公开(公告)号：US20070127189A1

公开(公告)日：2007-06-07

申请号：US11293673

申请日：2005-12-02

申请人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

发明人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

IPC分类号： H01G4/06

CPC分类号： H01G9/012 ,  H01G2/065 ,  H01G9/042 ,  H01G9/0425 ,  H01G9/08 ,  Y10T29/41 ,  Y10T29/417

摘要： A surface mount chip capacitor includes a metal substrate, a conductive powder element comprising a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

摘要翻译： 表面安装片式电容器包括金属基板，包括阀金属的导电粉末元件，并且部分地围绕金属基板，金属基板从导电粉末朝向表面安装片式电容器的阳极端向外延伸，银体阴极 至少部分地围绕导电粉末元件，通过围绕银体阴极的气相沉积形成的涂层，围绕从导电粉末向外延伸的部分基板形成的绝缘材料，在阳极处形成在金属基板周围的导电涂层 表面安装片式电容器的端部，与表面贴装电容器的阳极端处的导电涂层电连接的端接端子阳极，以及电连接到表面安装芯片的阴极端处的银体阴极的端部端子阴极 电容器。

公开(公告)号：US07283350B2

公开(公告)日：2007-10-16

申请号：US11293673

申请日：2005-12-02

申请人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

发明人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G2/065 ,  H01G9/042 ,  H01G9/0425 ,  H01G9/08 ,  Y10T29/41 ,  Y10T29/417

摘要： A surface mount chip capacitor includes a metal substrate, a conductive powder element including a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

摘要翻译： 表面安装片式电容器包括金属基板，包括阀金属的导电粉末元件，并部分地围绕金属基板，金属基板从导电粉末朝向表面安装片式电容器的阳极端向外延伸，银体阴极 至少部分地围绕导电粉末元件，通过围绕银体阴极的气相沉积形成的涂层，围绕从导电粉末向外延伸的部分基板形成的绝缘材料，在阳极处形成在金属基板周围的导电涂层 表面安装片式电容器的端部，与表面贴装电容器的阳极端处的导电涂层电连接的端接端子阳极，以及电连接到表面安装芯片的阴极端处的银体阴极的端部端子阴极 电容器。

公开(公告)号：US07426102B2

公开(公告)日：2008-09-16

申请号：US11415039

申请日：2006-05-01

申请人： Haim Goldberger ,  Reuven Katraro ,  Doron Gozaly

发明人： Haim Goldberger ,  Reuven Katraro ,  Doron Gozaly

IPC分类号： H01G4/228

CPC分类号： H01G4/228 ,  H01G4/33 ,  H01L2224/11

摘要： An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted. The standoff provides resistance to tilting.

摘要翻译： 诸如电容器的电子部件包括具有第一和第二主表面的基板，覆盖基板的第一主表面的电介质层，第一电极和第二电极。 存在覆盖第一和第二电极的钝化层，第一开口形成在第一电极上的钝化层中，第二开口形成在第二电极上的钝化层中。 第一底部电极终端位于第一开口中，而第二底部电极终端位于第二开口中。 第一底部电极端子电连接到第一电极，第二底部电极端子电连接到第二电极。 间隔件位于第一底部电极端子和第二底部电极端子之间并且附接到钝化层，从而在安装时为电子部件提供支撑。 对立提供了对倾斜的抵抗力。

公开(公告)号：US20070253143A1

公开(公告)日：2007-11-01

申请号：US11415039

申请日：2006-05-01

申请人： Haim Goldberger ,  Reuven Katraro ,  Doron Gozaly

发明人： Haim Goldberger ,  Reuven Katraro ,  Doron Gozaly

IPC分类号： H01G4/228

CPC分类号： H01G4/228 ,  H01G4/33 ,  H01L2224/11

摘要： An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted. The standoff provides resistance to tilting.

摘要翻译： 诸如电容器的电子部件包括具有第一和第二主表面的基板，覆盖基板的第一主表面的电介质层，第一电极和第二电极。 存在覆盖第一和第二电极的钝化层，第一开口形成在第一电极上的钝化层中，第二开口形成在第二电极上的钝化层中。 第一底部电极终端位于第一开口中，而第二底部电极终端位于第二开口中。 第一底部电极端子电连接到第一电极，第二底部电极端子电连接到第二电极。 间隔件位于第一底部电极端子和第二底部电极端子之间并且附接到钝化层，从而在安装时为电子部件提供支撑。 对立提供了对倾斜的抵抗力。

公开(公告)号：US08324711B2

公开(公告)日：2012-12-04

申请号：US13075752

申请日：2011-03-30

申请人： Haim Goldberger ,  Sik Lui ,  Jacek Korec ,  Y. Mohammed Kasem ,  Harianto Wong ,  Jack Van Den Heuvel

发明人： Haim Goldberger ,  Sik Lui ,  Jacek Korec ,  Y. Mohammed Kasem ,  Harianto Wong ,  Jack Van Den Heuvel

IPC分类号： H01L21/02

CPC分类号： H01G4/33 ,  H01G4/38 ,  H01L23/481 ,  H01L28/40 ,  H01L29/66181 ,  H01L29/945 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2924/13091 ,  Y10S438/957 ,  H01L2924/014 ,  H01L2924/00

摘要： A precision high-frequency capacitor includes a dielectric layer formed on the front side surface of a semiconductor substrate and a first electrode on top of the dielectric layer. The semiconductor substrate is heavily doped and therefore has a low resistivity. A second electrode, insulated from the first electrode, is also formed over the front side surface. In one embodiment, the second electrode is connected by a metal-filled via to a layer of conductive material on the back side of the substrate. In alternative embodiments, the via is omitted and the second electrode is either in electrical contact with the substrate or is formed on top of the dielectric layer, yielding a pair of series-connected capacitors. ESD protection for the capacitor can be provided by a pair of oppositely-directed diodes formed in the substrate and connected in parallel with the capacitor. To increase the capacitance of the capacitor while maintaining a low effective series resistance, each of the electrodes may include a plurality of fingers, which are interdigitated with the fingers of the other electrode. The capacitor is preferably fabricated in a wafer-scale process concurrently with numerous other capacitors on the wafer, and the capacitors are then separated from each other by a conventional dicing technique.

