公开(公告)号：US06590313B2

公开(公告)日：2003-07-08

申请号：US09963756

申请日：2001-09-26

申请人： Vivek Agrawal ,  Robert L. Wood ,  Ramaswamy Mahadevan

发明人： Vivek Agrawal ,  Robert L. Wood ,  Ramaswamy Mahadevan

IPC分类号： H02N1100

CPC分类号： H02N10/00 ,  H01H1/0036 ,  H01H2001/0042

摘要： A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches.

公开(公告)号：US06400550B1

公开(公告)日：2002-06-04

申请号：US09860213

申请日：2001-05-18

申请人： Robert L. Wood ,  Vivek Agrawal ,  Ramaswamy Mahadevan ,  Edward A. Hill

发明人： Robert L. Wood ,  Vivek Agrawal ,  Ramaswamy Mahadevan ,  Edward A. Hill

IPC分类号： H01G501

CPC分类号： H01G5/16 ,  B81B3/0056

摘要： A variable capacitor is provided having first and second capacitor plates, a tandem mover and an actuator. The first and second capacitor plates are positioned such that the first and second capacitor plates face one another in a spaced apart relationship. The tandem mover is configured to move the first and second capacitor plates in tandem in response to changes in ambient temperature to maintain a consistent spaced apart relationship between the capacitor plates. The actuator is then configured to vary the spaced apart relationship between the first and second capacitor plates in response to an external input. The capacitance of the variable capacitor can therefore be varied by increasing and decreasing the spaced apart relationship between the first and second capacitor plates.

摘要翻译： 提供具有第一和第二电容器板，串联移动器和致动器的可变电容器。 第一和第二电容器板被定位成使得第一和第二电容器板以间隔开的关系彼此面对。 串联移动器被配置成响应于环境温度的变化串联地移动第一和第二电容器板，以保持电容器板之间的一致的间隔开的关系。 致动器然后被配置成响应于外部输入而改变第一和第二电容器板之间的间隔开的关系。 因此，可变电容器的电容可以通过增加和减小第一和第二电容器板之间的间隔开的关系来改变。

公开(公告)号：US06618518B1

公开(公告)日：2003-09-09

申请号：US09721415

申请日：2000-11-22

申请人： Ramaswamy Mahadevan ,  Vivek Agrawal

发明人： Ramaswamy Mahadevan ,  Vivek Agrawal

IPC分类号： G02B626

CPC分类号： G02B6/357 ,  G02B6/3518 ,  G02B6/3542 ,  G02B6/3546 ,  G02B6/358 ,  G02B6/3584 ,  H04Q11/0005 ,  H04Q2011/0024 ,  H04Q2011/003 ,  H04Q2011/0039 ,  H04Q2011/0058

摘要： Optical cross-connect switches include input optical paths, output optical paths, and an array of electromechanical optical switches such as movable reflectors that are arranged in rows of the electromechanical optical switches and columns of the electromechanical optical switches, and that selectively move to couple the input optical paths to the output optical paths. Row address lines also are provided, a respective one of which is electromagnetically (i.e. electrically and/or optically) coupled to a respective row of the electromechanical optical switches. Column address lines also are provided, a respective one of which is electromagnetically coupled to a respective column of the electromechanical optical switches. If there are n2 electromechanical optical switches that couple n optical paths to n optical output paths, less than n2 row and column address lines may be provided. Preferably, 2n row and column address lines may be provided. The electromechanical optical switches may be configured upon selection of the respective row address line and column address line, but not selected upon selection of neither or only one of the respective row address line and column address line. Alternatively, the electromechanical optical switches may be configured to be selected except for an electromechanical optical switch that is electromagnetically coupled to the respective row address line and column address line.

