METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20250140740A1

    公开(公告)日:2025-05-01

    申请号:US18921312

    申请日:2024-10-21

    Abstract: A method of manufacturing a semiconductor device includes, after a wire bonding step, a step of determining a quality as to whether or not a whole of an end portion of a wire is located within a bonding region. A semiconductor chip includes a plurality of position determining opening patterns arranged in a region located around a main opening portion including the bonding region in plan view. The bonding region has a rectangular shape having an area smaller than an opening area of the main opening portion in plan view. The bonding region is defined by the plurality of position determining opening patterns.

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