公开(公告)号：US11049786B2

公开(公告)日：2021-06-29

申请号：US16575045

申请日：2019-09-18

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Keita Tsuchiya ,  Shuuichi Kariyazaki ,  Takashi Kikuchi ,  Michiaki Sugiyama ,  Yusuke Tanuma

IPC: H01L23/36 ,  H01L23/40 ,  H01L23/538 ,  H01L25/18

Abstract: The semiconductor device includes a wiring substrate, a first and second semiconductor chips, and the heat sink. The wiring substrate has a first surface. The first and second semiconductor chips are disposed on the first surface. The heat sink is disposed on the first surface so as to cover the first semiconductor chip. The heat sink has a second surface and the third surface opposite the first surface. The second surface faces the first surface. The heat sink has a first cut-out portion. The first cut-out portion is formed at a position overlapping with the second semiconductor chip in plan view, and penetrates the heat sink in a direction from the third surface toward the second surface. The second surface is joined to at least four corners of the first surface.

公开(公告)号：US10553558B2

公开(公告)日：2020-02-04

申请号：US15220438

申请日：2016-07-27

Applicant: Renesas Electronics Corporation

Inventor： Yosuke Katsura ,  Yusuke Tanuma

IPC: H01L23/18 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor device includes a memory component, which is a semiconductor component (a semiconductor chip or a semiconductor package), to be mounted over an upper surface of a wiring substrate. In addition, in the upper surface, a distance between the memory component and a first substrate side of the upper surface is smaller than a distance between the memory component and a second substrate side of the upper surface. In addition, in the upper surface, a dam portion is formed between the memory component and the first substrate side.

公开(公告)号：US12148680B2

公开(公告)日：2024-11-19

申请号：US17517908

申请日：2021-11-03

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Toshihiko Akiba ,  Yusuke Tanuma

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10

Abstract: A semiconductor device includes: a wiring substrate; a semiconductor chip mounted on the wiring substrate; a heat release sheet arranged on the semiconductor chip to cover the entire semiconductor chip and having a larger area than an area of the semiconductor chip; and a cover member which covers the semiconductor chip and the heat release sheet and to which the heat release sheet is fixed. The cover member has a first portion facing the semiconductor chip, a flange portion arranged in a periphery of the first portion and bonded and fixed onto the wiring substrate, and a second portion arranged between the first portion and the flange portion. In a plan view of the cover member viewed from the heat release sheet, the heat release sheet is bonded/fixed to the cover member through a bonding member partially arranged between the heat release sheet and the cover member.