公开(公告)号：US20140054759A1

公开(公告)日：2014-02-27

申请号：US14070676

申请日：2013-11-04

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi DANNO ,  Hiroyoshi TAYA ,  Yoshiharu SHIMIZU

IPC: H01L23/495

CPC classification number: H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

Abstract translation: 非铅半导体器件包括用于密封半导体芯片的密封体，密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于密封体的后表面的外边缘部分的各个表面的引线 以及形成在半导体芯片和引线上的焊盘连接焊盘。 位于密封体的外周部的悬架引线的端部未被暴露在密封体的背面，而被密封体覆盖。 悬挂引线的分离部分不会在树脂模制中形成。 当切割悬挂引线时，密封体的后表面的角部由切割模具中的保持器部分的平坦部分支撑，该切割模具的面积大于悬挂引线的切割余量，从而防止树脂碎裂 。

公开(公告)号：US20250079389A1

公开(公告)日：2025-03-06

申请号：US18799362

申请日：2024-08-09

Applicant: Renesas Electronics Corporation

Inventor： Yoshiharu SHIMIZU

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/498

Abstract: In plan view, an electrode pad of a semiconductor chip includes: a first region that contains a center of an exposed portion of the electrode pad; a second region that is located around the first region; and a third region that is located around the first region and that is located between the first region and the second region. Here, a first groove that separates a plurality of semiconductor elements formed in a semiconductor substrate from each other is formed in the semiconductor substrate. The semiconductor substrate includes: a fourth region that overlaps with the third region but not overlaps with each of the first region and the second region, and a fifth region that overlaps with the first region but not overlaps with the third region. And, the first groove is formed in the semiconductor substrate at the fifth region but not at the fourth region.

公开(公告)号：US20180047677A1

公开(公告)日：2018-02-15

申请号：US15729374

申请日：2017-10-10

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi DANNO ,  Hiroyoshi TAYA ,  Yoshiharu SHIMIZU

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/544 ,  H01L21/78 ,  H01L21/67 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/83 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

公开(公告)号：US20160351512A1

公开(公告)日：2016-12-01

申请号：US15236143

申请日：2016-08-12

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi DANNO ,  Hiroyoshi TAYA ,  Yoshiharu SHIMIZU

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/78 ,  H01L21/56 ,  H01L23/544 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

Abstract translation: 非铅半导体器件包括用于密封半导体芯片的密封体，密封体内部的突片，用于支撑突片的悬挂引线，具有暴露于密封体的后表面的外边缘部分的各个表面的引线 以及形成在半导体芯片和引线上的焊盘连接焊盘。 位于密封体的外周部的悬架引线的端部未被暴露在密封体的背面，而被密封体覆盖。 悬挂引线的分离部分不会在树脂模制中形成。 当切割悬挂引线时，密封体的后表面的角部由具有比悬挂引线的切割余量宽的区域的切割模具中的保持器部分的平坦部分支撑，从而防止了树脂的碎裂 。

公开(公告)号：US20150235987A1

公开(公告)日：2015-08-20

申请号：US14702969

申请日：2015-05-04

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi DANNO ,  Hiroyoshi TAYA ,  Yoshiharu SHIMIZU

IPC: H01L23/00 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.

Abstract translation: 非铅半导体器件包括用于密封半导体芯片的密封体，密封体内部的凸片，用于支撑凸片的悬挂引线，具有暴露于密封体的后表面的外边缘部分的各个表面的引线 以及形成在半导体芯片和引线上的焊盘连接焊盘。 位于密封体的外周部的悬架引线的端部未被暴露在密封体的背面，而被密封体覆盖。 悬挂引线的分离部分不会在树脂模制中形成。 当切割悬挂引线时，密封体的后表面的角部由具有比悬挂引线的切割余量宽的区域的切割模具中的保持器部分的平坦部分支撑，从而防止了树脂的碎裂 。

公开(公告)号：US20190198477A1

公开(公告)日：2019-06-27

申请号：US16290804

申请日：2019-03-01

Applicant: Renesas Electronics Corporation

Inventor： Tadatoshi DANNO ,  Hiroyoshi TAYA ,  Yoshiharu SHIMIZU

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L21/67 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/544

CPC classification number: H01L24/83 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/67144 ,  H01L21/6715 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/544 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/3701 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented.