公开(公告)号：US20240047438A1

公开(公告)日：2024-02-08

申请号：US18267455

申请日：2021-11-22

Applicant: ROHM CO., LTD.

Inventor： Hiroaki MATSUBARA ,  Taro NISHIOKA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L23/3107 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/46 ,  H01L2224/48195 ,  H01L2224/48245 ,  H01L2224/48991 ,  H01L2224/48455 ,  H01L2924/19042 ,  H01L2924/3512

Abstract: A semiconductor device includes first and second semiconductor elements, and first and second circuits at different potentials. The second semiconductor element, electrically connected to the first semiconductor element, relays mutual signals between the first and the second circuits, while insulating them. The semiconductor device further includes a first terminal lead electrically connected to the first semiconductor element, a first wire connected to the first and the second semiconductor elements, and a second wire connected to the first semiconductor element and the first terminal lead. The first wire contains a first metal. The second wire includes a first core containing a second metal, and a first surface layer containing a third metal and covering the first core. The second metal has a smaller atomic number than that of the first metal. The third metal has a greater bonding strength with respect to the first terminal lead than the second metal.

公开(公告)号：US20230335529A1

公开(公告)日：2023-10-19

申请号：US18340346

申请日：2023-06-23

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Taro NISHIOKA ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/48 ,  H01L23/49562 ,  H01L23/4952 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/48137 ,  H01L2924/13091 ,  H01L2924/13055 ,  H01L2224/32245 ,  H01L2224/73265

Abstract: A semiconductor device includes: a semiconductor element; an island lead on which the semiconductor element is mounted; a terminal lead electrically connected to the semiconductor element; a wire connected to the semiconductor element and the terminal lead; and a sealing resin covering the semiconductor element, the island lead, the terminal lead, and the wire. The terminal lead includes a base member having an obverse surface facing in a thickness direction of the terminal lead, and a metal layer located between the obverse surface and the wire. The base member has a greater bonding strength with respect to the sealing resin than the metal layer. The obverse surface includes an opposing side facing the island lead. The obverse surface includes a first portion that includes at least a portion of the opposing side and that is exposed from the metal layer.

公开(公告)号：US20240112995A1

公开(公告)日：2024-04-04

申请号：US18256150

申请日：2021-11-29

Applicant: ROHM CO., LTD.

Inventor： Moe YAMAGUCHI ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Ryohei UMENO ,  Taro NISHIOKA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49517 ,  H01L23/49558 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/73265

Abstract: A semiconductor device includes a first die pad with a first obverse surface facing in z direction, a second die pad spaced from the first die pad and including a second obverse surface facing in z direction, a first semiconductor element on the first obverse surface, a second semiconductor element on the second obverse surface, an insulating element on the first or second obverse surface and located between the first and second semiconductor elements in x direction to relay signals between the first and second semiconductor elements while electrically insulating these semiconductor elements, and a wire bonded to the first semiconductor element and the first obverse surface. The first die pad includes a first bond portion bonded to the wire, and a first opening located between the first bond portion and the first semiconductor element in y direction and including an opening end in the first obverse surface.

公开(公告)号：US20240030212A1

公开(公告)日：2024-01-25

申请号：US18352759

申请日：2023-07-14

Applicant: ROHM CO., LTD.

Inventor： Tomohira KIKUCHI ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/16 ,  H01L23/31

CPC classification number: H01L25/18 ,  H01L23/49575 ,  H01L25/16 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/48

Abstract: A semiconductor device includes a semiconductor control element, a first drive element, a second drive element and a first insulating element. The first drive element is spaced apart from the semiconductor control element in a first direction orthogonal to a thickness direction of the semiconductor control element and receives a signal transmitted from the semiconductor control element. The second drive element is spaced apart from the first drive element in a second direction orthogonal to the thickness direction and the first direction and receives a signal transmitted from the semiconductor control element. The first insulating element is located between the semiconductor control element and the first drive element in the first direction. The first insulating element relays a signal transmitted from the semiconductor control element to the first drive element and provides electrical insulation between the semiconductor control element and the first drive element.

