公开(公告)号：US20160351509A1

公开(公告)日：2016-12-01

申请号：US15080001

申请日：2016-03-24

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Dan Carey ,  Ma Shirley Asoy

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/48 ,  H01L21/683 ,  H01L21/56 ,  H01L21/3205 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L21/268

CPC classification number: H01L23/552 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/04105 ,  H01L2224/12105

Abstract: The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Abstract translation: 本公开将电磁屏蔽集成到晶片级扇出封装工艺中。 首先，提供具有多个模块的模具晶片。 每个模块包括一个具有I / O端口的模块，并被模块间区域包围。 包括耦合到每个模块的I / O端口的屏蔽连接元件的再分配结构形成在模具晶片的底表面上。 屏蔽连接元件从I / O端口横向延伸到每个模块的模块间区域。 接下来，在每个模块间区域对模具晶片进行子切割以形成空腔。 屏蔽连接元件的一部分然后通过每个空腔的底部暴露。 在模具晶片的顶表面和每个腔的暴露表面上形成屏蔽结构。 屏蔽结构与屏蔽连接的元件接触。

公开(公告)号：US09570406B2

公开(公告)日：2017-02-14

申请号：US15080001

申请日：2016-03-24

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Dan Carey ,  Ma Shirley Asoy

IPC: H01L21/78 ,  H01L23/552 ,  H01L23/31 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/268 ,  H01L21/683 ,  H01L21/56 ,  H01L21/3205 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/04105 ,  H01L2224/12105

Abstract: The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Abstract translation: 本公开将电磁屏蔽集成到晶片级扇出封装工艺中。 首先，提供具有多个模块的模具晶片。 每个模块包括一个具有I / O端口的模块，并被模块间区域包围。 包括耦合到每个模块的I / O端口的屏蔽连接元件的再分配结构形成在模具晶片的底表面上。 屏蔽连接元件从I / O端口横向延伸到每个模块的模块间区域。 接下来，在每个模块间区域对模具晶片进行子切割以形成空腔。 屏蔽连接元件的一部分然后通过每个空腔的底部暴露。 在模具晶片的顶表面和每个腔的暴露表面上形成屏蔽结构。 屏蔽结构与屏蔽连接的元件接触。