摘要:
A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.
摘要:
A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.
摘要:
A tri-phase combiner/splitter system that has similar advantages to presently available binary combiner/splitter systems which uses quadrature couplers. Notably, the combiner input Voltage Standing Wave Ratio ("VSWR") remains at 1:1 for identical mismatch impedance at the output ports. There is also a complete cancellation of back-door intermodulation components for identical output device nonlinearities. An innovative wideband, 0.degree. three way combiner/splitter is the basic building block of the present invention. To achieve equal port impedances, a new wideband transmission line transformer is used. By using 60.degree. or 120.degree. phase equalization networks at the three, 0.degree. output ports, this device is converted to a wideband tri-phase combiner.For moderate bandwidths, a coupled transmission line version is possible using meandering strip lines in the same fashion used in quadrature coupler design. A new transmission line phase compensation technique is also accomplished using meandering strip lines.
摘要:
An antenna for operating over a broadband of frequencies includes an operating radiating elements for radiating radio frequency energy at a selected band of frequencies and a lower radiating element for providing a counter poise to the upper radiating element. An antenna coupler transforms the load impedance of the upper radiating elements and the lower radiating element to a nominal impedance, such as 50 ohms. The coupler element also electronically couples the lower radiating element to the upper radiating element.
摘要:
RF signals may be split or combined across a wide band of frequencies with low insertion losses, large isolation between input ports, and low voltage standing wave ratio by means of coaxial transmission line sections interconnected in a bridge configuration. Even mode impedances between the cable shield and the common ground plane may be eliminated by placing ferrite sleeves on each line section. Impedance transformations introduced by the splitter/combiner are counteracted by a coaxial line impedance transformer.
摘要:
A four way 2:1 bandwidth RF splitter/combiner is described. When used as a splitter, the splitter/combiner provides equal amplitude output signals while maintaining quadrature phase over the entire bandwidth of the input signal. This splitter/combiner also maintains a one to one VSWR and eliminates back door intermodulation. When used as a combiner, the splitter/combiner losslessly combines four equal amplitude quadrature phase signals.
摘要:
A transmission line transformer (20, 30, 31) with inherent DC isolation has two sets (22, 22') of transmission line elements (ZN) with characteristic impedances which vary from relatively high values near the transformer inputs (P1, P2) to relatively low values near an intermediate location (28, 28') are ordered in a mirror image symmetry with respect to one another relative to the intermediate location (28, 28') in plural element embodiments (20, 30). The primaries (24, 24') are connected in series, while the secondaries (26, 26') of adjacent pairs of transmission line elements (ZN, ZN') are connected in series with the series connected pair connected in parallel across the output terminals (P3, P4). A center line transmission element (CZN) at the intermediate location (28') has a substantial zero impedance, and an electrical length equal to twice that of the other elements. In an embodiment (31) for the special case of N=1, the other transmission line elements of the two sets (22, 22') are eliminated and only a single center transmission line element (CZN) with approximately zero characteristic impedance is employed to obtain a broad band flat frequency response.
摘要:
Wafers from plural non-vacuum multiple wafer carriers are loaded and unloaded in an atmospheric front end of a wafer processing machine and transferred to and from the high vacuum chamber of a transfer module of a wafer manufacturing cluster tool through a plurality of single wafer loadlocks. Preferably, with the wafers oriented horizontally throughout, wafers are moved inbound to the high vacuum atmosphere through one loadlock and moved outbound through another loadlock, the outbound loadlock also actively cooling the wafer. In both the atmospheric and vacuum environments, transfer arms load and unload the loadlocks as often as possible when the other loadlock or loadlocks are sealed, and transfer wafers within the environments when all loadlocks are sealed. Preferably, the wafers are actively cooled in the outbound loadlock. Preferably also, wafers are passed through a wafer aligner after being removed from a carrier and before placed in a loadlock. When wafers from one of the carriers are being moved to and from loadlocks, another of the carriers of processed wafers is being exchanged with a carrier of unprocessed wafers.
摘要:
A sputter coating apparatus displays set and alternative machine parameters, entered or calculated from entered or measured data, for selection by the operator. The apparatus performs a sputter coating process to produce sputter coated articles in accordance with the selected machine parameters. Process parameters familiar to the person creating the process, such as desired coating thickness and desired deposition rate, may be entered by the operator. Measured data such as actual coating thickness at a plurality of points on a previously processed wafer may be entered by an operator or automatically measured from a wafer. Alternative machine parameters such as target sputtering power may be entered by an operator or calculated from entered process parameters or measured data. The operator selects and initiates a process in accordance with the selections by entering commands. The machine parameters control separately the sputtering from different regions of the sputtering surface of a one piece sputtering target by alternately energizing different plasmas over the different target regions and energizing the target in accordance with different machine parameters.
摘要:
A 20 to 500 MHz directional coupler for use in a high power RF system uses a pair of transmission line sections electrically interconnected in series by their shield terminals. The primary signal is passed through one of the line sections, and the second section is connected to ground through a resistor. The forward voltage is thus the voltage between the shield of the first line section and ground across the second line section.