Wafer processing cluster tool batch preheating and degassing apparatus
    1.
    发明授权
    Wafer processing cluster tool batch preheating and degassing apparatus 失效
    晶圆处理集群工具批量预热和脱气装置

    公开(公告)号:US5259881A

    公开(公告)日:1993-11-09

    申请号:US701800

    申请日:1991-05-17

    摘要: A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.

    摘要翻译: 具有一个或多个负载锁定的晶片处理集群工具设置有一个或多个批量预热模块,其仅在机器的内部真空压力下从集群工具传送模块接收晶片。 当其他晶片被预热时,可能会发生机器中晶片的装载,卸载,处理和处理。 预热模块具有可垂直移动的支架,并且装载有各种尺寸的批量的晶片,它们之间没有空置位置。 晶圆形屏蔽件可能占据与顶部和底部晶片相邻的位置,以使它们与机架中的其它晶片相同。 位于石英窗外部的红外灯在预热模块中加热晶片。 机架可旋转以提高加热均匀性。 温度传感器,例如高温计,不接触被预热的晶片,测量温度以控制灯的加热。

    Wafer processing cluster tool batch preheating and degassing method
    2.
    发明授权
    Wafer processing cluster tool batch preheating and degassing method 失效
    晶圆处理集群工具批量预热和脱气方法

    公开(公告)号:US5380682A

    公开(公告)日:1995-01-10

    申请号:US147666

    申请日:1993-11-03

    摘要: A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.

    摘要翻译: 具有一个或多个负载锁定的晶片处理集群工具设置有一个或多个批量预热模块,其仅在机器的内部真空压力下从集群工具传送模块接收晶片。 当其他晶片被预热时,可能会发生机器中晶片的装载,卸载,处理和处理。 预热模块具有可垂直移动的支架,并且装载有各种尺寸的批量的晶片,它们之间没有空置位置。 晶圆形屏蔽件可能占据与顶部和底部晶片相邻的位置,以使它们与机架中的其它晶片相同。 位于石英窗外部的红外灯在预热模块中加热晶片。 机架可旋转以提高加热均匀性。 温度传感器,例如高温计,不接触被预热的晶片,测量温度以控制灯的加热。

    Tri-phase combiner/splitter system
    3.
    发明授权
    Tri-phase combiner/splitter system 失效
    三相组合器/分路器系统

    公开(公告)号:US5285175A

    公开(公告)日:1994-02-08

    申请号:US939783

    申请日:1992-09-03

    IPC分类号: H01P5/12 H01P6/12 H01P5/18

    CPC分类号: H03F3/602 H01P5/12

    摘要: A tri-phase combiner/splitter system that has similar advantages to presently available binary combiner/splitter systems which uses quadrature couplers. Notably, the combiner input Voltage Standing Wave Ratio ("VSWR") remains at 1:1 for identical mismatch impedance at the output ports. There is also a complete cancellation of back-door intermodulation components for identical output device nonlinearities. An innovative wideband, 0.degree. three way combiner/splitter is the basic building block of the present invention. To achieve equal port impedances, a new wideband transmission line transformer is used. By using 60.degree. or 120.degree. phase equalization networks at the three, 0.degree. output ports, this device is converted to a wideband tri-phase combiner.For moderate bandwidths, a coupled transmission line version is possible using meandering strip lines in the same fashion used in quadrature coupler design. A new transmission line phase compensation technique is also accomplished using meandering strip lines.

    摘要翻译: 三相组合器/分路器系统具有与使用正交耦合器的当前可用的二进制组合器/分配器系统相似的优点。 值得注意的是,输出端口的相同失配阻抗,组合器输入电压驻波比(“VSWR”)保持在1:1。 对于相同的输出设备非线性,还可以完全取消后门互调部件。 创新的宽带0度三路组合器/分路器是本发明的基本构建块。 为了实现等端口阻抗,使用了一种新的宽带传输线变压器。 通过在三个0度输出端口使用60度或120度相位均衡网络,该器件将转换为宽带三相组合器。 对于适度的带宽,可以以与正交耦合器设计中相同的方式使用蜿蜒带状线来实现耦合传输线版本。 新的传输线相位补偿技术也是使用蜿蜒条线实现的。

    Broadband vertical dipole antenna
    4.
    发明授权
    Broadband vertical dipole antenna 失效
    宽带垂直偶极天线

    公开(公告)号:US4496953A

    公开(公告)日:1985-01-29

    申请号:US401474

    申请日:1982-07-26

    IPC分类号: H01Q9/16

    CPC分类号: H01Q9/16

    摘要: An antenna for operating over a broadband of frequencies includes an operating radiating elements for radiating radio frequency energy at a selected band of frequencies and a lower radiating element for providing a counter poise to the upper radiating element. An antenna coupler transforms the load impedance of the upper radiating elements and the lower radiating element to a nominal impedance, such as 50 ohms. The coupler element also electronically couples the lower radiating element to the upper radiating element.