摘要翻译： 光学交叉连接开关包括输入光路，输出光路，以及诸如可移动反射器的机电光学开关的阵列，其被布置成机电光开关的列和机电光开关的列，并且选择性地移动以耦合 输入光路到输出光路。 还提供了行地址线，其相应的一个电磁（即电和/或光）耦合到机电光开关的相应行。 还提供列地址线，其相应的一个电磁耦合到机电光开关的相应列。 如果存在将n个光路耦合到n个光输出路径的n2个机电光开关，则可以提供少于n2行和列地址线。 优选地，可以提供2n行和列地址行。 可以在选择相应的行地址线和列地址线之后配置机电光学开关，但是在选择相应的行地址线和列地址线中的一个或仅一个之后不进行选择。 或者，机电式光开关可以被配置为除了电磁耦合到相应行地址线和列地址线的机电光开关之外。

公开(公告)号：US09601677B2

公开(公告)日：2017-03-21

申请号：US13048191

申请日：2011-03-15

申请人： Edward P. Siivola ,  Ramaswamy Mahadevan

发明人： Edward P. Siivola ,  Ramaswamy Mahadevan

IPC分类号： H01L35/32

CPC分类号： H01L35/32

摘要： A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

公开(公告)号：US20110220162A1

公开(公告)日：2011-09-15

申请号：US13048191

申请日：2011-03-15

申请人： Edward P. Siivola ,  Ramaswamy Mahadevan

发明人： Edward P. Siivola ,  Ramaswamy Mahadevan

IPC分类号： H01L35/28

CPC分类号： H01L35/32

摘要： A thermoelectric structure may include a thermally conductive substrate, and a plurality of thermoelectric elements arranged on a surface of the thermally conductive substrate. Moreover, each thermoelectric element may be non-parallel and non-orthogonal with respect to the surface of the thermally conductive substrate. For example, each of thermoelectric elements may be a planar thermoelectric element, and a plane of each of the thermoelectric elements may be oriented obliquely with respect to the surface of the thermally conductive substrate.

摘要翻译： 热电结构可以包括导热基板和布置在导热基板的表面上的多个热电元件。 此外，每个热电元件可以相对于导热基板的表面是不平行的和非正交的。 例如，每个热电元件可以是平面热电元件，并且每个热电元件的平面可以相对于导热基板的表面倾斜地取向。

公开(公告)号：US06396975B1

公开(公告)日：2002-05-28

申请号：US09489264

申请日：2000-01-21

申请人： Robert L. Wood ,  Edward A. Hill ,  Ramaswamy Mahadevan

发明人： Robert L. Wood ,  Edward A. Hill ,  Ramaswamy Mahadevan

IPC分类号： G02B626

CPC分类号： G02B6/3572 ,  G02B6/3512 ,  G02B6/3546 ,  G02B6/3582 ,  G02B6/3584 ,  G02B26/085

摘要： A microelectromechanical structure capable of switching optical signals from an input fiber to one of two or more output fibers. In one embodiment, the MEMS optical cross-connect switch comprises a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a rotational magnetic field source, such as a variably controlled magnetic field source. The rotational magnetic field source allows for reliable actuation of the pop-up mirror from a non-reflective state to a reflective state. Additionally the invention is embodied in a MEMS optical cross-connect switch having a first microelectronic substrate having a pop-up mirror disposed on the surface of the substrate and a positioning structure disposed in a fixed positional relationship relative to the first substrate. The positioning structure may comprise a positioning structure extending from a second microelectronic substrate that is in a fixed positional relationship relative to the first microelectronic substrate. The positioning structure serves to restrict further movement of the pop-up mirror when the pop-up mirror has been actuated into a reflective state.

摘要翻译： 一种能够将光信号从输入光纤切换到两个或更多个输出光纤之一的微机电结构。 在一个实施例中，MEMS光学交叉连接开关包括具有设置在基板的表面上的弹出反射镜的第一微电子基板和诸如可变控制的磁场源的旋转磁场源。 旋转磁场源允许将弹出反射镜从非反射状态可靠地致动到反射状态。 另外，本发明体现在具有第一微电子衬底的MEMS光学交叉连接开关中，第一微电子衬底具有设置在衬底的表面上的弹出反射镜和相对于第一衬底以固定位置关系设置的定位结构。 定位结构可以包括从相对于第一微电子衬底处于固定位置关系的第二微电子衬底延伸的定位结构。 当弹起反射镜已经被启动成反射状态时，定位结构用于限制弹出反射镜的进一步移动。

