-
公开(公告)号：US06880140B2
公开(公告)日：2005-04-12
申请号：US10454027
申请日：2003-06-04
申请人： Ramon Gonzales , Kevin Cota , Manu Rehani , David Abercrombie
发明人： Ramon Gonzales , Kevin Cota , Manu Rehani , David Abercrombie
IPC分类号： G01R31/26 , G06F11/30 , G06F15/00 , G06F17/18 , G06F17/50 , G06F19/00 , G06M11/04 , H01L21/66 , H01L23/58 , H01L29/10
CPC分类号： H01L22/20
摘要： A method and system for selectively identifying reliability risk die based on characteristics of local regions on a wafer by computing particle sensitive yield and using the particle sensitive yield to identify reliability risk die. Specifically, a bin characteristics database which identifies hard and soft bins that are sensitive to different failure mechanisms is maintained, and the bin characteristics database is used to compute particle sensitive yield. It is determined whether the particle sensitive yield of the local region around the current die is less than a pre-set threshold, and the die is downgraded if the particle sensitive yield of the local region around the current die is less than the pre-set threshold. If the particle sensitive yield of the local region around the current die is not less than the pre-set threshold, the die is not downgraded.
-
2.发明授权Method to selectively identify reliability risk die based on characteristics of local regions on the wafer 有权基于晶片上局部区域的特性来选择性地识别可靠性风险的方法公开(公告)号：US07390680B2
公开(公告)日：2008-06-24
申请号：US11031564
申请日：2005-01-06
申请人： Ramon Gonzales , Kevin Cota , Manu Rehani , David Abercrombie
发明人： Ramon Gonzales , Kevin Cota , Manu Rehani , David Abercrombie
IPC分类号： G01R31/26
CPC分类号： H01L22/20
摘要： A method and system for selectively identifying reliability risk die based on characteristics of local regions on a wafer by computing particle sensitive yield and using the particle sensitive yield to identify reliability risk die. Specifically, a bin characteristics database which identifies hard and soft bins that are sensitive to different failure mechanisms is maintained, and the bin characteristics database is used to compute particle sensitive yield. It is determined whether the particle sensitive yield of the local region around the current die is less than a pre-set threshold, and the die is downgraded if the particle sensitive yield of the local region around the current die is less than the pre-set threshold. If the particle sensitive yield of the local region around the current die is not less than the pre-set threshold, the die is not downgraded.
摘要翻译： 通过计算粒子敏感产量和使用粒子敏感产量来识别可靠性风险死亡，通过基于晶片上局部区域的特征来选择性地识别可靠性风险的方法和系统。 具体来说，维护识别对不同故障机制敏感的硬盒和软盒的bin特征数据库，并且使用bin特征数据库来计算粒子敏感产量。 确定当前管芯周围的局部区域的粒子敏感产率是否小于预设阈值，并且如果当前管芯周围的局部区域的粒子敏感产率小于预设阈值，则管芯被降级 阈。 如果当前管芯周围的局部区域的粒子敏感产量不小于预设阈值，则管芯不会降级。
-
3.发明申请Method to selectively identify reliability risk die based on characteristics of local regions on the wafer 有权基于晶片上局部区域的特性来选择性地识别可靠性风险的方法公开(公告)号：US20050145841A1
公开(公告)日：2005-07-07
申请号：US11031564
申请日：2005-01-06
申请人： Ramon Gonzales , Kevin Cota , Manu Rehani , David Abercrombie
发明人： Ramon Gonzales , Kevin Cota , Manu Rehani , David Abercrombie
IPC分类号： G01R31/26 , G06F11/30 , G06F15/00 , G06F17/18 , G06F17/50 , G06F19/00 , G06M11/04 , H01L21/66 , H01L23/58 , H01L29/10
CPC分类号： H01L22/20
摘要： A method and system for selectively identifying reliability risk die based on characteristics of local regions on a wafer by computing particle sensitive yield and using the particle sensitive yield to identify reliability risk die. Specifically, a bin characteristics database which identifies hard and soft bins that are sensitive to different failure mechanisms is maintained, and the bin characteristics database is used to compute particle sensitive yield. It is determined whether the particle sensitive yield of the local region around the current die is less than a pre-set threshold, and the die is downgraded if the particle sensitive yield of the local region around the current die is less than the pre-set threshold. If the particle sensitive yield of the local region around the current die is not less than the pre-set threshold, the die is not downgraded.
