Integrated sensor for multi-dimensional signal analysis

    公开(公告)号:US11719639B2

    公开(公告)日:2023-08-08

    申请号:US17190331

    申请日:2021-03-02

    IPC分类号: G01N21/64 H01L27/146

    摘要: Some aspects relate to an integrated circuit, comprising at least one photodetection region configured to generate charge carriers responsive to incident photons emitted from a sample, at least one charge storage region configured to receive the charge carriers from the photodetection region, and at least one controller configured to obtain information about the incident photons, the information comprising at least one member selected from the group comprising pulse duration and interpulse duration and at least one member selected from the group comprising wavelength information, luminescence lifetime information, and intensity information. In some embodiments, the information comprises at least three, four, and/or five members selected from the group comprising wavelength information, luminescence lifetime information, intensity information, pulse duration information, and interpulse duration information. In some embodiments, the information obtained may be used to identify the sample.

    Sensor for lifetime plus spectral characterization

    公开(公告)号:US11885744B2

    公开(公告)日:2024-01-30

    申请号:US17149310

    申请日:2021-01-14

    IPC分类号: G01N21/64

    摘要: Some aspects relate to integrated devices for obtaining timing and/or spectral information from incident light. In some embodiments, a pixel may include one or more charge storage regions configured to receive charge carriers generated responsive to incident photons from a light source, with charge carriers stored in the charge storage region(s) indicative of spectral and timing information. In some embodiments, a pixel may include regions having different depths, each configured to generate charge carriers responsive to incident photons. In some embodiments, a pixel may include multiple charge storage regions having different depths, and one or more of the charge storage regions may be configured to receive the incident photons and generate charge carriers therein. In some embodiments, a pixel may include an optical sorting element configured to direct at least some incident photons to one charge storage region and other incident photons to another charge storage region.

    INTEGRATED SENSOR FOR MULTI-DIMENSIONAL SIGNAL ANALYSIS

    公开(公告)号:US20240003811A1

    公开(公告)日:2024-01-04

    申请号:US18335458

    申请日:2023-06-15

    IPC分类号: G01N21/64 H01L27/146

    摘要: Some aspects relate to an integrated circuit, comprising at least one photodetection region configured to generate charge carriers responsive to incident photons emitted from a sample, at least one charge storage region configured to receive the charge carriers from the photodetection region, and at least one controller configured to obtain information about the incident photons, the information comprising at least one member selected from the group comprising pulse duration and interpulse duration and at least one member selected from the group comprising wavelength information, luminescence lifetime information, and intensity information. In some embodiments, the information comprises at least three, four, and/or five members selected from the group comprising wavelength information, luminescence lifetime information, intensity information, pulse duration information, and interpulse duration information. In some embodiments, the information obtained may be used to identify the sample.

    INTEGRATED CIRCUIT HAVING MIRRORED PIXEL CONFIGURATION

    公开(公告)号:US20220328542A1

    公开(公告)日:2022-10-13

    申请号:US17716132

    申请日:2022-04-08

    IPC分类号: H01L27/146 H04N5/369

    摘要: Aspects of the technology described herein relate to improved semiconductor-based image sensor designs. In some aspects, an integrated circuit described herein may include a first pixel and a second pixel, wherein the first pixel is proximate the second pixel in a mirrored configuration. In some aspects, an integrated circuit described herein may include a first pixel and a second pixel that is proximate to the first pixel along a row direction, and a conductive line extending along a column direction that intersects with the row direction, wherein the conductive line is in electrical communication with a first component of the first pixel and a second component of the second pixel.

    INTEGRATED SENSOR WITH REDUCED SKEW

    公开(公告)号:US20210318238A1

    公开(公告)日:2021-10-14

    申请号:US17224925

    申请日:2021-04-07

    IPC分类号: G01N21/64

    摘要: Aspects of the present disclosure relate to techniques for reducing skew in an integrated device, such as a CMOS imaging device. In some aspects, multiple pixels of an integrated circuit may be configured to receive a same control signal and conduct charge carriers responsive to the control signal substantially at the same time. In some aspects, an integrated circuit may have modulated charge transfer channel voltage thresholds, such as by having different charge transfer channel lengths, and/or a doped portion configured to set a voltage threshold for charge transfer. In some aspects, an integrated circuit may have a via structure having a plurality of vias extending between continuous portions of at least two metal layers. In some aspects, an integrated circuit may include a row of pixels and a voltage source configured to provide a voltage to bias a semiconductor substrate of the integrated circuit along the row of pixels.