摘要翻译： 精密高频电容器包括形成在半导体衬底的前侧表面上的电介质层和位于电介质层顶部的第一电极。 半导体衬底是重掺杂的，因此具有低电阻率。 与第一电极绝缘的第二电极也形成在前侧表面上。 在一个实施例中，第二电极通过金属填充的通孔连接到衬底背面上的导电材料层。 在替代实施例中，省略通孔，并且第二电极与衬底电接触或者形成在电介质层的顶部，从而产生一对串联电容器。 电容器的ESD保护可以由形成在衬底中并与电容器并联连接的一对相反方向的二极管提供。 为了在保持低有效串联电阻的同时增加电容器的电容，每个电极可以包括与另一个电极的指状物交叉的多个指状物。 电容器优选与晶片上的许多其它电容器同时地以晶片级工艺制造，然后通过常规的切割技术将电容器彼此分离。

公开(公告)号：US07961148B2

公开(公告)日：2011-06-14

申请号：US11693056

申请日：2007-03-29

申请人： Haim Goldberger

发明人： Haim Goldberger

IPC分类号： H01Q1/38

CPC分类号： H01Q23/00 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01Q9/0407 ,  H01L2924/00

摘要： A circuit with an integral antenna, including a hybrid circuit on a substrate, a patch antenna that is adapted to be positioned at a pre-selected distance above the hybrid circuit and coupled to the hybrid circuit to form a single physical unit, a feeder that electronically connects between the hybrid circuit and the patch antenna.

摘要翻译： 一种具有集成天线的电路，包括衬底上的混合电路，贴片天线，其适于定位在混合电路之上的预选距离处并耦合到混合电路以形成单个物理单元;馈线， 电连接在混合电路和贴片天线之间。

公开(公告)号：US07221555B2

公开(公告)日：2007-05-22

申请号：US11264977

申请日：2005-11-02

申请人： Haim Goldberger

发明人： Haim Goldberger

IPC分类号： H01G9/02

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/15 ,  Y10T29/41 ,  Y10T29/417

摘要： The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.

摘要翻译： 本发明的表面安装MELF电容器包括电线和与导线电连接的导电粉末元件。 表面安装的MELF电容器具有围绕导电粉末元件的至少一部分和从导电粉末元件延伸的电线的绝缘材料。 第一端子在导线的第一端面处形成在表面安装片上电容器上，并且第二端子通过电连接到导电粉末元件而形成。 本发明的表面安装MELF电容器是通过以下方法产生的：包括提供导线并将导电粉末放置在导线上的步骤。 本发明的一个实施例将电线馈送到卷轴到卷轴系统中，并将导电粉末元件电泳沉积在导线上。

公开(公告)号：US08878727B2

公开(公告)日：2014-11-04

申请号：US12702363

申请日：2010-02-09

申请人： Haim Goldberger

发明人： Haim Goldberger

IPC分类号： H01Q1/38 ,  H01Q23/00 ,  H01Q9/04

CPC分类号： H01Q23/00 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01Q1/2283 ,  H01Q9/0407 ,  H01L2224/0401

摘要： A hybrid circuit with an integral antenna module, including an electronic circuit that includes circuit elements; and an antenna module including a dielectric material shaped to form a void enclosed by the dielectric material, a conducting patch on one side of the dielectric material. Wherein the circuit elements are enclosed by the dielectric material, so that the elements of the circuit are positioned inside the void formed by the dielectric material.

摘要翻译： 一种具有集成天线模块的混合电路，包括包括电路元件的电子电路; 以及天线模块，其包括形成为由电介质材料包围的空隙的电介质材料，介电材料的一侧上的导电贴片。 其中电路元件由电介质材料包围，使得电路的元件位于由电介质材料形成的空隙的内部。

公开(公告)号：US07088573B2

公开(公告)日：2006-08-08

申请号：US10792138

申请日：2004-03-02

申请人： Haim Goldberger

发明人： Haim Goldberger

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/15 ,  Y10T29/41 ,  Y10T29/417

摘要： The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.

摘要翻译： 本发明的表面安装MELF电容器包括电线和与导线电连接的导电粉末元件。 表面安装的MELF电容器具有围绕导电粉末元件的至少一部分和从导电粉末元件延伸的电线的绝缘材料。 第一端子在导线的第一端面处形成在表面安装片上电容器上，并且第二端子通过电连接到导电粉末元件而形成。 本发明的表面安装MELF电容器是通过以下方法产生的：包括提供导线并将导电粉末放置在导线上的步骤。 本发明的一个实施例将电线馈送到卷轴到卷轴系统中，并将导电粉末元件电泳沉积在导线上。

公开(公告)号：US20060104007A1

公开(公告)日：2006-05-18

申请号：US11259503

申请日：2005-10-26

申请人： Haim Goldberger

发明人： Haim Goldberger

IPC分类号： H01G4/228

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/15 ,  Y10T29/41 ,  Y10T29/417

摘要： The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.