公开(公告)号：US12068230B2

公开(公告)日：2024-08-20

申请号：US18430414

申请日：2024-02-01

Applicant: ROHM CO., LTD.

Inventor： Kohei Tanikawa ,  Kenji Hayashi ,  Ryosuke Fukuda

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L24/18 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2924/182

Abstract: A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.

公开(公告)号：US11990392B2

公开(公告)日：2024-05-21

申请号：US17437715

申请日：2020-05-13

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Takumi Kanda ,  Hidetoshi Abe

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49562 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/48177

Abstract: A semiconductor device includes a substrate including a main surface, a semiconductor element mounted on the main surface, a drive pad, and drive wires. The semiconductor element includes a front surface that faces in a same direction as the main surface and a drive electrode formed on the front surface and containing SiC. The drive wires are spaced apart from each other and connect the drive electrode to the drive pad. The drive wires include a first drive wire and a second drive wire configured to be a combination of furthermost ones of the drive wires. The first drive wire and the second drive wire are separated from each other by a greater distance at the drive pad than at the drive electrode as viewed in a first direction that is perpendicular to the main surface of the substrate.

公开(公告)号：US11776936B2

公开(公告)日：2023-10-03

申请号：US17644452

申请日：2021-12-15

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Akihiro Suzaki ,  Masaaki Matsuo ,  Ryuta Watanabe ,  Makoto Ikenaga

IPC: H01L25/07 ,  H01L23/049 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L25/072 ,  H01L23/049 ,  H01L23/296 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/564 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/48096 ,  H01L2224/48139 ,  H01L2224/48225 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/13091 ,  H01L2924/14252

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer. The moisture-resistant layer is held in contact with the mounting layer and the side surface so as to be spanned between the mounting layer and the side surface in the thickness direction.

公开(公告)号：US11600602B2

公开(公告)日：2023-03-07

申请号：US17173935

申请日：2021-02-11

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Masashi Hayashiguchi

IPC: H01L25/07 ,  H01L23/36 ,  H01L23/488 ,  H01L23/00 ,  H01L25/18 ,  H02M7/48

Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at another surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.

公开(公告)号：US10950582B2

公开(公告)日：2021-03-16

申请号：US16793753

申请日：2020-02-18

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Masashi Hayashiguchi

IPC: H01L25/07 ,  H01L23/36 ,  H01L23/488 ,  H01L23/00 ,  H01L25/18 ,  H02M7/48

Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at another surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.

公开(公告)号：US10777542B2

公开(公告)日：2020-09-15

申请号：US15997321

申请日：2018-06-04

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Akihiro Suzaki

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L23/495 ,  H01L25/07 ,  H01L23/36 ,  H01L29/739 ,  H01L23/433

Abstract: A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.

公开(公告)号：US12283573B2

公开(公告)日：2025-04-22

申请号：US18399105

申请日：2023-12-28

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Masashi Hayashiguchi

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/36 ,  H01L23/488 ,  H01L25/18 ,  H02M7/48

Abstract: A semiconductor power module including an insulating substrate having one surface and another surface, an output side terminal arranged at a one surface side of the insulating substrate, a first power supply terminal arranged at the one surface side of the insulating substrate, a second power supply terminal to which a voltage of a magnitude different from a voltage applied to the first power supply terminal is to be applied, and arranged at an other surface side of the insulating substrate so as to face the first power supply terminal across the insulating substrate, a first switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the first power supply terminal, and a second switching device arranged at the one surface side of the insulating substrate and electrically connected to the output side terminal and the second power supply terminal.

公开(公告)号：US12224231B2

公开(公告)日：2025-02-11

申请号：US18601686

申请日：2024-03-11

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Kohei Tanikawa ,  Ryosuke Fukuda

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor module includes a conductive substrate, a plurality of first semiconductor elements, and a plurality of second semiconductor elements. The conductive substrate includes a first conductive portion to which the plurality of first semiconductor elements are electrically bonded, and a second conductive portion to which the plurality of second semiconductor elements are electrically bonded. The semiconductor module further includes a first input terminal, a second input terminal, and a third input terminal that are provided near the first conductive portion. The second input terminal and the third input terminal are spaced apart from each other with the first input terminal therebetween. The first input terminal is electrically connected to the first conductive portion. A polarity of the first input terminal is set to be opposite to a polarity of each of the second input terminal and the third input terminal.

公开(公告)号：US12057426B2

公开(公告)日：2024-08-06

申请号：US18421658

申请日：2024-01-24

Applicant: ROHM CO., LTD.

Inventor： Kenji Hayashi ,  Kohei Tanikawa ,  Ryosuke Fukuda

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07

CPC classification number: H01L24/40 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29575 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40101 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/73263 ,  H01L2224/8383 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/35121

Abstract: A semiconductor module includes: a first conductive portion; a second conductive portion spaced from the first conductive portion in a first direction; first semiconductor elements electrically bonded to the first conductive portion and mutually spaced in a second direction perpendicular to the first direction; and second semiconductor elements electrically bonded to the second conductive portion and mutually spaced in the second direction. The semiconductor module further includes: a first input terminal electrically connected to the first conductive portion; a second input terminal of opposite polarity to the first input terminal; and an output terminal opposite from the two input terminals in the first direction and electrically connected to the second conductive portion. The semiconductor module further includes: a first conducting member connected to the first semiconductor elements and second conductive portion; and a second conducting member connected to the second semiconductor elements and second input terminal.

公开(公告)号：USD1034494S1

公开(公告)日：2024-07-09

申请号：US29912887

申请日：2023-09-25

Applicant: ROHM CO., LTD.

Designer： Kohei Tanikawa ,  Kenji Hayashi

Abstract: FIG. 1 is a front, top, and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a left side view thereof;
FIG. 8 is an enlarged view of the portion indicated by line 8-8 in FIG. 6; and,
FIG. 9 is an enlarged view of the portion indicated by line 9-9 in FIG. 7.
The broken lines illustrate portions of the semiconductor device that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.