公开(公告)号：US20170271310A1

公开(公告)日：2017-09-21

申请号：US15613694

申请日：2017-06-05

Applicant: ROHM CO., LTD.

Inventor： Takashi MORIGUCHI ,  Masahiko KOBAYAKAWA

IPC: H01L25/075 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED module includes a substrate having a main surface and a rear surface located opposite the main surface, a main surface electrode located on the main surface, a plurality of penetration electrodes connected to the main surface electrode and extending through the substrate, three or more LED chips arranged on the main surface electrode along a first direction, and a case arranged on the main surface to surround the main surface electrode. The LED chips include at least one LED chip that can emit red light, at least one LED chip that can emit green light and at least one LED chip that can emit blue light.

公开(公告)号：US20170186735A1

公开(公告)日：2017-06-29

申请号：US15455236

申请日：2017-03-10

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Takashi MORIGUCHI

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes.

公开(公告)号：US20150235996A1

公开(公告)日：2015-08-20

申请号：US14703169

申请日：2015-05-04

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Takashi MORIGUCHI

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes.

Abstract translation: LED模块包括基板，由基板的主表面支撑的一个或多个LED芯片和布线。 基板具有从主表面贯穿到后表面的一个或多个通孔。 布线形成在基板上并与LED芯片导通。 布线包括形成在主表面上并与LED芯片，后表面上形成的后表面电极以及在焊盘和后表面电极之间形成导电并且形成在 通孔的内侧。