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42 条记录 (耗时 0.031 秒)

    METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
    1.
    发明申请
    METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
    用于抛光底物的方法和组合物

    公开(公告)号：US20090008600A1

    公开(公告)日：2009-01-08

    申请号：US11923400

    申请日：2007-10-24

    申请人： Renhe Jia ,  Feng Q. Liu ,  Stan D. Tsai ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  Feng Q. Liu ,  Stan D. Tsai ,  Liang-Yuh Chen

    IPC分类号： C09K13/00

    CPC分类号： B23H5/08 ,  C09G1/02 ,  C11D3/1213 ,  C11D3/124 ,  C11D3/14 ,  C11D3/3765 ,  C11D3/3947 ,  C11D11/0041 ,  C25F3/02 ,  C25F3/08 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684

    摘要： Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. Polishing compositions are provided for removing at least a barrier material from a substrate surface by a chemical mechanical polishing process or by an electrochemical mechanical polishing process. The polishing compositions used in barrier removal may further be used after a process for electrochemical mechanical planarization process of a conductive material. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization type defects.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料和阻挡材料的方法。 提供抛光组合物用于通过化学机械抛光工艺或通过电化学机械抛光工艺从衬底表面去除至少一种阻挡材料。 用于屏障去除的抛光组合物可以在导电材料的电化学机械平面化工艺的过程之后进一步使用。 本文所述的抛光组合物和方法改善了材料从衬底表面的有效去除速率，同时降低了平面化型缺陷。

    Method and composition for polishing a substrate
    2.
    发明授权
    Method and composition for polishing a substrate 失效
    抛光基材的方法和组合物

    公开(公告)号：US07390744B2

    公开(公告)日：2008-06-24

    申请号：US11130032

    申请日：2005-05-16

    申请人： Renhe Jia ,  Feng Q. Liu ,  Stan D. Tsai ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  Feng Q. Liu ,  Stan D. Tsai ,  Liang-Yuh Chen

    IPC分类号： H01L21/302

    CPC分类号： B23H5/08 ,  C09G1/02 ,  C11D3/1213 ,  C11D3/124 ,  C11D3/14 ,  C11D3/3765 ,  C11D3/3947 ,  C11D11/0041 ,  C25F3/02 ,  C25F3/08 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684

    摘要： Polishing compositions and methods for removing conductive materials and barrier materials from a substrate surface are provided. Polishing compositions are provided for removing at least a barrier material from a substrate surface by a chemical mechanical polishing process or by an electrochemical mechanical polishing process. The polishing compositions used in barrier removal may further be used after a process for electrochemical mechanical planarization process of a conductive material. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface with a reduction in planarization type defects.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料和阻挡材料的方法。 提供抛光组合物用于通过化学机械抛光工艺或通过电化学机械抛光工艺从衬底表面去除至少一种阻挡材料。 用于屏障去除的抛光组合物可以在导电材料的电化学机械平面化工艺的过程之后进一步使用。 本文所述的抛光组合物和方法改善了材料从衬底表面的有效去除速率，同时降低了平面化型缺陷。

    Method and apparatus for reduced wear polishing pad conditioning
    3.
    发明授权
    Method and apparatus for reduced wear polishing pad conditioning 失效
    降低磨损抛光垫调理的方法和装置

    公开(公告)号：US07210988B2

    公开(公告)日：2007-05-01

    申请号：US11209167

    申请日：2005-08-22

    申请人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    发明人： Yan Wang ,  Stan D. Tsai ,  Yongqi Hu ,  Feng Q. Liu ,  Liang-Yuh Chen ,  Daxin Mao ,  Huyen Karen Tran ,  Martin S. Wohlert ,  Renhe Jia ,  Yuan A. Tian

    IPC分类号： B24B53/00

    CPC分类号： B24B53/017 ,  B23H5/08

    摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.

    摘要翻译： 提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。 在一个实施例中，调节头包括设置在中心腔中的刷子。 清洁流体通过调节头的中心空腔设置到处理垫。 刷子旋转并横向移动到处理垫的表面上。 通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻擦拭处理垫。 调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。 清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

    Control of removal profile in electrochemically assisted CMP
    7.
    发明授权
    Control of removal profile in electrochemically assisted CMP 失效
    电化学辅助CMP中去除曲线的控制

    公开(公告)号：US06991526B2

    公开(公告)日：2006-01-31

    申请号：US10244697

    申请日：2002-09-16

    申请人： Lizhong Sun ,  Liang-Yuh Chen ,  Siew Neo ,  Feng Q. Liu ,  Alain Duboust ,  Stan D. Tsai ,  Rashid Mavliev

    发明人： Lizhong Sun ,  Liang-Yuh Chen ,  Siew Neo ,  Feng Q. Liu ,  Alain Duboust ,  Stan D. Tsai ,  Rashid Mavliev

    IPC分类号： B24B1/00 ,  C25F7/00

    CPC分类号： B24B37/042 ,  B23H5/08

    摘要： Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.

    摘要翻译： 本发明的各方面通常提供使用电化学沉积技术来抛光衬底的方法和装置。 一方面，用于研磨衬底的装置包括对电极和位于衬底和对电极之间的衬垫以及位于衬底和对电极之间的衬垫。 电介质插入件位于对电极和衬底之间。 电介质插入件具有多个区域，每个区域允许在对电极和衬底之间分开的电流密度。 在另一个实施例中，用于抛光包括导电层的衬底的装置包括与材料层相对的对电极。 对电极包括多个电绝缘的导电元件。 电连接器分别耦合到每个导电元件。

    Method and composition for polishing a substrate
    9.
    发明授权
    Method and composition for polishing a substrate 失效
    抛光基材的方法和组合物

    公开(公告)号：US07160432B2

    公开(公告)日：2007-01-09

    申请号：US10608404

    申请日：2003-06-26

    申请人： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

    发明人： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

    IPC分类号： B23H5/08

    CPC分类号： B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/32134 ,  H01L21/7684

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义之上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率。 电化学机械抛光技术可以包括抛光组合物，其包含酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约 2和约10，和溶剂。