摘要翻译： 通过计算粒子敏感产量和使用粒子敏感产量来识别可靠性风险死亡，通过基于晶片上局部区域的特征来选择性地识别可靠性风险的方法和系统。 具体来说，维护识别对不同故障机制敏感的硬盒和软盒的bin特征数据库，并且使用bin特征数据库来计算粒子敏感产量。 确定当前管芯周围的局部区域的粒子敏感产率是否小于预设阈值，并且如果当前管芯周围的局部区域的粒子敏感产率小于预设阈值，则管芯被降级 阈。 如果当前管芯周围的局部区域的粒子敏感产量不小于预设阈值，则管芯不会降级。
-
4.发明授权Adaptive off tester screening method based on intrinsic die parametric measurements 失效基于固有参数测量的自适应测试仪筛选方法公开(公告)号：US06807655B1
公开(公告)日：2004-10-19
申请号：US10197956
申请日：2002-07-16
申请人： Manu Rehani , Kevin Cota , David Abercrombie , Robert Madge
发明人： Manu Rehani , Kevin Cota , David Abercrombie , Robert Madge
IPC分类号： G06F1750
CPC分类号： H01L22/20 , H01L21/67017
摘要： A method for adaptively providing parametric limits to identify defective die quantizes the die into a plurality of groups according to statistical distributions, such as intrinsic speed in one embodiment. For each quantization level, an intrinsic distribution of the parameter is derived. Adaptive screening limits are then set as a function of the intrinsic distribution. Dies are then screened according to their parametric values with respect to the adaptive limits.
摘要翻译： 一种用于自适应地提供参数限制以识别有缺陷的模具的方法根据统计分布（例如在一个实施例中的固有速度）将模具量化为多个组。 对于每个量化级别，导出参数的内在分布。 然后将自适应筛选限值设置为内在分布的函数。 然后根据自适应极限的参数值对模具进行筛选。
-
公开(公告)号：US20060059452A1
公开(公告)日：2006-03-16
申请号：US10927802
申请日：2004-08-27
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , H01L21/70
摘要： A method for determining component patterns of a raw substrate map. A subset of substrate patterns is selected from a set of substrate patterns, and combined into a composite substrate map. The substrate patterns are weighted. The composite substrate map is compared to the raw substrate map, and a degree of correlation between the composite substrate map and the raw substrate map is determined. The steps are iteratively repeated until the degree of correlation is at least a desired degree, and the weighted subset of substrate patterns is output as the component patterns of the raw substrate map.
-
公开(公告)号：US07454387B2
公开(公告)日：2008-11-18
申请号：US10663218
申请日：2003-09-15
CPC分类号： G05B23/0254
摘要： A method of isolating sources of variance in parametric data includes steps of: (a) cleaning a data set of measurements for a plurality of parameters; (b) generating a principal component analysis basis from the cleaned data set; (c) estimating an independent component analysis model from the principal component analysis basis; (d) calculating percentages of variance for the plurality of parameters explained by each component in the estimated independent component analysis model; (e) if the calculated percentages of variance indicate that a component is a minor component, then transferring control to step (f), else transferring control to step (g); (f) removing the minor component from the principal component analysis basis and transferring control to step (c); and (g) generating as output the estimated independent component analysis model wherein no component of the independent component analysis model is a minor component.
摘要翻译： 一种隔离参数数据方差源的方法包括以下步骤：（a）清洁多个参数的测量数据集; （b）从清理的数据集中生成主成分分析基础; （c）从主成分分析的基础上估计独立成分分析模型; （d）计算由估计的独立分量分析模型中的每个分量解释的多个参数的方差百分比; （e）如果计算的方差百分比表示组分是次要组分，则将控制转移到步骤（f），否则将控制转移到步骤（g）; （f）从主成分分析基础中除去次要组分，并将控制转移到步骤（c）; 和（g）生成估计的独立分量分析模型作为输出，其中独立分量分析模型的分量不是次要分量。
-
公开(公告)号：US06980917B2
公开(公告)日：2005-12-27
申请号：US10334430
申请日：2002-12-30
申请人： Mark Ward , David Abercrombie , Larry Kelley
发明人： Mark Ward , David Abercrombie , Larry Kelley
CPC分类号： G03F7/70433
摘要： A method of increasing the wafer yield for an integrated circuit includes the steps of receiving as input a shot map, an initial orientation of a center of the shot map relative to a center of a wafer resulting in a maximum number of printable die, a usable wafer diameter, a selected yield margin, and historical yield information for each die location in the shot map; generating a plot of an estimated yield for each die location in the wafer from the historical yield information; plotting an estimated wafer yield within an area of the wafer as a function of a radius; and selecting a sweet spot radius corresponding to an area of the wafer having a wafer yield that is substantially equal to the selected yield margin for finding an offset from the initial orientation of the center of the shot map that results in a maximum wafer yield.