    INTEGRATED SENSOR FOR LIFETIME CHARACTERIZATION

    公开(公告)号:US20240096924A1

    公开(公告)日:2024-03-21

    申请号:US18520502

    申请日:2023-11-27

    IPC分类号: H01L27/146

    CPC分类号: H01L27/14643 H01L27/14683

    摘要: Aspects of the technology described herein relate to improved semiconductor-based image sensor designs. In some embodiments, an integrated circuit may comprise a photodetection region and a drain region electrically coupled to the photodetection region, and the photodetection region may be configured to induce an intrinsic electric field in a direction from the photodetection region to the drain region(s). In some embodiments, a charge storage region and the drain region may be positioned on a same side of the photodetection region. In some embodiments, at least one drain layer may be configured to receive incident photons and/or charge carriers via the photodetection region. In some embodiments, an integrated circuit may comprise a plurality of pixels and a control circuit configured to control a transfer of charge carriers in the plurality of pixels.

    SENSOR FOR LIFETIME PLUS SPECTRAL CHARACTERIZATION

    公开(公告)号:US20210215605A1

    公开(公告)日:2021-07-15

    申请号:US17149310

    申请日:2021-01-14

    IPC分类号: G01N21/64

    摘要: Some aspects relate to integrated devices for obtaining timing and/or spectral information from incident light. In some embodiments, a pixel may include one or more charge storage regions configured to receive charge carriers generated responsive to incident photons from a light source, with charge carriers stored in the charge storage region(s) indicative of spectral and timing information. In some embodiments, a pixel may include regions having different depths, each configured to generate charge carriers responsive to incident photons. In some embodiments, a pixel may include multiple charge storage regions having different depths, and one or more of the charge storage regions may be configured to receive the incident photons and generate charge carriers therein. In some embodiments, a pixel may include an optical sorting element configured to direct at least some incident photons to one charge storage region and other incident photons to another charge storage region.

    Integrated sensor with reduced skew

    公开(公告)号:US11573180B2

    公开(公告)日:2023-02-07

    申请号:US17224899

    申请日:2021-04-07

    IPC分类号: G01N21/64 G05F1/46 H01L27/146

    摘要: Aspects of the present disclosure relate to techniques for reducing skew in an integrated device, such as a CMOS imaging device. In some aspects, multiple pixels of an integrated circuit may be configured to receive a same control signal and conduct charge carriers responsive to the control signal substantially at the same time. In some aspects, an integrated circuit may have modulated charge transfer channel voltage thresholds, such as by having different charge transfer channel lengths, and/or a doped portion configured to set a voltage threshold for charge transfer. In some aspects, an integrated circuit may have a via structure having a plurality of vias extending between continuous portions of at least two metal layers. In some aspects, an integrated circuit may include a row of pixels and a voltage source configured to provide a voltage to bias a semiconductor substrate of the integrated circuit along the row of pixels.

    INTEGRATED CIRCUIT HAVING MIRRORED PIXEL CONFIGURATION

    公开(公告)号:US20220328541A1

    公开(公告)日:2022-10-13

    申请号:US17716098

    申请日:2022-04-08

    摘要: Aspects of the technology described herein relate to improved semiconductor-based image sensor designs. In some aspects, an integrated circuit described herein may include a first pixel and a second pixel, wherein the first pixel is proximate the second pixel in a mirrored configuration. In some aspects, an integrated circuit described herein may include a first pixel and a second pixel that is proximate to the first pixel along a row direction, and a conductive line extending along a column direction that intersects with the row direction, wherein the conductive line is in electrical communication with a first component of the first pixel and a second component of the second pixel.