公开(公告)号：US20140225265A1

公开(公告)日：2014-08-14

申请号：US13976192

申请日：2012-03-29

申请人： Rajen S. Sidhu ,  Ashay A. Dadi ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Ashay A. Dadi ,  Martha A. Dudek

IPC分类号： H01L23/532 ,  H01L21/768

CPC分类号： H01L23/53209 ,  H01L21/76882 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16507 ,  H01L2224/81191 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/00

摘要： Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.

摘要翻译： 互连封装技术，用于直接芯片连接，封装封装或一级和二级互连叠层，相对于球技术，Z高度降低。 在实施例中，单层或多层互连结构以允许例如基于功能来定制封装内的特定互连的电气和机械特性之一或两者的方式被沉积。 功能性封装互连可以改变至少材料层组成，层厚度，层数或多个材料中的一个以实现特定功能，例如基于互连部件的应用或应用 整个集会。 在实施例中，多层叠层结构的参数取决于衬底区域内的互连位置，例如具有较高应力的互连位置处具有较高延展性的结构。