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1.发明授权公开(公告)号：US06987033B2
公开(公告)日：2006-01-17
申请号：US10921511
申请日：2004-08-19
CPC分类号： H01L21/4882 , H01L21/4857 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L24/31 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/83894 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
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2.发明授权Method for making electronic devices including silicon and LTCC and devices produced thereby 有权用于制造包括硅和LTCC的电子器件的方法以及由此产生的器件公开(公告)号：US06809424B2
公开(公告)日：2004-10-26
申请号：US09741754
申请日：2000-12-19
IPC分类号： H01L2348
CPC分类号： H01L21/4882 , H01L21/4857 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L24/31 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/83894 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
摘要翻译： 一种制造电子设备的方法包括定位第一和第二构件，使得其相对表面彼此接触，第一构件包括硅，第二构件包括低温共烧陶瓷（LTCC）材料。 该方法还包括将第一和第二构件的相对表面阳极结合在一起，以在其间形成气密密封。 阳极接合在不使用粘合剂的情况下在构件之间提供牢固且牢固的结合。 该方法还可以包括在第一和第二构件中的至少一个中形成至少一个冷却结构。 至少一个冷却结构可以包括第一构件中的至少一个第一微流体冷却结构，以及与第一微流体冷却结构对准的第二构件中的至少一个第二微流体冷却结构。
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3.发明申请Method for making electronic devices including silicon and LTCC and devices produced thereby 有权用于制造包括硅和LTCC的电子器件的方法以及由此产生的器件公开(公告)号：US20050019986A1
公开(公告)日：2005-01-27
申请号：US10921511
申请日：2004-08-19
申请人： Randy Pike , Charles Newton , Carol Gamlen , Raymond Rumpf , Betty O'Dowd
发明人： Randy Pike , Charles Newton , Carol Gamlen , Raymond Rumpf , Betty O'Dowd
IPC分类号： H01L21/48 , H01L23/373 , H01L23/427 , H01L23/473 , H01L21/44 , H01L21/50
CPC分类号： H01L21/4882 , H01L21/4857 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L24/31 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/83894 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
摘要翻译： 一种制造电子设备的方法包括定位第一和第二构件，使得其相对表面彼此接触，第一构件包括硅，第二构件包括低温共烧陶瓷（LTCC）材料。 该方法还包括将第一和第二构件的相对表面阳极结合在一起，以在其间形成气密密封。 阳极接合在不使用粘合剂的情况下在构件之间提供牢固且牢固的结合。 该方法还可以包括在第一和第二构件中的至少一个中形成至少一个冷却结构。 至少一个冷却结构可以包括第一构件中的至少一个第一微流体冷却结构，以及与第一微流体冷却结构对准的第二构件中的至少一个第二微流体冷却结构。
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