    摘要翻译: 用于在频率宽带上操作的天线包括用于以选定的频带辐射射频能量的操作辐射元件和用于向上辐射元件提供计数器的下辐射元件。 天线耦合器将上辐射元件和下辐射元件的负载阻抗变换成标称阻抗,例如50欧姆。 耦合器元件还将下辐射元件电耦合到上辐射元件。

    Wideband transmission line signal combiner/divider
    5.
    发明授权
    Wideband transmission line signal combiner/divider 失效
    宽带传输线信号组合器/分频器

    公开(公告)号:US4774481A

    公开(公告)日:1988-09-27

    申请号:US913201

    申请日:1986-09-30

    CPC分类号: H03H7/48 H01P5/16 H03F3/602

    摘要: RF signals may be split or combined across a wide band of frequencies with low insertion losses, large isolation between input ports, and low voltage standing wave ratio by means of coaxial transmission line sections interconnected in a bridge configuration. Even mode impedances between the cable shield and the common ground plane may be eliminated by placing ferrite sleeves on each line section. Impedance transformations introduced by the splitter/combiner are counteracted by a coaxial line impedance transformer.

    摘要翻译: RF信号可以通过在桥接配置中互连的同轴传输线路段,在具有低插入损耗,输入端口之间的大隔离和低电压驻波比的宽带频率下被分离或组合。 可以通过在每个线路部分放置铁氧体套筒来消除电缆屏蔽层和公共接地层之间的均匀模式阻抗。 由分路器/组合器引入的阻抗变换由同轴线路阻抗变压器抵消。

    2:1 bandwidth, 4-way, combiner/splitter
    6.
    发明授权
    2:1 bandwidth, 4-way, combiner/splitter 失效
    2:1带宽,4路,组合/分路器

    公开(公告)号:US5313174A

    公开(公告)日:1994-05-17

    申请号:US947860

    申请日:1992-09-18

    IPC分类号: H01P5/12

    CPC分类号: H01P5/12

    摘要: A four way 2:1 bandwidth RF splitter/combiner is described. When used as a splitter, the splitter/combiner provides equal amplitude output signals while maintaining quadrature phase over the entire bandwidth of the input signal. This splitter/combiner also maintains a one to one VSWR and eliminates back door intermodulation. When used as a combiner, the splitter/combiner losslessly combines four equal amplitude quadrature phase signals.

    摘要翻译: 描述了四路2:1带宽RF分路器/组合器。 当用作分路器时,分路器/组合器提供相等幅度的输出信号,同时在输入信号的整个带宽上保持正交相位。 该分离器/组合器还保持一对一的VSWR并消除后门互调。 当用作组合器时,分路器/组合器无损地组合四个相等振幅正交相位信号。

    Transmission line transformer with DC isolation
    7.
    发明授权
    Transmission line transformer with DC isolation 失效
    具有直流隔离的输电线路变压器

    公开(公告)号:US5130678A

    公开(公告)日:1992-07-14

    申请号:US787691

    申请日:1991-10-31

    IPC分类号: H03H7/38 H04B3/00

    CPC分类号: H04B3/00 H03H7/38

    摘要: A transmission line transformer (20, 30, 31) with inherent DC isolation has two sets (22, 22') of transmission line elements (ZN) with characteristic impedances which vary from relatively high values near the transformer inputs (P1, P2) to relatively low values near an intermediate location (28, 28') are ordered in a mirror image symmetry with respect to one another relative to the intermediate location (28, 28') in plural element embodiments (20, 30). The primaries (24, 24') are connected in series, while the secondaries (26, 26') of adjacent pairs of transmission line elements (ZN, ZN') are connected in series with the series connected pair connected in parallel across the output terminals (P3, P4). A center line transmission element (CZN) at the intermediate location (28') has a substantial zero impedance, and an electrical length equal to twice that of the other elements. In an embodiment (31) for the special case of N=1, the other transmission line elements of the two sets (22, 22') are eliminated and only a single center transmission line element (CZN) with approximately zero characteristic impedance is employed to obtain a broad band flat frequency response.

    摘要翻译: 具有固有DC隔离的传输线变压器(20,30,31)具有传输线元件(ZN)的两组(22,22'),其特征阻抗与变压器输入(P1,P2)附近的相对高的值变化到 相对于多个元件实施例(20,30)中的相对于中间位置(28,28'),中间位置(28,28')附近的相对较低的值以镜像对称的方式排列。 原色(24,24')串联连接,而相邻传输线元件对(ZN,ZN')的二次(26,26')与串联连接的对串联连接,并联连接在输出端 端子(P3,P4)。 在中间位置(28')处的中心线传输元件(CZN)具有基本的零阻抗,并且电长度等于其它元件的两倍。 在用于N = 1的特殊情况的实施例(31)中,消除了两组(22,22')中的其它传输线元件,并且仅使用具有近似零特性阻抗的单个中心传输线元件(CZN) 以获得宽带平坦的频率响应。

