公开(公告)号：US20240014107A1

公开(公告)日：2024-01-11

申请号：US18470083

申请日：2023-09-19

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/64

CPC classification number: H01L23/49562 ,  H01L23/49503 ,  H01L23/49537 ,  H01L24/32 ,  H01L24/48 ,  H01L23/645 ,  H01L2224/48247 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/19042

Abstract: A semiconductor device includes a plurality of conductive members including a die pad, a first semiconductor element and a second semiconductor element each located on the die pad, an insulating element electrically connected to the first semiconductor element and the second semiconductor element and insulating the first semiconductor element and the second semiconductor element from each other, and an insulating substrate interposed between the die pad and the insulating element and bonded to the die pad. The insulating element is bonded to the insulating substrate.

公开(公告)号：US20180122726A1

公开(公告)日：2018-05-03

申请号：US15856021

申请日：2017-12-27

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/49 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L23/49548 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

公开(公告)号：US20160007464A1

公开(公告)日：2016-01-07

申请号：US14789233

申请日：2015-07-01

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Yasumasa KASUYA ,  Taro NISHIOKA

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/544 ,  H01L23/31

CPC classification number: H01L24/32 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/544 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/06155 ,  H01L2224/29139 ,  H01L2224/29239 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32013 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/05442 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/207

Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.

Abstract translation: 电子设备包括电子元件，沿第一方向排列的多个第一子电极，沿与第一方向正交的第二方向排列的多个第二子电极，虚拟电极和密封树脂。 密封树脂具有多个第一子电极，多个第二子电极和虚拟电极露出的树脂后表面。 多个第二子电极比第一子电极中的任一个进一步位于第一方向。 多个第一子电极比第二子电极中的任一个进一步位于第二方向。 所述虚拟电极比所述多个第一子电极中的任一个进一步位于所述第一方向上，并且比所述多个第二子电极中的任一个进一步位于所述第二方向。

公开(公告)号：US20130285250A1

公开(公告)日：2013-10-31

申请号：US13930670

申请日：2013-06-28

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Taro NISHIOKA

IPC: H01L23/49

CPC classification number: H01L23/49548 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The semiconductor device according to the present invention includes a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead arranged around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package collectively sealing the semiconductor chip, the island, the lead and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

Abstract translation: 根据本发明的半导体器件包括半导体芯片，具有半导体芯片接合的上表面的岛，围绕岛的引线，在半导体芯片的表面和第二半导体芯片的上表面之间延伸的接合线 引线和树脂封装集体地密封半导体芯片，岛，引线和接合线，同时岛的下表面和引线的下表面暴露在树脂封装的后表面上，并且 引线设置有从下表面侧凹入并在其侧表面上开口的凹部。

公开(公告)号：US20240379574A1

公开(公告)日：2024-11-14

申请号：US18777194

申请日：2024-07-18

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/495 ,  H01L23/64 ,  H01L25/065

Abstract: A semiconductor device is configured to suppress an occurrence of dielectric breakdown in the semiconductor device. The semiconductor device includes an insulating element, a conductive member on which the insulating element is mounted, and a sealing resin covering the insulating element. The conductive member includes an uneven part covered by the sealing resin. As an example, in the semiconductor device, the conductive member includes a first die pad on which the insulating element is mounted, and the uneven part includes a first region that is provided on the first die pad.

公开(公告)号：US20230386983A1

公开(公告)日：2023-11-30

申请号：US18449360

申请日：2023-08-14

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA ,  Tomohira KIKUCHI ,  Kenji FUJII ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48175 ,  H01L2224/48137

Abstract: A semiconductor device includes first and second semiconductor elements, a conductive support, a third semiconductor element and a sealing resin. The conductive support includes first and second leads spaced apart in a first direction. The first semiconductor element is supported by the first lead. The second semiconductor element is supported by the second lead. The third semiconductor element, supported by the conductive support, insulates the first semiconductor element and the second semiconductor element. The sealing resin covers a part of the conductive support. A distance d1 between the first lead and the second lead in the first direction is greater than distance d0 given by Equation below. In Equation below, Y is the number of years of insulation life (years) expected for the semiconductor device, A and B are constants determined by a material of the sealing resin, and X is a voltage (kVrms).





d
⁢
0

=



Y
A

B

×
0.15
×
X

公开(公告)号：US20230238317A1

公开(公告)日：2023-07-27

申请号：US18295111

申请日：2023-04-03

Applicant: ROHM CO., LTD.

Inventor： Bin ZHANG ,  Akinori NII ,  Taro NISHIOKA

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49861 ,  H01L23/49866 ,  H01L21/485 ,  H01L23/3121

Abstract: There is provided a semiconductor device including: a lead frame including a first opening portion; a resin filled in the first opening portion; and a semiconductor element electrically connected to the lead frame, wherein a side wall surface of the lead frame in the first opening portion has a larger average surface roughness than an upper surface of the lead frame.

公开(公告)号：US20140225243A1

公开(公告)日：2014-08-14

申请号：US14257217

申请日：2014-04-21

Applicant: ROHM CO., LTD.

Inventor： Akihiro KOGA ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/42 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof.

Abstract translation: 公开了一种半导体器件。 半导体器件具有半导体芯片，具有半导体芯片接合的上表面的岛，设置在岛上的引线，在半导体芯片的表面和引线的上表面之间延伸的接合线，以及 树脂封装密封半导体芯片，岛，引线和接合线，而岛的下表面和引线的下表面暴露在树脂封装的后表面上，并且引线设置有 从下表面侧凹入并在其侧面开口的凹部。

公开(公告)号：US20240304510A1

公开(公告)日：2024-09-12

申请号：US18660967

申请日：2024-05-10

Applicant: Rohm Co., Ltd.

Inventor： Hiroaki MATSUBARA ,  Taro NISHIOKA ,  Yoshizo OSUMI

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H01L23/522 ,  H01L25/18

CPC classification number: H01L23/3135 ,  H01L23/291 ,  H01L23/49838 ,  H01L23/5223 ,  H01L23/5227 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/1815

Abstract: A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.

公开(公告)号：US20240194660A1

公开(公告)日：2024-06-13

申请号：US18587461

申请日：2024-02-26

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA ,  Hiroaki MATSUBARA

IPC: H01L25/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L31/02005 ,  H01L31/0203 ,  H01L33/56 ,  H01L33/62 ,  H01L31/18 ,  H01L2933/005 ,  H01L2933/0066

Abstract: Semiconductor device includes first lead, second lead, light-emitting element, light-receiving element, transparent resin and first resin. First lead includes first die pad having first obverse surface and first reverse surface mutually opposite in thickness direction. Second lead includes second die pad having second obverse surface facing same side as first obverse surface in thickness direction and second reverse surface facing same side as first reverse surface in thickness direction. Light-emitting element is mounted on first obverse surface. Light-receiving element is mounted on second obverse surface. Transparent resin covers portions of light-emitting element and light-receiving element. First resin covers transparent resin. Transparent resin includes transparent-resin obverse surface facing same side as first obverse surface in thickness direction, and transparent-resin reverse surface facing same side as first reverse surface in thickness direction. Transparent-resin reverse surface has surface roughness larger than that of transparent-resin obverse surface.