公开(公告)号：US20250006621A1

公开(公告)日：2025-01-02

申请号：US18883587

申请日：2024-09-12

Applicant: Rohm Co., Ltd.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA ,  Tomohira KIKUCHI

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

Abstract: An electronic device includes: an electronic component; a sealing resin covering the electronic component; a first lead including a first inner portion and a first outer portion; a second lead including a second inner portion and a second outer portion; and a wire including a bonding segment secured to the first inner portion and a bonding segment secured to the second inner portion. The first inner portion is located inside a peripheral edge of the sealing resin as viewed in a thickness direction z, except at a first boundary with the first outer portion. The second inner portion is located inside the peripheral edge of the sealing resin as viewed in the thickness direction z, except at a second boundary with the second outer portion. As viewed in the thickness direction z, the wire has a length that is at least 25% of an average of a distance from the first boundary to the bonding segment secured to the first inner portion and a distance from the second boundary to the bonding segment secured to the second inner portion.

公开(公告)号：US20240332137A1

公开(公告)日：2024-10-03

申请号：US18741266

申请日：2024-06-12

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L25/0655 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2924/1424 ,  H01L2924/182

Abstract: An electronic device includes an electronic component, a sealing resin covering the electronic component, first and second terminals protruding from the sealing resin toward a first side in a first direction, and plural third terminals protruding from the sealing resin toward a second side in the first direction. The first and second terminals are located side by side with a first interval in a second direction. The third terminals are arranged in the second direction with a second interval. The first interval is greater than the second interval. Along the second direction, the first mount portion of the first terminal has a first dimension, the second mount portion of the second terminal has a second dimension, and the third mount portion of each third terminal has a third dimension. The first and second dimensions are greater than the third dimension.

公开(公告)号：US20240332138A1

公开(公告)日：2024-10-03

申请号：US18742527

申请日：2024-06-13

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/48245 ,  H01L2924/1424 ,  H01L2924/182

Abstract: An electronic device includes an electronic component, a sealing resin covering the component, a first terminal protruding from the sealing resin toward a first side in a first direction orthogonal to the thickness direction of the sealing resin, a second terminal protruding from the sealing resin toward the first side in the first direction, and a plurality of third terminals protruding from the sealing resin toward a second side in the first direction. The first terminal and the second terminal are located side by side with a first interval in a second direction orthogonal to the thickness direction and the first direction. The third terminals are arranged in the second direction with a second interval. The first interval is greater than the second interval. The first terminal includes a plurality of first mount portions located at an end opposite to the sealing resin in the first direction.

公开(公告)号：US20240006274A1

公开(公告)日：2024-01-04

申请号：US18465558

申请日：2023-09-12

Applicant: ROHM CO., LTD.

Inventor： Ryohei UMENO ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Tomohira KIKUCHI ,  Moe YAMAGUCHI

IPC: H01L23/495 ,  H01L25/18 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/49555 ,  H01L23/49575 ,  H01L25/18 ,  H01L23/295 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L23/3121

Abstract: A semiconductor device includes: conductive members including first and second members; a first semiconductor element electrically connected to one conductive member; a second semiconductor element electrically connected to one conductive member configured to receive input of a voltage different from that applied to the first semiconductor element; and a sealing resin covering a part of each conductive member, the first semiconductor element, and the second semiconductor element. The voltage applied to the second member differs from the voltage applied to the first member. The sealing resin contains electrically insulating fillers. When a square cross section having a side length equal to ⅔ of a minimum spacing between two adjacent conductive members is hypothetically defined in the sealing resin, eight or more of the fillers each having a particle size equal to or greater than ⅛ of the minimum spacing are at least partially contained in the square cross section.

公开(公告)号：US20230343684A1

公开(公告)日：2023-10-26

申请号：US18343290

申请日：2023-06-28

Applicant: ROHM CO., LTD.

Inventor： Tomohira KIKUCHI ,  Hiroaki MATSUBARA ,  Yoshizo OSUMI ,  Moe YAMAGUCHI ,  Ryohei UMENO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L24/48 ,  H01L23/49562 ,  H01L2224/48245

Abstract: A semiconductor device includes a semiconductor control element, a first drive element, a second drive element, a first insulating element and a second insulating element. In plan view, the first drive element and the second drive element are located on the opposite sides with respect to the semiconductor control element. The first insulating element is located between the semiconductor control element and the first drive element, relays a signal transmitted from the semiconductor control element to the first drive element, and provides electrical insulation between the semiconductor control element and the first drive element. The second insulating element is located between the semiconductor control element and the second drive element, relays a signal transmitted from the semiconductor control element to the second drive element, and provides electrical insulation between the semiconductor control element and the second drive element.