公开(公告)号：US20240136302A1

公开(公告)日：2024-04-25

申请号：US18452829

申请日：2023-08-20

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Ryusei TAKAISHI

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L23/544 ,  H01L23/3157 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/54426 ,  H01L2224/05013 ,  H01L2224/48145 ,  H01L2224/48175 ,  H01L2224/78 ,  H01L2224/85125 ,  H01L2924/1305 ,  H01L2924/13091

Abstract: A bonding region is specified by having a horizontal line partially constituting crosshairs displayed on a monitor of a wire bonding apparatus superimposed on a first line segment of a first marker, and having a vertical line partially constituting the crosshairs superimposed on a first line segment of a second marker.

公开(公告)号：US20250140740A1

公开(公告)日：2025-05-01

申请号：US18921312

申请日：2024-10-21

Applicant: Renesas Electronics Corporation

Inventor： Ryusei TAKAISHI ,  Koichi HASEGAWA

IPC: H01L23/00

Abstract: A method of manufacturing a semiconductor device includes, after a wire bonding step, a step of determining a quality as to whether or not a whole of an end portion of a wire is located within a bonding region. A semiconductor chip includes a plurality of position determining opening patterns arranged in a region located around a main opening portion including the bonding region in plan view. The bonding region has a rectangular shape having an area smaller than an opening area of the main opening portion in plan view. The bonding region is defined by the plurality of position determining opening patterns.

公开(公告)号：US20240234331A9

公开(公告)日：2024-07-11

申请号：US18452829

申请日：2023-08-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Ryusei TAKAISHI

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L25/065 ,  H01L25/16

CPC classification number: H01L23/544 ,  H01L23/3157 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/54426 ,  H01L2224/05013 ,  H01L2224/48145 ,  H01L2224/48175 ,  H01L2224/78 ,  H01L2224/85125 ,  H01L2924/1305 ,  H01L2924/13091

Abstract: A bonding region is specified by having a horizontal line partially constituting crosshairs displayed on a monitor of a wire bonding apparatus superimposed on a first line segment of a first marker, and having a vertical line partially constituting the crosshairs superimposed on a first line segment of a second marker.