Methods and devices for sealing microchip reservoir devices
    1.
    发明授权
    Methods and devices for sealing microchip reservoir devices 失效
    密封微芯片储存装置的方法和装置

    公开(公告)号:US06730072B2

    公开(公告)日:2004-05-04

    申请号:US09867976

    申请日:2001-05-30

    IPC分类号: A61K922

    摘要: Methods and devices are provided for mechanically sealing the reservoirs of microchip devices to prevent leakage from or between any of the reservoirs. In one embodiment, the method includes sandwiching a microchip device and a gasket material covering the reservoir openings between a front sealing frame and a backplate, such that the gasket material is compressed against the back side of the microchip device by the back plate. The front sealing frame is secured to the back sealing plate using fasteners or welding. The gasket material is preferably a flexible polymeric sheet, which is biocompatible and compatible with the reservoir contents. In another embodiment, a composite backplate is used in place of the back sealing plate and separate gasket material. The composite backplate can include a substrate having sealing plugs defined thereon. The composite backplate also can be designed to hold the drug, thereby combining the assembly steps of reservoir filling and sealing.

    摘要翻译: 提供了用于机械密封微芯片装置的储存器的方法和装置,以防止任何储存器之间的泄漏。 在一个实施例中,该方法包括在前密封框架和背板之间夹着微芯片装置和覆盖储存器开口的衬垫材料,使得衬垫材料通过后板压靠在微芯片装置的后侧。 前密封框架使用紧固件或焊接固定到后密封板。 垫片材料优选是柔性聚合物片材,其是生物相容性的并且与储存器内容物相容。 在另一个实施例中,使用复合背板来代替后密封板和单独的衬垫材料。 复合背板可以包括其上限定有密封塞的基板。 复合背板也可以设计成保持药物,从而结合储液器填充和密封的组装步骤。

    Hermetically sealed microchip reservoir devices
    9.
    发明授权
    Hermetically sealed microchip reservoir devices 有权
    密封微芯片油藏装置

    公开(公告)号:US07497846B2

    公开(公告)日:2009-03-03

    申请号:US11005391

    申请日:2004-12-06

    IPC分类号: A61M5/00 A61K9/22

    CPC分类号: A61K9/0097

    摘要: Devices are provided for the controlled exposure or release of contents stored in hermetically sealed reservoirs. The devices comprise a primary substrate having a front side and a back side, and including one or more hermetic sealing materials; a plurality of reservoirs in the primary substrate positioned between the front side and the back side; reservoir contents, which comprise chemical molecules (such as drugs) or a secondary device (such as a glucose sensor), located inside the reservoirs; a hermetic sealing substrate having a surface composed of one or more hermetic sealing materials; and a hermetic seal formed between and joining the primary substrate and the hermetic sealing substrate, wherein the hermetic seal independently seals the reservoirs.

    摘要翻译: 提供了用于控制曝光或释放存储在密封储存器中的内容物的装置。 这些装置包括具有前侧和后侧的主基板,并且包括一个或多个密封材料; 位于前侧和后侧之间的主要基底中的多个储存器; 包括化学分子(如药物)或位于储存器内部的次级装置(如葡萄糖传感器)的储存器内容物; 具有由一种或多种密封材料构成的表面的气密密封基材; 以及形成在主基板和气密密封基板之间并与其接合的气密密封件,其中气密密封独立地密封储存器。

    Methods for hermetically sealing microchip reservoir devices
    10.
    发明授权
    Methods for hermetically sealing microchip reservoir devices 有权
    密封微芯片储液装置的方法

    公开(公告)号:US06827250B2

    公开(公告)日:2004-12-07

    申请号:US10184259

    申请日:2002-06-28

    IPC分类号: B23K106

    CPC分类号: A61K9/0097

    摘要: Methods are provided for hermetically sealing the reservoirs of microchip devices and for hermetically sealing the substrate assemblies in a hermetic packaging structure. In one embodiment, the method comprises (1) providing a primary substrate having a front side and a back side, the substrate comprising a plurality of reservoirs positioned between the front side and the back side, each reservoir being loaded with molecules or a secondary device for controlled release or exposure, the reservoirs having at least one opening in need of sealing, the primary substrate including one or more hermetic sealing materials; (2) providing a hermetic sealing substrate having a surface composed of one or more hermetic sealing materials; (3) positioning the hermetic sealing substrate over the reservoir openings and contacting said hermetic sealing materials of the primary substrate with said hermetic sealing materials of the hermetic sealing substrate; and (4) applying energy or a mechanical force to the contacted sealing materials effective to form a hermetic seal between the hermetic sealing substrate and the primary substrate to hermetically seal the reservoir openings.

    摘要翻译: 提供了用于气密地密封微芯片装置的储存器的方法,以及用于密封密封封装结构中的基板组件。 在一个实施例中,该方法包括(1)提供具有前侧和后侧的主基底,所述基底包括位于前侧和后侧之间的多个储存器,每个储存器装载有分子或辅助装置 为了控制释放或暴露,储存器具有至少一个需要密封的开口,主基底包括一个或多个气密密封材料; (2)提供具有由一种或多种密封材料构成的表面的气密密封基材; (3)将气密密封基板定位在储存器开口上,并使主基板的气密密封材料与气密密封基板的气密密封材料接触; 和(4)将能量或机械力施加到接触的密封材料上,以有效地在气密密封基底和初级基底之间形成气密密封,从而气密地密封储层开口。