摘要翻译： 增加集成电路的晶片产量的方法包括以下步骤：接收射击图，拍摄图的中心相对于晶片的中心的初始取向，导致最大可打印模数，可用 晶圆直径，选定的收益率以及拍摄地图中每个模具位置的历史收益率信息; 从历史产量信息生成晶片中每个模具位置的估计产量的图; 在晶片的区域内绘制估计的晶片产量作为半径的函数; 以及选择对应于具有基本上等于所选择的收益率边缘的晶圆产量的晶圆的区域的甜点半径，以便从导致最大晶片产量的射出图的中心的初始取向偏移。
-
公开(公告)号：US20050060336A1
公开(公告)日：2005-03-17
申请号：US10663218
申请日：2003-09-15
CPC分类号： G05B23/0254
摘要： A method of isolating sources of variance in parametric data includes steps of: (a) cleaning a data set of measurements for a plurality of parameters; (b) generating a principal component analysis basis from the cleaned data set; (c) estimating an independent component analysis model from the principal component analysis basis; (d) calculating percentages of variance for the plurality of parameters explained by each component in the estimated independent component analysis model; (e) if the calculated percentages of variance indicate that a component is a minor component, then transferring control to step (f), else transferring control to step (g); (f) removing the minor component from the principal component analysis basis and transferring control to step (c); and (g) generating as output the estimated independent component analysis model wherein no component of the independent component analysis model is a minor component.
摘要翻译： 一种隔离参数数据方差源的方法包括以下步骤：（a）清洁多个参数的测量数据集; （b）从清理的数据集中生成主成分分析基础; （c）从主成分分析的基础上估计独立成分分析模型; （d）计算由估计的独立分量分析模型中的每个分量解释的多个参数的方差百分比; （e）如果计算的方差百分比表示组分是次要组分，则将控制转移到步骤（f），否则将控制转移到步骤（g）; （f）从主成分分析基础中除去次要组分，并将控制转移到步骤（c）; 和（g）生成估计的独立分量分析模型作为输出，其中独立分量分析模型的分量不是次要分量。
-
公开(公告)号：US07725849B2
公开(公告)日：2010-05-25
申请号：US11242633
申请日：2005-10-03
CPC分类号： G06F17/5009 , G06F17/5045 , G06F17/5068 , G06F2217/10 , G06F2217/12 , G06F2217/70 , Y02P90/265
摘要： Techniques are disclosed for determining the likelihood that a known feature in an integrated circuit design will cause a defect during the manufacturing process. According to some of these techniques, various logical units that incorporate an identified design feature are identified, and the amount that the design feature occurs in each of a plurality of these logical units is determined. The failure rate of integrated circuit portions corresponding to at least these logical units are then obtained. A feature failure coefficient indicating the likelihood that the feature will cause a defect then is determined by correlating the failure rates with the amount of occurrences of the feature.
摘要翻译： 公开了用于确定在制造过程中集成电路设计中的已知特征将导致缺陷的可能性的技术。 根据这些技术中的一些，识别并入了识别的设计特征的各种逻辑单元，并且确定设计特征在多个这些逻辑单元中的每一个中发生的量。 然后获得与至少这些逻辑单元对应的集成电路部分的故障率。 通过将故障率与特征的出现量相关联来确定指示特征将导致缺陷的可能性的特征故障系数。
-
公开(公告)号：US07460211B2
公开(公告)日：2008-12-02
申请号：US11383171
申请日：2006-05-12
CPC分类号： H01L21/02087 , G03F7/2028 , Y10S438/926
摘要： An apparatus includes an edge expose unit for exposing an annular area in an edge exclusion zone of a wafer to radiation having a wavelength suitable for removing a film from the wafer in the annular area and a radiation modulator coupled to the edge expose unit for modulating the radiation to pattern the film in the annular area.
摘要翻译： 一种装置包括边缘曝光单元，用于将晶片的边缘排除区域中的环形区域暴露于具有适于从环形区域中的晶片去除膜的波长的辐射以及耦合到边缘曝光单元的辐射调制器，用于调制 辐射以在环形区域中对膜进行图案化。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.022 秒)
