公开(公告)号：US20180115260A1

公开(公告)日：2018-04-26

申请号：US15405407

申请日：2017-01-13

Applicant: Seiki CHIBA ,  Mikio WAKI ,  ROHM CO., LTD. ,  KUREHA ELASTOMER CO., LTD.

Inventor： Seiki CHIBA ,  Mikio WAKI ,  Yoshinori TANAKA ,  Kuniyoshi OKAMOTO ,  Kazuya NAGASE ,  Naoaki TSURUMI ,  Syo KURITA ,  Makoto TAKASUGI ,  Nobuhiro MIYAGI

IPC: H02N2/04

CPC classification number: H02N2/046

Abstract: A dielectric elastomer motor includes an artificial muscle and a conversion mechanism cooperating with the artificial muscle. The artificial muscle includes a dielectric elastomer film or layer having a first surface and a second surface opposite to the first surface. First and second electrodes are attached to the first surface and the second surface of the dielectric elastomer film, respectively. First and second bases are attached to the dielectric elastomer so as to be spaced apart from each other. The first base and the second base are capable of reciprocation relative to each other upon change in size of the dielectric elastomer. The conversion mechanism converts the reciprocation of the bases to pivotal or rotational movement. The dielectric elastomer receives voltage application with a predetermined timing via the first and the second electrodes.

公开(公告)号：US20150155684A1

公开(公告)日：2015-06-04

申请号：US14618483

申请日：2015-02-10

Applicant: ROHM CO., LTD.

Inventor： Junichi KASHIWAGI ,  Kuniyoshi OKAMOTO ,  Taketoshi TANAKA ,  Masashi KUBOTA

IPC: H01S5/02 ,  H01S5/343 ,  H01S5/22

CPC classification number: H01S5/0202 ,  B82Y20/00 ,  H01S5/0287 ,  H01S5/2009 ,  H01S5/22 ,  H01S5/2201 ,  H01S5/305 ,  H01S5/3063 ,  H01S5/3201 ,  H01S5/3202 ,  H01S5/3211 ,  H01S5/34333 ,  H01S2301/176

Abstract: A method for manufacturing a semiconductor laser device includes preparing an original substrate having a plurality of semiconductor laser device regions arrayed in a matrix, and a plurality of ridges formed in stripes so as to pass through each of the plurality of semiconductor laser device regions that are aligned in one direction. A scribing process is applied to the original substrate along cutting lines set along boundaries of the plurality of semiconductor laser device regions from a rear surface at an opposite side of a top surface at which the ridges are formed. A blade is applied to the original substrate along each cutting line from the top surface of the original substrate for dividing the original substrate along the cutting line.

Abstract translation: 一种半导体激光装置的制造方法，其特征在于，准备具有排列成矩阵状的多个半导体激光装置区域的原版基板，以及形成为条状的多个脊，以穿过所述多个半导体激光装置区域 在一个方向对齐。 沿着形成有脊的上表面的相对侧的后表面沿着沿着多个半导体激光器装置区域的边界设置的切割线，对原始基板进行划线处理。 沿着原始基板的顶表面沿着每个切割线将原始基板施加到原始基板上，以沿着切割线分割原始基板。

公开(公告)号：US20170155032A1

公开(公告)日：2017-06-01

申请号：US15362461

申请日：2016-11-28

Applicant: Seiki CHIBA ,  Mikio WAKI ,  ROHM CO., LTD.

Inventor： Seiki CHIBA ,  Mikio WAKI ,  Yoshinori TANAKA ,  Kuniyoshi OKAMOTO ,  Kazuya NAGASE ,  Naoaki TSURUMI

IPC: H01L41/09 ,  H01L41/047

CPC classification number: H01L41/09 ,  B25J15/0009 ,  H01L41/047 ,  H01L41/0986 ,  H02N2/046

Abstract: A dielectric elastomer driving mechanism includes a driver, a follower, and a power transmitter. The driver includes a dielectric elastomer driving element made up of a dielectric elastomer layer and two electrode layers sandwiching the dielectric elastomer layer. The driver also includes a tension maintaining element maintaining, in a no-voltage state, the dielectric elastomer driving element in a state in which tension occurs, and includes an output portion capable of moving along with the expanding or contracting of the dielectric elastomer driving element. The follower includes a following element actuating in accordance with a driving force inputted. The power transmitter is connected to the output portion of the driver for transmitting a driving force of the driver to the follower.