公开(公告)号：US06262512B1

公开(公告)日：2001-07-17

申请号：US09436939

申请日：1999-11-08

申请人： Ramaswamy Mahadevan

发明人： Ramaswamy Mahadevan

IPC分类号： H02N1000

CPC分类号： H01H1/0036 ,  F16K31/002 ,  H01H61/02 ,  H01H2061/006

摘要： Microelectromechanical structures include a microelectronic substrate and spaced apart supports on the microelectronic substrate. A beam extends between the spaced apart supports and expands upon application of heat thereto, to thereby cause displacement of the beam between the spaced apart supports. The application of heat to the beam creates a thermal conduction path from the beam through the spaced apart supports and into the substrate. A thermal isolation structure in the heat conduction path reduces thermal conduction from the beam, through the spaced apart supports and into the substrate, compared to absence of the thermal isolation structure. The thermal isolation structure preferably has lower thermal conductivity than the beam and the supports. The heat that remains in the beam thereby can be increased. The thermal isolation structure may include a thermally insulating structure at each end of the beam, a thermally insulating structure in each spaced apart support, a thermally insulating structure in the substrate adjacent each spaced apart support, and/or at least one thermally insulating structure in the beam. Accordingly, improved thermal efficiency for microelectromechanical structures may be provided, to thereby allow lower power, higher deflection, larger force and/or higher speed.

摘要翻译： 微机电结构包括微电子衬底和微电子衬底上的间隔开的支撑。 梁在间隔开的支撑件之间延伸并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。 向梁施加热量产生从光束通过间隔开的支撑件并进入衬底的热传导路径。 与不存在热隔离结构相比，热传导路径中的热隔离结构减少了来自梁的热传导，通过间隔开的支撑件并进入衬底。 隔热结构优选具有比梁和支撑件更低的热导率。 由此可以增加留在光束中的热量。 热隔离结构可以包括在梁的每个端部处的隔热结构，每个间隔开的支撑件中的隔热结构，邻近每个间隔开的支撑件的衬底中的隔热结构，和/或至少一个隔热结构 梁。 因此，可以提供用于微机电结构的改善的热效率，从而允许更低的功率，更高的偏转，更大的力和/或更高的速度。

公开(公告)号：US5311305A

公开(公告)日：1994-05-10

申请号：US906916

申请日：1992-06-30

申请人： Ramaswamy Mahadevan ,  Vishvjit S. Nalwa

发明人： Ramaswamy Mahadevan ,  Vishvjit S. Nalwa

IPC分类号： G06T7/60 ,  G01S3/786 ,  G06T7/20 ,  H04N7/18 ,  H04N7/26 ,  H04N7/36

CPC分类号： G01S3/7864 ,  G06T7/2033 ,  H04N19/523 ,  H04N19/54 ,  H04N7/183

摘要： Edges/corners in an image can be detected and tracked over time by first sampling the image at periodic time intervals, and then processing the samples to obtain the intensity value for each pixel within each image acquired at a particular time. For each pixel, the bidirectional intraframe correlation of its intensity with the intensities of pixels along each of several directions within the same image is computed. Also, the bidirectional interframe correlation of the intensity of each pixel in each image with the intensities of pixels along each of several directions spanning several images is established. The intraframe and interframe intensity correlations are processed to obtain spatiotemporal tangent information about isobrightness surfaces and curves which are indicative of edges and corners, respectively, and their image motions.

