且包括透玻璃通孔(TGV)和嵌入式无源器件,例如电阻器,电容器和电感器。 半导体器件可以形成为单个封装或封装封装结构,其中通孔棒和存储管芯封装在封装中,并且衬底和逻辑裸片在另一封装中。
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