公开(公告)号：US20240173927A1

公开(公告)日：2024-05-30

申请号：US18433630

申请日：2024-02-06

Applicant: Resonac Corporation

Inventor： Noriaki MURAKAMI ,  Ryoichi UCHIMURA ,  Masahisa OSE ,  Kenichi OHHASHI

IPC: B29C70/16 ,  B29C70/00 ,  B29C70/30 ,  B29K101/10 ,  B29K309/08 ,  B29L9/00 ,  B32B5/02 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B17/04 ,  H05K1/03

CPC classification number: B29C70/16 ,  B29C70/003 ,  B29C70/30 ,  B32B5/024 ,  B32B5/263 ,  B32B15/14 ,  B32B15/20 ,  B32B17/04 ,  H05K1/036 ,  B29K2101/10 ,  B29K2309/08 ,  B29L2009/00 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/54 ,  B32B2307/732 ,  B32B2457/08 ,  H05K2201/029

Abstract: The present invention relates to a laminate including two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition, the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y), the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers, the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and the second glass fibers having a higher tensile elastic modulus at 25° C. than the first glass fibers, a printed wiring board including the laminate, a semiconductor package, and a method for producing a laminate.