摘要翻译： 可以通过以周期性的时间间隔首先对图像进行采样，然后对样本进行处理以获得在特定时间获取的每个图像内的每个像素的强度值，从而可以随时间检测和跟踪图像中的边缘/角落。 对于每个像素，计算其强度与同一图像内的每个方向上的像素强度的双向帧内相关性。 此外，建立了每个图像中的每个像素的强度与横跨几个图像的多个方向上的每个像素的强度的双向帧间相关。 处理帧内和帧间强度相关性以获得关于分别表示边缘和角的等亮面和曲线的时空切线信息及其图像运动。

公开(公告)号：US20100252087A1

公开(公告)日：2010-10-07

申请号：US12731546

申请日：2010-03-25

申请人： Philip A. Deane ,  Ramaswamy Mahadevan ,  Edward P. Siivola

发明人： Philip A. Deane ,  Ramaswamy Mahadevan ,  Edward P. Siivola

IPC分类号： H01L35/20 ,  H01L35/00 ,  B05D5/12 ,  B29C65/56

CPC分类号： H01L35/08 ,  H01L35/32

摘要： A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.

摘要翻译： 热电装置可以包括包括热电材料层并具有相对的第一和第二表面的热电元件。 可以在热电元件的第一表面上设置第一金属焊盘，并且可以在热电元件的第二表面上设置第二金属焊盘。 此外，第一和第二金属焊盘可以在相对于热电元件的第一和第二表面平行的方向上偏移。 还讨论了相关方法。

公开(公告)号：US06229684B1

公开(公告)日：2001-05-08

申请号：US09461247

申请日：1999-12-15

申请人： Allen Bruce Cowen ,  Vijayakumar Rudrappa Dhuler ,  Edward Arthur Hill ,  David Alan Koester ,  Ramaswamy Mahadevan

发明人： Allen Bruce Cowen ,  Vijayakumar Rudrappa Dhuler ,  Edward Arthur Hill ,  David Alan Koester ,  Ramaswamy Mahadevan

IPC分类号： H01G501

CPC分类号： H01G5/18 ,  B81B3/0056 ,  F03G7/06 ,  H01G5/16 ,  H01H1/0036 ,  H01H59/0009 ,  H01H61/02 ,  H01H2059/0063 ,  H01H2059/0072 ,  H01H2059/0081 ,  H01H2061/006

摘要： A variable capacitor having low loss and a correspondingly high Q is provided. In addition to a substrate, the variable capacitor includes at least one substrate electrode and a substrate capacitor plate that are disposed upon the substrate and formed of a low electrical resistance material, such as HTS material or a thick metal layer. The variable capacitor also includes a bimorph member extending outwardly from the substrate and over the at least one substrate electrode. The bimorph member includes first and second layers formed of materials having different coefficients of thermal expansion. The first and second layers of the bimorph member define at least one bimorph electrode and a bimorph capacitor plate such that the establishment of a voltage differential between the substrate electrode and the bimorph electrode moves the bimorph member relative to the substrate electrode, thereby altering the interelectrode spacing as well as the distance between the capacitor plates. As such, the capacitance of the variable capacitor can be controlled based upon the relative spacing between the bimorph member and the underlying substrate. A method is also provided for micromachining or otherwise fabricating a variable capacitor having an electrode and a capacitor plate formed of a low electrical resistance material such that the resulting variable capacitor has low loss and a correspondingly high Q. The variable capacitor can therefore be employed in high frequency applications, such as required by some tunable filters.

摘要翻译： 提供具有低损耗和相应高Q的可变电容器。 除了基板之外，可变电容器包括至少一个基板电极和基板电容器板，其设置在基板上并且由诸如HTS材料或厚金属层的低电阻材料形成。 可变电容器还包括从基板向外延伸并且在至少一个基板电极上方的双压电晶片。 双压电晶片构件包括由具有不同热膨胀系数的材料形成的第一和第二层。 双压电晶片构件的第一和第二层限定至少一个双压电晶片电极和双压电晶片电容器板，使得在衬底电极和双压电晶片电极之间建立电压差使得双压电晶片相对于衬底电极移动，从而改变电极间 间距以及电容器板之间的距离。 因此，可以基于双压电晶片构件和下面的衬底之间的相对间隔来控制可变电容器的电容。 还提供了一种用于微加工或以其他方式制造具有由低电阻材料形成的电极和电容器板的可变电容器的方法，使得所得到的可变电容器具有低损耗和相应高的Q.因此可变电容器可用于 高频应用，如某些可调谐滤波器所要求的。