公开(公告)号：US08541261B2

公开(公告)日：2013-09-24

申请号：US13666125

申请日：2012-11-01

Applicant: Renesas Electronics Corporation

Inventor： Takashi Kikuchi ,  Tomoaki Hashimoto ,  Tatsuya Hirai

IPC: H01L21/00

CPC classification number: H01L23/3128 ,  H01L21/565 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2224/03 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

Abstract: Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.

Abstract translation: 与微电脑芯片（半导体芯片）的焊盘（电极焊盘）电连接的端子（接合引线）配置在周边部分侧的焊盘上的凸起电极（导电部件）用密封树脂（密封体）密封。 此后，密封树脂被部分地研磨（去除），使得每个凸起电极的一部分露出。 在研磨步骤之后，执行从密封树脂的前表面突出每个凸起电极的一部分的步骤。