    Multiple single-wafer loadlock wafer processing apparatus and loading
and unloading method therefor
    8.
    发明授权
    Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor 失效
    多个单晶片负载晶片加工装置及其装卸方法

    公开(公告)号:US5944857A

    公开(公告)日:1999-08-31

    申请号:US853172

    申请日:1997-05-08

    摘要: Wafers from plural non-vacuum multiple wafer carriers are loaded and unloaded in an atmospheric front end of a wafer processing machine and transferred to and from the high vacuum chamber of a transfer module of a wafer manufacturing cluster tool through a plurality of single wafer loadlocks. Preferably, with the wafers oriented horizontally throughout, wafers are moved inbound to the high vacuum atmosphere through one loadlock and moved outbound through another loadlock, the outbound loadlock also actively cooling the wafer. In both the atmospheric and vacuum environments, transfer arms load and unload the loadlocks as often as possible when the other loadlock or loadlocks are sealed, and transfer wafers within the environments when all loadlocks are sealed. Preferably, the wafers are actively cooled in the outbound loadlock. Preferably also, wafers are passed through a wafer aligner after being removed from a carrier and before placed in a loadlock. When wafers from one of the carriers are being moved to and from loadlocks, another of the carriers of processed wafers is being exchanged with a carrier of unprocessed wafers.

    摘要翻译: 来自多个非真空多晶片载体的晶片在晶片处理机的大气前端装载和卸载,并通过多个单个晶片装载块传送到晶片制造集群工具的转移模块的高真空室。 优选地,当晶片横向定向时,晶片通过一个负载锁移入到高真空气氛中,并通过另一个负载锁移出外部,出站负载锁定也主动冷却晶片。 在大气和真空环境中,当其他负载锁或负载锁密封时,传送臂可以尽可能多地负载和卸载负载锁,并在所有负载锁定时在环境中传输晶片。 优选地,晶片在出站负载锁中被主动冷却。 优选地,在从载体移除之后并且在放置在加载锁之前,晶片通过晶片对准器。 当来自其中一个载体的晶片被移动到负载锁定和来自负载锁定时,处理过的晶片的另一个载体被与未处理的晶片的载体交换。

    Sputter coating process control method and apparatus
    9.
    发明授权
    Sputter coating process control method and apparatus 失效
    溅射涂布工艺控制方法和装置

    公开(公告)号:US5126028A

    公开(公告)日:1992-06-30

    申请号:US570943

    申请日:1990-08-22

    摘要: A sputter coating apparatus displays set and alternative machine parameters, entered or calculated from entered or measured data, for selection by the operator. The apparatus performs a sputter coating process to produce sputter coated articles in accordance with the selected machine parameters. Process parameters familiar to the person creating the process, such as desired coating thickness and desired deposition rate, may be entered by the operator. Measured data such as actual coating thickness at a plurality of points on a previously processed wafer may be entered by an operator or automatically measured from a wafer. Alternative machine parameters such as target sputtering power may be entered by an operator or calculated from entered process parameters or measured data. The operator selects and initiates a process in accordance with the selections by entering commands. The machine parameters control separately the sputtering from different regions of the sputtering surface of a one piece sputtering target by alternately energizing different plasmas over the different target regions and energizing the target in accordance with different machine parameters.

    摘要翻译: 溅射涂层设备显示由输入或测量数据输入或计算的设置和替代机器参数,以供操作员选择。 该设备执行溅射涂覆工艺以根据所选择的机器参数产生溅射涂覆的物品。 可以由操作者输入创建该过程的人熟悉的工艺参数,例如所需的涂层厚度和所需的沉积速率。 在先前处理的晶片上的多个点处的实际涂层厚度的测量数据可以由操作者输入或者从晶片自动测量。 可以由操作者输入替代的机器参数,例如目标溅射功率,或从输入的过程参数或测量数据计算。 操作人员通过输入命令,根据选择选择并启动进程。 机器参数通过在不同的目标区域上交替地激励不同的等离子体,并根据不同的机器参数对目标进行激励,分别地控制一片溅射靶的溅射表面的不同区域的溅射。

    R-segment transmission line directional coupler
    10.
    发明授权
    R-segment transmission line directional coupler 失效
    R段传输线定向耦合器

    公开(公告)号:US4859971A

    公开(公告)日:1989-08-22

    申请号:US39570

    申请日:1987-04-15

    IPC分类号: H01P5/18

    CPC分类号: H01P5/183

    摘要: A 20 to 500 MHz directional coupler for use in a high power RF system uses a pair of transmission line sections electrically interconnected in series by their shield terminals. The primary signal is passed through one of the line sections, and the second section is connected to ground through a resistor. The forward voltage is thus the voltage between the shield of the first line section and ground across the second line section.

    摘要翻译: 用于高功率RF系统的20至500MHz定向耦合器使用通过其屏蔽端子串联电互连的一对传输线段。 主信号通过一个线路部分,第二部分通过一个电阻器接地。 因此,正向电压是第一线路段的屏蔽和穿过第二线路段的地之间的电压。